Patents by Inventor Jung Wuk Kim

Jung Wuk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanoimprint method
    Patent number: 8795775
    Abstract: A method for applying a patterned coating of resist onto a surface of a substrate, includes embossing flowable resist at least once, wherein the flowable resist is respectively embossed between a patterned surface of a stamp and a carrier, whereby the stamp surface is provided with a patterned resist surface. The stamp carrying a first patterned part of the resist coating and the carrier carrying a second part of the resist coating are separated from each other. The patterned resist coating is transferred, wherein the first patterned part of the resist coating on the surface of the stamp is pressed against the surface of the substrate and the patterned resist coating is transferred onto the surface of the substrate. The first patterned part of the resist coating is cured and a demolding step is performed by separating the stamp from the first patterned part of the resist coating.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 5, 2014
    Assignee: AMO GmbH
    Inventors: Namil Koo, Jung Wuk Kim, Christian Moormann
  • NANOIMPRINT METHOD
    Publication number: 20110171432
    Abstract: A method for applying a patterned coating of resist onto a surface of a substrate, includes embossing flowable resist at least once, wherein the flowable resist is respectively embossed between a patterned surface of a stamp and a carrier, whereby the stamp surface is provided with a patterned resist surface. The stamp carrying a first patterned part of the resist coating and the carrier carrying a second part of the resist coating are separated from each other. The patterned resist coating is transferred, wherein the first patterned part of the resist coating on the surface of the stamp is pressed against the surface of the substrate and the patterned resist coating is transferred onto the surface of the substrate. The first patterned part of the resist coating is cured and a demolding step is performed by separating the stamp from the first patterned part of the resist coating.
    Type: Application
    Filed: February 25, 2011
    Publication date: July 14, 2011
    Inventors: Namil Koo, Jung Wuk Kim, Christian Moormann