Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, internal electrodes, and a reinforcing pattern and an external electrode on the body. The internal electrodes are disposed alternately with the dielectric layer therebetween in the first direction. The reinforcing pattern is disposed on surfaces of a capacitance formation portion in the first direction. The reinforcing pattern contacts a surface of the body in a second direction. The reinforcing pattern includes four parts in a third direction from one end to the other end in the third direction. A length of the reinforcing pattern at a ¼ point in the second direction is greater than a length thereof at a ½ point in the second direction and a length thereof at a ¾ point in the second direction is greater than the length thereof at the ½ point in the second direction.

Abstract: In a multilayer electronic component according to an embodiment of the present disclosure, a step of the multilayer electronic component may be alleviated by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on at least one of one surface and the other surface of the capacitance formation portion in the first direction, and the occurrence of bending cracks may be suppressed.

Abstract: A multilayer electronic component includes a body including a dielectric layer, and internal electrode layers disposed alternately in a first direction with the dielectric layer, and; first and second external electrodes disposed on the third and fourth surfaces, respectively, wherein internal electrode layer includes a main portion and an internal electrode extending from the main portion and connected to the external electrode through the lead portion, and a dummy electrode spaced apart from the internal electrode and connected to the external electrode, and a width of the lead portion may be smaller than a width of the main portion, at least a portion of the dummy electrode overlap the internal electrode in a length direction, and the dummy electrode may not overlap the internal electrode of another layer in a laminate direction.

Abstract: A multilayer electronic component according to an example embodiment may include: a body including a plurality of dielectric layers, a first internal electrode, a second internal electrode, and a margin pattern; and an external electrode disposed on the body. The first and second internal electrodes may be alternately disposed in a first direction with the dielectric layer interposed therebetween, and the margin pattern may be disposed in a position different from the first and second internal electrodes in the first direction and may be disposed so as not to overlap the first internal electrode or the second internal electrode in the first direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed on the dielectric layer, an external electrode including a base electrode layer connected to the internal electrode, and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si. The base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba/Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba/Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1/M2?1.5.

Abstract: A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (Ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (Ag) coating layer may be 2 ?m or more and 5 ?m or less.

Abstract: A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO3) and Yttria-stabilized zirconia (YSZ).

Abstract: The present invention relates to precursor compounds, and more particularly to nonpyrophoric precursor compounds suitable for use in thin film deposition through atomic layer deposition (ALD) or chemical vapor deposition (CVD), and to an ALD/CVD process using the same.

Abstract: A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO3) and Yttria-stabilized zirconia (YSZ).

Abstract: The present invention relates to precursor compounds, and more particularly to nonpyrophoric precursor compounds suitable for use in thin film deposition through atomic layer deposition (ALD) or chemical vapor deposition (CVD), and to an ALD/CVD process using the same.