Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a first redistribution substrate and a first semiconductor device on the first redistribution substrate. The first redistribution substrate includes a first dielectric layer that includes a first hole, an under-bump that includes a first bump part in the first hole and a second bump part that protrudes from the first bump part onto the first dielectric layer, an external connection terminal on a bottom surface of the first dielectric layer and connected to the under-bump through the first hole, a wetting layer between the external connection terminal and the under-bump, and a first barrier/seed layer between the under-bump and the first dielectric layer and between the under-bump and the wetting layer.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a first redistribution substrate and a first semiconductor device on the first redistribution substrate. The first redistribution substrate includes a first dielectric layer that includes a first hole, an under-bump that includes a first bump part in the first hole and a second bump part that protrudes from the first bump part onto the first dielectric layer, an external connection terminal on a bottom surface of the first dielectric layer and connected to the under-bump through the first hole, a wetting layer between the external connection terminal and the under-bump, and a first barrier/seed layer between the under-bump and the first dielectric layer and between the under-bump and the wetting layer.

Abstract: A display device includes: a display panel including a folding area and a non-folding area on one side of the folding area; and an upper protective member on a first surface of the display panel and including a coating layer, wherein the coating layer includes: a first portion overlapping the folding area; and a second portion on one side of the first portion, wherein a contact angle of the first portion is different from a contact angle of the second portion.

Abstract: A shock fatigue testing device for a powertrain mount includes: a main frame having a guide support vertically extending from a base plate and a mounting plate coupled to the guide support; a first mount jig mounted to the mounting plate and configured to support the upper portion of a mount member; a second mount jig mounted to a lower portion of the mount member and configured to support the lower portion of the mount member; a weight portion fixed to the second mount jig and configured to apply a load to the mount member; and a vibration portion configured to continuously provide vibration to the base plate to vibrate the weight portion using the main frame, the first mount jig, and the second mount jig as media.

Abstract: Disclosed are a method and device for managing a project by using a data pointer. A project is efficiently operated by dividing a project based on a minimum unit task and designing a plurality of child projects connected in sequential order such that a plurality of child projects proceed in order.

Abstract: An off-road travel assistive device includes a receiver configured to receive travel data of a vehicle, and an estimator. The estimator includes a road surface severity estimator configured to estimate road surface severity data based on the travel data of the vehicle. The device also includes a stuck probability determiner configured to determine probability of a stuck state of the vehicle occurring using the travel data and the road surface severity data. The stuck probability determiner determines stuck probability using a meta-model.

Abstract: A focused ultrasound apparatus for women is disclosed. According to one aspect of the present disclosure, the focused ultrasound apparatus for women is provided, including a handpiece, a cartridge which is detachably coupled to the handpiece and one side of the cartridge may be inserted into recipient's vagina, an ultrasound generation unit which is equipped on one side of the cartridge and generates a focused ultrasound, a rotation drive unit which rotates the cartridge which is equipped in and coupled to the handpiece around a longitudinal axis of the cartridge, a control unit which controls operations of the ultrasound generation unit and the rotation drive unit, and a procedure assistance unit which is movably coupled to the cartridge in order to enable an adjustment of an insertion depth of the cartridge inserted into a recipient's vagina.

Abstract: A road surface condition estimation apparatus includes a storage unit configured to store a road surface condition estimation model, and a road surface severity estimator configured to estimate, based on travel information, severity of a condition of a road surface on which a vehicle is travelling using the road surface condition estimation model.

Abstract: An apparatus for determining whether a vehicle is in a stuck state may include: a receiving unit configured for receiving driving information of a vehicle; a score determination unit configured for determining a stuck score based on the driving information; and a stuck determining unit configured for determining whether a vehicle is in a stuck state based on accumulated stuck scores obtained by accumulating stuck scores.

Abstract: An apparatus for estimating a vehicle speed includes: a vehicle information receiving unit for receiving driving information of a vehicle, including wheel speed, motor torque, and longitudinal acceleration of the vehicle; a wheel slip determining unit for determining whether wheel slip occurs; a longitudinal acceleration correction unit correcting the longitudinal acceleration received from the vehicle information receiving unit; and a vehicle speed estimation unit for estimating a vehicle speed using the wheel speed or the corrected longitudinal acceleration according to the determination result of the wheel slip determining unit.

Abstract: Disclosed is a biosignal sensing device capable of measuring at least one biosignal while being in contact with a user's skin. The biosignal sensing device includes a sensor configured to detect at least one biosignal while being in contact with a user's skin, and the sensor is deformed to a shape corresponding to a contact portion and comes into close contact with the contact portion.

Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer.

Abstract: A memory device, and a method of operating the same, includes a memory block to which first and second word line groups are coupled, and to which a first dummy line group disposed between the first and second word line groups is coupled. The memory device also includes a peripheral circuit configured to program memory cells coupled to a selected word line of the first or second word line group. The peripheral circuit is configured to, when the selected word line is included in the second word line group, when a program voltage is applied to the selected word line, apply a first pass voltage to unselected word lines included in the first and second word line groups and to dummy lines included in the first dummy line group.

Abstract: The present invention relates to novel peptides having anti-inflammatory and tissue regenerative actions and uses thereof.

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

Abstract: A semiconductor package includes a redistribution substrate having first and second surfaces opposed to each other, and including an insulation member, a plurality of redistribution layers on different levels in the insulation member, and a redistribution via having a shape narrowing from the second surface toward the first surface in a first direction; a plurality of UBM layers, each including a UBM pad on the first surface of the redistribution substrate, and a UBM via having a shape narrowing in a second direction, opposite to the first direction; and at least one semiconductor chip on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to the redistribution layer adjacent to the second surface among the plurality of redistribution layers.

Abstract: Disclosed is a semiconductor package comprising a redistribution substrate, and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an under-bump pattern, a lower dielectric layer that covers a sidewall of the under-bump pattern, and a first redistribution pattern on the lower dielectric layer. The first redistribution pattern includes a first line part. A width at a top surface of the under-bump pattern is greater than a width at a bottom surface of the under-bump pattern. A thickness of the under-bump pattern is greater than a thickness of the first line part.

Abstract: Disclosed is a semiconductor package comprising a redistribution substrate, and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an under-bump pattern, a lower dielectric layer that covers a sidewall of the under-bump pattern, and a first redistribution pattern on the lower dielectric layer. The first redistribution pattern includes a first line part. A width at a top surface of the under-bump pattern is greater than a width at a bottom surface of the under-bump pattern. A thickness of the under-bump pattern is greater than a thickness of the first line part.

Abstract: A display device includes a flexible display portion, a case which accommodates the display portion, and a blocking layer which is disposed between the display portion and the case. The blocking layer includes a plurality of nanolines.

Abstract: A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.