Abstract: A patterning method includes: forming a first photoresist layer on a substrate; performing first divisional exposure on the first photoresist layer with first exposure energy, higher than or equal to threshold energy, using a reticle having lines and spaces of a mask pattern and an exposure apparatus; and shifting the reticle below a line width of the mask pattern and performing second divisional exposure on the first photoresist layer with second exposure energy, higher than or equal to the threshold energy, using the reticle to form a photoresist pattern. A spatial distribution of the first exposure energy may overlap a spatial distribution of the second exposure energy.

Abstract: A method for forming a line and a space pattern, according to one embodiment of the present invention, comprises exposing a mask in a first direction and a second direction on a substrate and stitching same. The method for forming a line and a space pattern comprises the steps of: performing first exposure on the substrate so that first shots of the mask come in contact with each other in the first direction; and performing second exposure on the substrate so that second shots of the mask come in contact with each other so as to be distanced in the second direction and be offset with respect to the first shots in the first direction.