Patents by Inventor Jung-Ying Wu

Jung-Ying Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer lot split method and system
    Publication number: 20060184265
    Abstract: A computer-implemented wafer lot split method is disclosed. A database is provided. The database is coupled to manufacturing tools in a wafer manufacturing environment. Split parameters for a wafer lot are predetermined in the database. The wafer lot is split according to the split parameters to acquire child wafer lots.
    Type: Application
    Filed: February 6, 2006
    Publication date: August 17, 2006
    Inventors: Hui-Mei Tseng, Chi-Kung Hung, Yuan-Chi Yang, Jung-Ying Wu