Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A method for manufacturing an integrated circuit includes patterning a plurality of photomask layers over a substrate, partially backfilling the patterned plurality of photomask layers with a first material using atomic layer deposition, completely backfilling the patterned plurality of photomask layers with a second material using atomic layer deposition, removing the plurality of photomask layers to form a masking structure comprising at least one of the first and second materials, and transferring a pattern formed by the masking structure to the substrate and removing the masking structure. The first material includes a silicon dioxide, silicon carbide, or carbon material, and the second material includes a metal oxide or metal nitride material.

Abstract: A hole puncher is provided, including: a frame, including a base and a guide portion, the base including at least one punching hole, the guide portion including at least one guide hole corresponding to the at least one punching hole, there being a distance between the punching hole and the guide hole; an operating lever, provably connected to the frame; at least one punching rod, driven by the operating lever, being relatively movable within the at least one guide hole and movable to come within or out from the at least one punching hole, each punching rod including a first straight section, a second straight section and a tapered section which is tapered from the first straight section toward the second straight section.

Abstract: A cartridge for a driving device includes a stationary part extending transversely from a nose plate, and a slidable part mounted slidably on cooperating with the stationary part to define a nail-receiving channel which has an inverted U-shaped portion and a straight branch portion. The U-shaped portion has a bight segment and opposing segments extending downwardly and respectively from two opposite ends of the bight segment toward a discharging end of the nose plate. The straight branch portion extends upwardly from one of the opposite ends of the bight segment in the vertical direction.