Patents by Inventor Jung-Yi Tsai

Jung-Yi Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080071415
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Application
    Filed: November 6, 2007
    Publication date: March 20, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. LTD.
    Inventors: Hui-Jye HSHIEH, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Patent number: 7315827
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: January 1, 2008
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hui-Jye Hshieh, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Publication number: 20070042532
    Abstract: A system of packing for turnkey services. An input port receives first and second wafer lots from a semiconductor manufacturer. The first wafer lot comprises a first number of dies, and the second wafer lot comprises a second number of dies. A packing device loads dies of the first wafer lot in a provided carrier having a preset capacity, and each of the loaded carriers is filled to capacity. A controller determines whether there is a remaining die of the first wafer lot that cannot fill one of the carriers, and directs the packing device to load the remaining dies of the first wafer lot and dies of the second wafer lot sequentially.
    Type: Application
    Filed: August 19, 2005
    Publication date: February 22, 2007
    Inventors: Jung-Yi Tsai, Chao-Hsin Chang, Wen-Sze Huang
  • Publication number: 20050240454
    Abstract: A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
    Type: Application
    Filed: April 12, 2004
    Publication date: October 27, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Hui-Jye Hshieh, Tu Shao Chi, Jung-Yi Tsai, Chui-Chung Chiu, Wendy Chang
  • Patent number: 6957116
    Abstract: A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: October 18, 2005
    Assignee: Taiwan Semiconductor Manufcturing Co., Ltd.
    Inventors: Jung-Yi Tsai, Chao-Yu Chang, Chui-Chung Chiu, Shu-Jung Tseng
  • Publication number: 20050075749
    Abstract: A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 7, 2005
    Inventors: Jung-Yi Tsai, Chao-Yu Chang, Chui-Chung Chiu, Shu-Jung Tseng