Abstract: A method for inhibiting the metastasis of triple-negative breast cancer, which includes administering to a subject in need thereof a pharmaceutical composition containing rosoxacin or a pharmaceutically acceptable salt thereof.

Abstract: Disclosed herein is a method for alleviating a chronic liver disease, comprising administrating to a subject in need thereof a pharmaceutical composition containing rosoxacin.

Abstract: Disclosed herein is a method for alleviating a chronic liver disease, comprising administrating to a subject in need thereof a pharmaceutical composition containing rosoxacin.

Abstract: A method for treating cancer in a subject is provided; the method includes administrating bupropion to the subject, wherein the tumor cells of the cancer overexpress neuronal acetylcholine receptor subunit ?9 (CHRNA9). Another method for treating cancer in a subject is provided; the method includes administrating a pharmaceutical composition to the subject, wherein the pharmaceutical composition includes: a therapeutically effective amount of bupropion and a pharmaceutically acceptable excipient; wherein the tumor cells of the cancer overexpress CHRNA9. A method for inhibiting migration of tumor cells is also provided; the method includes administrating an effective amount of bupropion to the tumor cells; wherein the tumor cells overexpress CHRNA9.

Abstract: The package of the present invention includes a chip located on a substrate with signal transferring device electrically connected between them. Solder balls connect the substrate and thus electrically connect the substrate to external circuits. Molding compound is covered to protect the chip and signal transferring means. The heat-slug is capped over the molding compound through a conductive glue. The entire area of the upper surface of the heat-slug is exposed to the ambient to improve the ability to spread heat.

Abstract: The lead frame package with dummy chip comprising a lead frame with a plurality of first leads, molding compound, a dummy chip and a die. Wherein the molding compound encapsulates the die and the dummy chip, the dummy chip is arranged on a lower portion of the molding compound. The die is stacked on an upper surface of the dummy chip by using an adhesive material. A plurality of bonding wires are connected between the die and an end of the plurality of leads over the dummy chip.

Abstract: A method of forming a HSQFN (High Stand-off Quad Flat Non-leaded) package comprises providing a leadframe with bonding pads and die pads for receiving a die. Then, the die is attached on the die pad and bonding wires are connected between the bonding pads and the die for electrical connection. Molding process is used to encompass the die by compound from a first surface of the leadframe. Then, backside etching is used to etch the leadframe from a second surface of the leadframe to expose a lower surface of the compound, thereby separating the bonding pads and the die pads. A sigulation is applied to separate each individual package by cutting the leadframe and the compound.

Abstract: The package includes a chip located on a substrate with signal transferring device electrically connected between them. Solder balls connect the substrate and thus electrically connect the substrate to external circuits. Molding compound is covered to protect the chip and signal transferring means. The heat-slug is capped over the molding compound through a conductive glue. All area of the upper surface of the heat-slug is exposed to the ambient to improve the capability of spreading heat.

Abstract: A leadframe for semiconductor devices is characterized in that the edge of the paddle has the shape of inclined plane which facilitate the silver epoxy to fill up the gap near the edge of the epoxy. The inclined plane on the paddle can also prevent the excessive silver epoxy from leaking to the bottom side of the paddle, which may cause delamination due to the poor adhesion between silver epoxy and plastic resin. Therefore the leadframe of the present utility can prevent moisture from accumulating within the package and the problem of pop corn.

Abstract: The present invention disclose an Integral heat spreader for semiconductor package which is a metal plate and characterized in that a plurality of upper bumps are provided on the top surface of the metal plate. By the provision of the upper bumps, one or more space(s) can be formed between the bottom surface of the paddle and the top surface of the heat spreader for the compact filling of molding compound. Therefore, the occurrence of gap or delamination can be prevented, while maintaining the necessary effect of heat dissipation.

Abstract: A 100BASE-T compliant integrated circuit multiport repeater provides one or more medium independent interfaces (MII's) and a plurality of physical interfaces. This facilitates connection of the repeater to one or more external medium access controller devices also implementing the MII standard. The multiport repeater device shares status, configuration and control management function of the MII among the plurality of physical ports. Therefore, only one MII physical address is needed for each multiport repeater, rather than for each physical transceiver in the system. The medium independent interfaces on the repeater chip share a number of pins and logic so that the total number of I/O pins required for a repeater chip according to the present invention with multiple medium independent interfaces is substantially reduced over a similar device which might have a plurality of independent medium independent interfaces.