Patents by Inventor Jung Eun Kang
Jung Eun Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240164147Abstract: A display device includes: a base substrate; a first pixel electrode, a second pixel electrode, and a third pixel electrode arranged on the base substrate to be spaced apart from each other; a pixel defining film on the first pixel electrode, the second pixel electrode, and the third pixel electrode and including a first opening exposing the first pixel electrode, a second opening exposing the second pixel electrode and spaced apart from the first opening, and a third opening exposing the third pixel electrode and spaced apart from the first opening and the second opening; a first organic layer on the first pixel electrode exposed by the first opening; a second organic layer on the second pixel electrode exposed by the second opening; and a third organic layer on the third pixel electrode exposed by the third opening.Type: ApplicationFiled: January 18, 2024Publication date: May 16, 2024Inventors: Sang Shin LEE, Joon Young PARK, Min Goo KANG, Jung Woo KO, Jong Sung PARK, Hong Kyun AHN, Sang Min YI, Sang Woo JO, Young Eun RYU, Yoon Seo LEE
-
Publication number: 20240151440Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.Type: ApplicationFiled: May 10, 2023Publication date: May 9, 2024Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
-
Publication number: 20240124404Abstract: The present invention relates to a composition for preventing, improving, or treating diseases related to advanced glycation end products, comprising an indole derivative or a pharmaceutically acceptable salt thereof. Specifically, the composition of the present invention possesses the effect of trapping methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
-
Publication number: 20240124399Abstract: The present invention relates to a novel indole derivative and a use thereof. The novel indole derivative according to the present invention traps methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
-
Patent number: 9107313Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.Type: GrantFiled: December 18, 2013Date of Patent: August 11, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun Lim, Jung Eun Kang, Heung Soo Park, Seog Moon Choi, Kwang Soo Kim, Joon Seok Chae, Sung Keun Park
-
Publication number: 20140096380Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.Type: ApplicationFiled: December 18, 2013Publication date: April 10, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun LIM, Jung Eun KANG, Heung Soo PARK, Seog Moon CHOI, Kwang Soo KIM, Joon Seok CHAE, Sung Keun PARK
-
Publication number: 20140084447Abstract: Disclosed herein is a power module package including: a body member having a polyhedral shape and made of a metal material; a semiconductor device mounted on the body member; and a block member formed at an edge region of the body member and made of a metal material.Type: ApplicationFiled: July 11, 2013Publication date: March 27, 2014Inventors: Jung Eun Kang, Jin Su Kim, Kwang Soo Kim
-
Publication number: 20130062744Abstract: Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate.Type: ApplicationFiled: December 9, 2011Publication date: March 14, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Soo Kim, Jung Eun Kang, Young Ki Lee
-
Patent number: 8338714Abstract: Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.Type: GrantFiled: August 6, 2010Date of Patent: December 25, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Eun Kang, Hye Sook Shin, Ki Ho Seo
-
Patent number: 8315056Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element.Type: GrantFiled: September 16, 2010Date of Patent: November 20, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Hyun Lim, Jung Eun Kang, Seog Moon Choi, Kwang Soo Kim, Sung Keun Park
-
Patent number: 8198543Abstract: Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.Type: GrantFiled: November 14, 2009Date of Patent: June 12, 2012Assignee: Samsung Electro-Mechanics Co., LtdInventors: Jung Eun Kang, Seog Moon Choi, Tae Hoon Kim, Young Ki Lee, Hye Sook Shin, Chang Hyun Lim
-
Publication number: 20120111610Abstract: Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.Type: ApplicationFiled: January 25, 2011Publication date: May 10, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Soo KIM, Sang Hyun SHIN, Jung Eun KANG, Chang Hyun LIM, Seog Moon CHOI, Sung Keun PARK
-
Publication number: 20120073863Abstract: Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.Type: ApplicationFiled: January 14, 2011Publication date: March 29, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Eun KANG, Kwang Soo KIM, Seog Moon CHOI, Sung Keun PARK, Chang Hyun LIM
-
Publication number: 20120067623Abstract: Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer.Type: ApplicationFiled: January 14, 2011Publication date: March 22, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Keun PARK, Chang Hyun LIM, Seog Moon CHOI, Kwang Soo KIM, Jung Eun KANG
-
Publication number: 20120000697Abstract: Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.Type: ApplicationFiled: November 24, 2010Publication date: January 5, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Eun Kang, Seog Moon Choi, Sung Keun Park, Chang Hyun Lim, Kwang Soo Kim
-
Publication number: 20110303437Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.Type: ApplicationFiled: October 25, 2010Publication date: December 15, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun LIM, Jung Eun KANG, Seog Moon CHOI, Kwang Soo KIM, Joon Seok CHAE, Sung Keun PARK
-
Publication number: 20110304990Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element.Type: ApplicationFiled: September 16, 2010Publication date: December 15, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun Lim, Jung Eun Kang, Seog Moon Choi, Kwang Soo Kim, Sung Keun Park
-
Publication number: 20110303440Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.Type: ApplicationFiled: October 7, 2010Publication date: December 15, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Hyun LIM, Jung Eun KANG, Heung Soo PARK, Seog Moon CHOI, Kwang Soo KIM, Joon Seok CHAE, Sung Keun PARK
-
Publication number: 20110240346Abstract: Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.Type: ApplicationFiled: August 6, 2010Publication date: October 6, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Eun Kang, Hye Sook Shin, Ki Ho Seo
-
Publication number: 20110075374Abstract: Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.Type: ApplicationFiled: November 14, 2009Publication date: March 31, 2011Inventors: Jung Eun KANG, Seog Moon CHOI, Tae Hoon KIM, Young Ki LEE, Hye Sook SHIN, Chang Hyun LIM