Abstract: The present disclosure discloses systems and methods of calculating a near-maximum likelihood detection (MLD) performance capability signal to interference plus noise ratio (SINR) according to instructions stored in non-transitory computer readable memory that when executed by a processor of a multiple-input, multiple output orthogonal frequency-division multiplexing (MIMO-OFDM) wireless communications receiver device cause the processor to perform operations including the processor acquiring Hi and noise variance ?n2 for each subcarrier of a set of subcarriers between a MIMO-OFDM wireless communications transmitter device and the wireless communications receiver device, computing an average received bit mutual information rate (RBIR) over all subcarriers, converting the average RBIR to an effective SINR; and selecting a modulation coding scheme (MCS).

Abstract: Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.

Abstract: According to various embodiments, an electronic device may comprise: a housing comprising a first housing and a second housing. The first housing may comprise: a hinge module including a hinge; a first plate connected to the hinge module; a second plate facing a direction opposite the first plate; and a first side frame surrounding a first space between the first plate and the second plate. The second housing may comprise: a third plate connected to the hinge module; a fourth plate facing a direction opposite the third plate; and a second side frame surrounding a second space between the third plate and the fourth plate. The first housing and the second housing may be configured to fold or unfold with regard to each other using the hinge module.

Abstract: A method performed by a transmitter in a wireless local area network (WLAN) is provided. The method comprises: setting a second parameter in a second frame based on a first puncturing pattern indicated by a first parameter in a first frame for a basic service set (BSS) set up by an access point (AP); and transmitting, to a receiver, the second frame, wherein the first puncturing pattern is one of a plurality of puncturing patterns pre-determined for a third parameter in a third frame.

Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.

Abstract: A pixel circuit and a display device including the same are disclosed. The pixel circuit includes: a driving transistor which includes a first electrode connected to a first node, a gate electrode connected to a second node, and a second electrode connected to a third node, and supplies a driving current to a light emitting device; a first transistor that is electrically connected between the first node and the second node; a second transistor that is electrically connected between the first node and a data voltage; a third transistor that is electrically connected between the first node and a power supply line that supplies a high potential voltage; and a storage capacitor that includes a first electrode connected to the high potential voltage and a second electrode connected to the second node.

Abstract: According to various embodiments, an electronic device may include: a first housing; a second housing; a hinge device connecting the first housing and the second housing in a foldable manner; and a flexible display disposed to be supported by the first housing and the second housing, and including a display panel and a protection layer laminated on the display panel. The protection layer of the flexible display may include a first layer laminated on the display panel; a second layer laminated on the first layer; a third layer laminated on the second layer; and a coating layer formed on an upper surface of the third layer, wherein the third layer has a thickness greater than a thickness of the second layer.

Abstract: A semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. The wafer-type sensor includes a plurality of sensors each comprising a passive element.

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

Abstract: An electronic device is provided. The electronic device includes a first housing including a first plate, a second housing including a second plate, a display disposed on the first plate of the first housing and the second plate of the second housing, a hinge member that is disposed between the first housing and the second housing and that rotatably connects the first housing and the second housing, and an antenna module disposed in the first housing. The first plate includes an antenna seating portion on which the antenna module is seated. The antenna seating portion is formed between a first sidewall part and a second sidewall part that vertically extend from one surface of the first plate and face each other. The antenna module is disposed such that at least a portion faces the first sidewall part and the second sidewall part. The first sidewall part includes a bumpy structure.

Abstract: An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.

Abstract: A SOI wafer is formed by forming a hole array on a surface of a wafer including a semiconductor material, forming a membrane-cavity structure by annealing process on the wafer, forming a buried oxide layer on an inside of the cavity and an outer oxide layer on an outside of the membrane, and forming a device layer by removing the outer oxide layer.

Abstract: An electronic device include: a first housing; a second housing; a display module including a flexible substrate, a TFT layer on the flexible substrate, a protection layer on the TFT layer, and a deformation region which deforms as a relative position between the first housing and the second housing changes; a bending portion including a first layer integral with the flexible substrate and bent, and a second layer integral with the TFT layer, bent and laminated on the first layer; a display driver IC (DDI) in the bending portion; a touch wire on the protection layer to be connected to a touch circuit; and a detection wire on the protection layer in the deformation region and having an electrical value changeable by physical damage to the protection layer. The detection wire extends from the protection layer to the second layer so as to be electrically connected to the DDI.

Abstract: An electronic device is provided. The electronic device includes a flexible display including a plurality of layers and a support member having the flexible display mounted thereon. The flexible display includes a first region having a first flexibility and a second region having a second flexibility different from the first flexibility and extending from the first region in a first direction. At least one of the plurality of layers has a first structure in the first region and has a second structure different from the first structure in the second region. The support member includes a first portion that supports the first region such that at least part of the first region remains flat and a second portion that supports the second region such that at least part of the second region is bent and then unfolded.

Abstract: The disclosure provides a novel process and synthetic intermediates for making belzutifan, a HIF-2a inhibitor, useful for the treatment of certain VHL-related indications and cancer.

Abstract: A pixel circuit and a display device including the same are disclosed. The pixel circuit includes: a driving transistor which includes a first electrode connected to a first node, a gate electrode connected to a second node, and a second electrode connected to a third node, and supplies a driving current to a light emitting device; a first transistor that is electrically connected between the first node and the second node; a second transistor that is electrically connected between the first node and a data voltage; a third transistor that is electrically connected between the first node and a power supply line that supplies a high potential voltage; and a storage capacitor that includes a first electrode connected to the high potential voltage and a second electrode connected to the second node.

Abstract: An electronic device is provided. The electronic device includes: a first housing; a display on a front surface of the first housing; a camera provided on the first housing; an upper speaker module provided on the first housing adjacent the camera; an upper sound hole that extends through an upper lateral surface of the first housing and is configured to emit sound generated by the upper speaker module to outside the electronic device; an upper conduit including a first conduit extending from the upper speaker module toward the upper sound hole in an extension direction, and a second conduit extending in a direction perpendicular to the extension direction of the first conduit; and an expansion portion extending from the upper conduit into the first housing to expand an internal volume of the upper conduit.

Abstract: A radio frequency (RF) switch is provided. The RF switch includes: a switch transistor that includes a first terminal to which a radio frequency (RF) signal is input, a second terminal to which the RF signal is output, a control terminal to which a first level voltage and a second level voltage are applied in response to a control signal, and a body terminal to which a bias voltage is applied; and a bias switch connected between the control terminal and the body terminal of the switch transistor and configured to turn on when the switch transistor is turned off to apply the second level voltage to the body terminal.

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

Abstract: Disclosed are a urethane having improved thermal insulation performance by lowering thermal conductivity of the urethane and a refrigerator comprising the same. The urethane may comprise: a plurality of closed cells containing inside gas; a plurality of open cells connected to outside air; and cell walls disposed between at least one of the plurality of closed cells and at least one of the plurality of open cells or between the plurality of closed cells to connect the at least one of the plurality of closed cells with the at least one of the plurality of open cells or to connect the plurality of closed cells. Diameters of a closed cell of the plurality of closed cells and an open cell of the plurality of open cells may be about 100 to 200 ?m.