Patents by Inventor Jung Chul Park

Jung Chul Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132386
    Abstract: The present invention relates to a water treatment device, and more specifically to a water purifier capable of removing scale in a simple manner.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: COWAY Co., Ltd.
    Inventors: Si Jun PARK, Hyun Suk MOON, Sang-Young LEE, Doo Won HAN, Jung Chul PARK, In Du CHOI
  • Publication number: 20240128476
    Abstract: The present disclosure relates to a catalyst for a fuel cell electrode including an active particle which includes a core comprising platinum, a transition metal excluding platinum, and an oxide of a non-transition metal; and a shell disposed on the core and including platinum, wherein the active particle includes platinum and the non-transition metal in a molar ratio of 100:1.80 to 100:4.00, a method of preparing the same, and a fuel cell including the same.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 18, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Jung Hoon KIM, Jong Jun PARK, Eun Young YOU, Lim KIM, Sung Chul LEE, Jong Myung LEE, Young Ick CHO
  • Patent number: 11951089
    Abstract: Provided is a method for preventing or treating a wound or scar comprising administering to a subject in need thereof a pharmaceutical composition comprising benzbromarone as an active ingredient, wherein benzbromarone inhibits the function of heat shock protein 47 (HSP47), or inhibits the accumulation of collagen by reducing collagen overproduction cells.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: April 9, 2024
    Assignee: INNOVO THERAPEUTICS INC.
    Inventors: Dong Chul Lim, Jung Gyu Park
  • Publication number: 20240092228
    Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.
    Inventors: Jung Sang YOU, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20240067056
    Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.
    Type: Application
    Filed: March 6, 2023
    Publication date: February 29, 2024
    Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Publication number: 20240072949
    Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first RF block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an RF reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and th
    Type: Application
    Filed: September 22, 2023
    Publication date: February 29, 2024
    Inventors: Joo Seung KIM, Young Ju KIM, Jung Joon KIM, Sung Chul PARK
  • Publication number: 20240053078
    Abstract: The present invention relates to a running-water-type evaporator, and an ice-making device and a water purification device comprising the same, and to a running-water-type evaporator, and an ice-making device and a water purification device comprising the same, the evaporator uniformly transferring, to ice, heat supplied through high-temperature fluid during ice separation, so as to enable the ice to be easily separated without using separate ice-separating water, and thus minimizes melting of the ice during ice separation, and circulating ice-making water in a state where the ice-making water flows only toward the outer sides of a pair of outer plate members, and thus a degradation in the cleanliness of the ice-making water can be prevented.
    Type: Application
    Filed: December 1, 2021
    Publication date: February 15, 2024
    Applicant: COWAY CO., LTD.
    Inventors: Gyeong Min LEE, Gyeong Jong KIM, Hyun Woo LEE, In Du CHOI, Jae Man KIM, Jung Chul PARK, Min Chul YONG, Sung Hwan HEO, Byung Hyo YE, Chung Rae KIM, Jae Wook CHO
  • Publication number: 20230349618
    Abstract: The present invention relates to a water purifier with an ice maker, and more particularly to a water purifier with an ice maker, wherein a guide member for guiding ice may stably guide ice separated while moving together with a tray member, and the guide member does not interfere with a purified water storage part even in a case where the tray member rotates such that the purifier can increase the capacity of the purified water storage part and thus can improve user convenience.
    Type: Application
    Filed: May 27, 2021
    Publication date: November 2, 2023
    Applicant: COWAY Co., Ltd.
    Inventors: Kwang Seok HONG, Jung Chul PARK, Do Han KIM, Seong Wook KIM
  • Patent number: 11211347
    Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: December 28, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Patent number: 10955180
    Abstract: An icemaker according to present invention may comprise: a device body having an inflow penetration portion and a discharge penetration portion formed therein; a flow portion having an inflow opening and a discharge opening provided to penetrate the inflow penetration portion and the discharge penetration directly or indirectly, respectively, and having a flow space formed therein so as to connect with the inflow opening and the discharge opening; a cooling portion configured such that a refrigerant flows to at least a part of the periphery of the flow portion, thereby cooling water, which is introduced into the flow space through the inflow opening and flows therein, and turning the same into ice or cold water; and a separating/transferring portion for separating the ice, which has been generated in the flow space, from the flow space and transferring the same to the discharge opening.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: March 23, 2021
    Inventors: Sang-Gu Sim, Myung-Jin Park, Jung-Chul Park, Hyun-Woo Lee, Sung-Jin Kim, In-Du Choi
  • Patent number: 10943841
    Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: March 9, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Publication number: 20210020592
    Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Patent number: 10847482
    Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: November 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Publication number: 20200227327
    Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Applicant: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Patent number: 10651100
    Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: May 12, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Publication number: 20190360735
    Abstract: An icemaker according to present invention may comprise: a device body having an inflow penetration portion and a discharge penetration portion formed therein; a flow portion having an inflow opening and a discharge opening provided to penetrate the inflow penetration portion and the discharge penetration directly or indirectly, respectively, and having a flow space formed therein so as to connect with the inflow opening and the discharge opening; a cooling portion configured such that a refrigerant flows to at least a part of the periphery of the flow portion, thereby cooling water, which is introduced into the flow space through the inflow opening and flows therein, and turning the same into ice or cold water; and a separating/transferring portion for separating the ice, which has been generated in the flow space, from the flow space and transferring the same to the discharge opening.
    Type: Application
    Filed: September 8, 2017
    Publication date: November 28, 2019
    Inventors: Sang-Gu SIM, Myung-Jin PARK, Jung-Chul PARK, Hyun-Woo LEE, Sung-Jin KIM, In-Du CHOI
  • Publication number: 20190355682
    Abstract: In some embodiments, a method of forming an opening in a material comprises forming RIM over target material. Radiation is impinged onto the RIM through a masking tool over a continuous area of the RIM under which a target-material opening will be formed. The masking tool during the impinging allows more radiation there-through onto a mid-portion of the continuous area of the RIM in a vertical cross-section than onto laterally-opposing portions of the continuous area of the RIM that are laterally-outward of the mid-portion of the RIM in the vertical cross-section. After the impinging, the RIM is developed to form a RIM opening that has at least one pair of laterally-opposing ledges laterally-outward of the mid-portion of the RIM in the vertical cross-section elevationally between a top and a bottom of the RIM opening.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 21, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Publication number: 20190355631
    Abstract: A substrate comprises a pair of immediately-adjacent integrated-circuit dies having scribe-line area there-between. At least one of the dies comprises insulting material above integrated circuitry. The insulating material has an opening therein that extends elevationally inward to an upper conductive node of integrated circuitry within the one die. The one die comprises a conductive line of an RDL above the insulating material. The RDL-conductive line extends elevationally inward into the opening and is directly electrically coupled to the upper conductive node. The insulating material has a minimum elevational thickness from an uppermost surface of the upper conductive node to an uppermost surface of the insulating material that is immediately-adjacent the insulating-material opening. Insulator material is above a conductive test pad in the scribe-line area. The insulator material has an opening therein that extends elevationally inward to an uppermost surface of the conductive test pad.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 21, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal
  • Patent number: 10326961
    Abstract: An electronic device includes a projector, an operating method of an electronic device including a projector, and a non-transitory computer-readable recording medium having recorded thereon instructions for performing the operating method. The electronic device includes a communicator configured to exchange data with an external device, a projector configured to project light; a sensor configured to measure a degree of proximity between the electronic device and an installation surface on which the electronic device is to be installed, and a controller configured to control the communicator and/or the projector based on the degree of proximity measured by the sensor.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: June 18, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Hyung Kim, Hee-kyung Kim, Jung-chul Park, Se-jun Song, Sung-kwang Yang, Yoon-gi Lee