Abstract: Provided are an organometallic compound represented by Formula 1, a resist composition including the same, and a pattern formation method using the resist composition, M11(Rx)n(Ry)(m-n),??Formula 1 wherein reference should be made to the specification for the descriptions of M11, Rx, Ry, n and m in Formula 1.

Abstract: Provided are a resist composition including an organometallic compound represented by Formula 1 and an additive represented by Formula 2, and a pattern formation method using the same: Descriptions of M11, Rx, Ry, n, m, X2, Y2, Z2, L2, a2, b2, and c2 in Formulae 1 and 2 are provided in the specification.

Abstract: Provided are a resist composition and a method of forming a pattern using the same. The resist composition may include an organometallic compound represented by Formula 1 and a polymer including a first repeating unit represented by Formula 2 and a second repeating unit represented by Formula 3: wherein, in Formulae 1 to 3, M11, Rx, Ry, n, m, L21 to L24, a21 to a24, R21, X21, p21, L31 to L34, a31 to a34, R31, X31, and p31 are as described in the present specification.

Abstract: A pattern formation method may use a resist composition. The resist composition may include an organometallic compound represented by any one of Formulae 1-1 to 1-4, an additive represented by Formula 2, and a solvent. The solvent may include a non-polar solvent, a polar aprotic solvent, or a combination thereof. Refer to the specification for the descriptions of M11, L11 to L14, a11 to a14, R11 to R14, b11 to b14, Y11 to Y13, X11 to X13, Y21, Y22, L21, and a21 in Formulae 1-1 to 1-4 and 2.

Abstract: Provided are a polymer, a resist composition including the same, and a pattern formation method using the resist composition. The polymer includes a polymer chain including a first repeating unit represented by Formula 1 below, and a terminus including at least one of an amino group, a hydroxy group, a C1-C10 alkoxy group, or a C1-C10 ester group: wherein, in Formula 1, L11 to L14, a11 to a14, A11, X11, R11, R12, b12, and p11 are as defined in the specification.

Abstract: Provided are a resist composition and a pattern formation method using the same, the resist composition including a first organometallic compound represented by one of Formulae 1-1 to 1-4 and a second organometallic compound represented by Formula 2: wherein M11, M21, L11 to L14, L21 to L24, a11 to a14, a21 to a24, R11 to R14, R21 to R24, b11 to b14, b21 to b24, Y11 to Y13, and X11 to X13 in Formulae 1-1 to 1-4 and 2 are as described in the specification.

Abstract: Provided are a resist composition and a pattern formation method using the same. The resist composition may include an organometallic compound represented by one of Formulae 1-1 to 1-4, and an additive represented by Formula 2: wherein M11, L11 to L14, a11 to a14, R11 to R14, b11 to b14, Y11 to Y13, X11 to X13, Y21, Y22, L21, and a21 in Formulae 1-1 to 1-4 and 2 are described in the specification.

Abstract: Provided are an organometallic compound represented by one of Formulae 1-1 to 1-4, a resist composition including the same, and a pattern formation method using the resist composition: M11, Q11 to Q14, b11 to b14, R11 to R14, Y11 to Y13, and X11 to X14 in Formulae 1-1 to 1-4 are as described in the specification.

Abstract: Provided are a polymer including a first repeating unit represented by Formula 1 and having a glass transition temperature of 50° C. or less, a polymer-containing composition including the polymer, and a method of forming a pattern by using the polymer-containing composition: wherein, in Formula 1, descriptions of L11 to L13, a11 to a13, An, R11, R12, b12, and p1 are provided in the present specification.

Abstract: Provided are an organic salt represented by Formula 1 below, a photoresist composition including the same, and a method of forming a pattern by using the photoresist composition. A description of Formula 1 is provided herein.

Abstract: Provided are a resist composition and a method of forming a pattern using the same, wherein the resist composition may include an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below. For a description of M11, R11, R12, n, A21, L21 to L23, A21 to a23, R21 to R22, b22, and p in Formula 1 and Formula 2, the specification is referred to.

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4, a composition for preparing the poly(amide-imide copolymer, and an article including the copolymer, e.g., a film are provided: wherein, in Chemical Formulae 1 to 4, Ra, L1, L2, n1, A, R3, X, R10, R12, R13, n7 and n8 are the same as defined in the specification.

Abstract: Provided are a resist composition and a method of forming a pattern using the same, the resist composition including an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below: wherein, in Formulas 1 and 2, M11, R11, R12, n, A21, L21 to L23, a21 to a23, R21 to R24, b22, p, and X21 are as described in the specification.

Abstract: Provided are a resist composition and a method of forming a pattern by using the same, the resist composition including: an organometallic compound represented by Formula 1; and a polymer including a repeating unit containing a radical generating group, a repeating unit containing a radical accepting group, or any combination thereof. Sn(R11)n(OR12)(4-n) ??Formula 1 Descriptions of R11, R12 and n in Formula 1 are provided in the specification.

Abstract: Provided are a polymer, a resist composition including the same, and a method of forming a pattern using the resist composition, the polymer including one or more of a first repeating unit represented by Formula 1 and a second repeating unit represented by Formula 2, and free of a repeating unit of which a structure changes by an acid: In Formulae 1 and 2, R11 to R16, b12, X?, R21 to R24, b22, and Y are as described in the specification.

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

Abstract: Provided are a carboxylate salt represented by Formula 1, a photoresist composition including the carboxylate salt represented by Formula 1, and a method of forming a pattern by using the photoresist composition wherein, in Formula 1, A11, R11 to R15, b15, n11, n12, and M+ are described in the specification.

Abstract: Provided are a polymer including a repeating unit represented by Formula 1, a photoresist composition including the polymer, and a method of forming a pattern by using the photoresist composition: wherein the details of R11, L11, a11, A11?, and B11+in Formula 1 are provided in the present specification.

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.