Patents by Inventor Jung-Yan Huang

Jung-Yan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7114941
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 3, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu
  • Patent number: 7046441
    Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 16, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
  • Publication number: 20050141090
    Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.
    Type: Application
    Filed: March 31, 2004
    Publication date: June 30, 2005
    Inventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
  • Publication number: 20040119199
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Application
    Filed: March 20, 2003
    Publication date: June 24, 2004
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu