Patents by Inventor Junghwi LEE

Junghwi LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210135115
    Abstract: Provided is a resin which is excellent in terms of solubility in common solvents, crosslinking temperature, time required for crosslinking, solvent resistance (cracking resistance), breakdown voltage, leakage current, solvent wettability, and planarity in cases where the resin is formed into a thin film. A resin which comprises repeating units represented by formula (1) and formula (2), and wherein the repeating unit represented by formula (2) is contained in an amount of 20% by mole or more relative to the total amount of the repeating units represented by formula (1) and formula (2).
    Type: Application
    Filed: March 9, 2018
    Publication date: May 6, 2021
    Applicant: TOSOH CORPORATION
    Inventors: Hiroshi YAMAKAWA, Shinya OKU, Shohei YUMINO, Junghwi LEE, Fumiaki KATAGIRI