Abstract: One embodiment sets forth an electronic device that includes a printed circuit board, an integrated circuit that is coupled to the printed circuit board on a first side and a thermal solution on a second side, a thermal interface material that is disposed between the integrated circuit and the thermal solution, and an elastomeric sealing member that is disposed around a perimeter of the integrated circuit.

Abstract: According to various embodiments, a flexible printed circuit board includes: a first flexible dielectric layer that includes reinforcing fibers; a second flexible dielectric layer that includes no reinforcing fibers; and a first conductive layer that is disposed between the first dielectric layer and the second dielectric layer and contacts the first dielectric layer and the second dielectric layer.

Abstract: Example graphics processing subsystems and computing devices that include the graphics processing subsystem(s) are described. In one example, the graphics processing subsystem may comprise a first fan, a second fan and a printed circuit board (PCB) on which a processor is disposed. The first fan may be associated with a first axis about which the first fan is rotatable. The second fan may be associated with a second axis about which the second fan is rotatable. The PCB may be shaped and positioned such that (a) a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, and (b) a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan. The first airflow path and the second airflow path are substantially linear relative to the respective first axis and second axis.

Abstract: According to various embodiments, a heatsink includes: a plurality of cooling fins, wherein a first cooling fin included in the plurality of cooling fins has a first portion with a first height and has a second portion with a second height that is less than the first height, and wherein the first height and the second height are defined in a direction that is parallel with a direction of cooling air flowing across the plurality of cooling fins.

Abstract: According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.