Patents by Inventor Jung Yong Park

Jung Yong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150060114
    Abstract: Disclosed herein is a rigid flexible printed circuit board (PCB) including: a flexible area having a flexible copper foil laminate in which circuit layers are formed on an insulating material, and cover lays formed on the laminate; and rigid areas having insulating layers and copper layers built-up on both sides of the flexible area, and flattening materials to flatten outer surfaces of the insulating layers.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Yong PARK, Tae Ho Ko, Seok Cheol Song
  • Publication number: 20140096377
    Abstract: A method of manufacturing a rigid-flexible printed circuit board in accordance with an embodiment of the present invention includes: providing a pair of rigid boards and a flexible substrate inserted in between the pair of rigid boards and having one end thereof extended outside the pair of rigid boards; mounting a cover film on an extended area of the flexible substrate; providing a pair of pressing jigs disposed, respectively, above and below the rigid boards and the flexible substrate, having a protruded part formed on each thereof corresponding to a step difference between the rigid boards and the flexible substrate, and configured to press the pair of rigid boards and the flexible substrate and press the flexible substrate and the cover film mounted thereon; and pressing the rigid boards, the flexible substrate and the cover film with the pressing jigs.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 10, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung-Yong Park, Jung-Woo KIM
  • Publication number: 20140082937
    Abstract: Disclosed herein is a method of manufacturing a rigid flexible printed circuit board, including: preparing a flexible substrate having an inner layer circuit pattern formed on one surface or both surfaces thereof and divided into a rigid region and a flexible region; forming a protective layer in the flexible region of the flexible substrate; forming a coverlay so as to expose the protective layer on one surface of the flexible substrate; stacking a rigid insulating layer in the rigid region and stacking a metal layer in the protective layer and the rigid insulating layer; forming an outer layer circuit layer by patterning the metal layer and removing the metal layer in the flexible region; and removing the protective layer.
    Type: Application
    Filed: September 23, 2013
    Publication date: March 27, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Yong Park, Seok Cheol Song, Myong Keun Jung, Jae Woo Joung
  • Publication number: 20130298021
    Abstract: A method and an apparatus are disclosed for moving an execution point of a multimedia file through an expansive search of a multimedia file being executed by the multimedia executing apparatus. When the multimedia executing apparatus enters into an expansive search mode during a display of a progress bar having an execution point for execution of a multimedia file on a screen according to the execution of the multimedia file, an enlarged progress bar representing an enlarged section of the progress bar including the execution point is displayed on the screen.
    Type: Application
    Filed: March 11, 2013
    Publication date: November 7, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Yong PARK, Jung-Min YOON, Sang-Uk LEE
  • Publication number: 20130292164
    Abstract: Disclosed herein is a rigid-flexible substrate including: a rigid area including a circuit layer; a flexible area formed at one end of the rigid area; and a raw material formed over the flexible area and having indentation formed on a surface thereof.
    Type: Application
    Filed: April 25, 2013
    Publication date: November 7, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Yong Park, Myeong Hui Jung, Jae Woo Joung, Dae Hyung You
  • Patent number: 8015835
    Abstract: An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: September 13, 2011
    Assignee: Korea Delphi Automotive Systems Corporation
    Inventors: Kwang Yong Lee, Young Jo Park, Dong Han Kim, Jung Yong Park, Jae Ho Jeong
  • Publication number: 20090193827
    Abstract: An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.
    Type: Application
    Filed: October 30, 2008
    Publication date: August 6, 2009
    Applicant: KOREA DELPHI AUTOMOTIVE SYSTEMS CORPORATION
    Inventors: Kwang Yong Lee, Young Jo Park, Dong Han Kim, Jung Yong Park, Jae Ho Jeong
  • Publication number: 20050148555
    Abstract: Disclosed are methods of treating COPD and Pulmonary Hypertension using p38 Map Kinase inhibitors in combination with one or more other active ingredients.
    Type: Application
    Filed: August 19, 2004
    Publication date: July 7, 2005
    Applicants: Boehringer Ingelheim Pharmaceuticals, Inc., Boehringer Ingelheim International GmbH, Boehringer Ingelheim France
    Inventors: Abhya Gupta, Philippe Iacono, Linda Kelash-Cannavo, Jeffrey Madwed, Jung-Yong Park, Susan Way, Mehran Yazdanian