Patents by Inventor Jung-Hyun Lim

Jung-Hyun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240006213
    Abstract: Proposed are a transport vehicle which can prevent the risk of collision of the transport vehicle and minimize damage to parts of the transport vehicle in the event of the collision, and an article transport system including the transport vehicle. The transport vehicle for transporting an article in a manufacturing factory includes a driving unit which drives along a driving rail, and a hoist unit which is located under the driving unit and supports the article. The hoist unit includes a frame, and a pair of tail plates which is provided on a rear surface of the frame and protrudes rearward.
    Type: Application
    Filed: March 6, 2023
    Publication date: January 4, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Hyuk Jae SUNG, Ki Tae NOH, Ju Ho LEE, Jung Hyun LIM
  • Patent number: 11437295
    Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Jung Hyun Lim, Seung Goo Jang, Eun Kyoung Kim, Se Min Jin
  • Patent number: 10945705
    Abstract: A portable facility failure diagnosis device using detection of radiation ultrasonic waves, comprising: an ultrasonic sensor array; a data acquisition board (DAQ board) in which an electronic circuit for acquiring ultrasonic signals at a sampling frequency of the ultrasonic signals sensed by the ultrasonic sensor array is mounted on a substrate of the data acquisition board (DAQ board); a main board in which an operation processing device that processes the ultrasonic signals received from the DAQ board is mounted on the substrate and the processed ultrasonic sound source information to a display device; a data storage medium storing data processed in the operation processing device of the main board; a display device visually displaying the data processed; and an optical camera picking up an image of a direction.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: March 16, 2021
    Assignee: SM INSTRUMENT CO., LTD.
    Inventors: Young Ki Kim, YoungMin Kim, JeaSun Lee, Kwang Hyun Lee, Seong Joo Han, Jung Hyun Lim
  • Publication number: 20200219784
    Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
    Type: Application
    Filed: March 19, 2020
    Publication date: July 9, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun KIM, Jung Hyun LIM, Seung Goo JANG, Eun Kyoung KIM, Se Min JIN
  • Patent number: 10636721
    Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 28, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Jung Hyun Lim, Seung Goo Jang, Eun Kyoung Kim, Se Min Jin
  • Publication number: 20190057924
    Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 21, 2019
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyun Kim, Jung Hyun Lim, Seung Goo Jang, Eun Kyoung Kim, Se Min Jin
  • Publication number: 20180333135
    Abstract: A portable facility failure diagnosis device using detection of radiation ultrasonic waves, comprising: an ultrasonic sensor array; a data acquisition board (DAQ board) in which an electronic circuit for acquiring ultrasonic signals at a sampling frequency of the ultrasonic signals sensed by the ultrasonic sensor array is mounted on a substrate of the data acquisition board (DAQ board); a main board in which an operation processing device that processes the ultrasonic signals received from the DAQ board is mounted on the substrate and the processed ultrasonic sound source information to a display device; a data storage medium storing data processed in the operation processing device of the main board; a display device visually displaying the data processed; and an optical camera picking up an image of a direction.
    Type: Application
    Filed: November 9, 2017
    Publication date: November 22, 2018
    Inventors: Young Ki KIM, YoungMin KIM, JeaSun LEE, Kwang Hyun LEE, Seong Joo HAN, Jung Hyun LIM
  • Publication number: 20180335510
    Abstract: A radiation ultrasonic wave visualization method in which an ultrasonic wave radiated by a sound source is visualized, comprises: heterodyne-converting ultrasonic signals in a band of at least 20 KHz or more, which are acquired by an ultrasonic sensor array constituted by a plurality of ultrasonic sensors and converting the ultrasonic signals into a low-frequency signal and thereafter, beamforming the converted low-frequency signals or beamforming the converted low-frequency signals based on resampling signals, thereby handling the low-frequency signals without distorting ultrasonic sound location information to reduce a data handling amount in the beamforming step.
    Type: Application
    Filed: November 8, 2017
    Publication date: November 22, 2018
    Inventors: Young Ki KIM, YoungMin KIM, JeaSun LEE, Kwang Hyun LEE, Seong Joo HAN, Jung Hyun LIM
  • Publication number: 20150301778
    Abstract: An electronic shelf label includes a front protection plate; a rear case coupled to the front protection plate; a display panel disposed on an inner side of the front protection plate including a display unit and a driving unit configured to drive the display unit; a main circuit board disposed on an inner side of the rear case and including a main circuit unit electrically connected to the driving unit; and an near field communications (NFC) unit disposed between the display panel and the main circuit board and configured to perform NFC communications.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 22, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jung Hyun LIM
  • Patent number: 8922574
    Abstract: A liquid crystal display (LCD) device comprises an image signal processing unit that selectively compensates a current frame upon determining that it is part of a sequence of changing images as opposed to a sequence of still images. The image signal processing device comprises an encoding/decoding unit that generates comparison frame decoding data by encoding and decoding comparison frame data, generates reference frame decoding data by encoding and decoding reference frame data, and a determining unit that sets a comparison range based on effective bits in the comparison frame decoding data and effective bits in the reference frame decoding data, and compares the comparison frame decoding data and the reference frame decoding data within the comparison range.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: December 30, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-hyun Lim, Hong-ki Kwon, Deok-soo Park, Sang-hoon Ha, Byoung-ju Song
  • Patent number: 8818118
    Abstract: An image encoding device includes a first compression unit, a second compression unit, a third compression unit and an output unit. The first compression unit generates first compressed data by compressing first data associated with a reference block in an input image. The second compression unit generates second compressed data by compressing second data associated with a current compressing block in the input image when the current compressing block corresponds to a first pattern. The current compressing block is included in the reference block. The third compression unit generates third compressed data by compressing the second data when the current compressing block corresponds to one of a plurality of second patterns. The output unit outputs compressed data based on the first compressed data, the second compressed data and the third compressed data.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: August 26, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Deok-Soo Park, Hong-Ki Kwon, Byoung-Ju Song, Jung-Hyun Lim, Sang-Hoon Ha
  • Patent number: 8797424
    Abstract: An image processing apparatus including a memory, a data bus provided to access the memory, an image conversion unit which receives an image signal and converts the image signal into a frame comprising a plurality of lines, and an image compression/decompression unit which divides the frame into a plurality of line groups, compresses each of the plurality of line groups to generate compressed data, and stores the compressed data in the memory via the data bus, where at least one line in at least one line group is omitted from the compression.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: August 5, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Do Oh, Jae Young Lee, Jung Hyun Lim, Hong Jun Choi
  • Publication number: 20130142445
    Abstract: An image encoding device includes a first compression unit, a second compression unit, a third compression unit and an output unit. The first compression unit generates first compressed data by compressing first data associated with a reference block in an input image. The second compression unit generates second compressed data by compressing second data associated with a current compressing block in the input image when the current compressing block corresponds to a first pattern. The current compressing block is included in the reference block. The third compression unit generates third compressed data by compressing the second data when the current compressing block corresponds to one of a plurality of second patterns. The output unit outputs compressed data based on the first compressed data, the second compressed data and the third compressed data.
    Type: Application
    Filed: August 30, 2012
    Publication date: June 6, 2013
    Inventors: Deok-Soo PARK, Hong-Ki KWON, Byoung-Ju SONG, Jung-Hyun LIM, Sang-Hoon HA
  • Patent number: 8279233
    Abstract: Provided are a system for compensating response speed and a method of controlling frame data of an image. The system includes: a circuit for compensating response speed; an internal frame memory that comprises N sub frame memories formed in a single chip with the circuit for compensating response speed, wherein N is a natural number; a frame memory controller that comprises N sub frame memory controllers corresponding to each sub frame memory; and a data flow controller that comprises N write first-in-first-out (FIFO) circuits and N read FIFO circuits corresponding to each sub frame memory.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: October 2, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jung-hyun Lim
  • Publication number: 20120235962
    Abstract: A liquid crystal display (LCD) device comprises an image signal processing unit that selectively compensates a current frame upon determining that it is part of a sequence of changing images as opposed to a sequence of still images. The image signal processing device comprises an encoding/decoding unit that generates comparison frame decoding data by encoding and decoding comparison frame data, generates reference frame decoding data by encoding and decoding reference frame data, and a determining unit that sets a comparison range based on effective bits in the comparison frame decoding data and effective bits in the reference frame decoding data, and compares the comparison frame decoding data and the reference frame decoding data within the comparison range.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 20, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-hyun Lim, Hong-ki Kwon, Deok-soo Park, Sang-hoon Ha, Byoung-ju Song
  • Publication number: 20110149147
    Abstract: An image processing apparatus including a memory, a data bus provided to access the memory, an image conversion unit which receives an image signal and converts the image signal into a frame comprising a plurality of lines, and an image compression/decompression unit which divides the frame into a plurality of line groups, compresses each of the plurality of line groups to generate compressed data, and stores the compressed data in the memory via the data bus, where at least one line in at least one line group is omitted from the compression.
    Type: Application
    Filed: October 29, 2010
    Publication date: June 23, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Do OH, Jae Young LEE, Jung Hyun LIM, Hong Jun CHOI
  • Publication number: 20090245388
    Abstract: A memory saving method performed in a signal processing apparatus may include the operations of performing decoding processing on an input video compressed image stream; individually inputting decoding processed data of a previous frame and decoding processed data of a current frame, the decoding processed data of a previous frame and the decoding processed data of a current frame being generated in the decoding processing; and performing response time compensation processing by using the input decoding processed data of the previous frame and the input decoding processed data of the current frame.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Inventor: Jung-Hyun Lim
  • Publication number: 20080192061
    Abstract: Provided are a system for compensating response speed and a method of controlling frame data of an image. The system includes: a circuit for compensating response speed; an internal frame memory that comprises N sub frame memories formed in a single chip with the circuit for compensating response speed, wherein N is a natural number; a frame memory controller that comprises N sub frame memory controllers corresponding to each sub frame memory; and a data flow controller that comprises N write first-in-first-out (FIFO) circuits and N read FIFO circuits corresponding to each sub frame memory.
    Type: Application
    Filed: December 13, 2007
    Publication date: August 14, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jung-hyun Lim
  • Patent number: 7343238
    Abstract: Disclosed herein is a technology for controlling speed of a car. More specifically, the invention relates to a speed controller for a car using telematics, the controller comprising a sensor unit to detect the speed of the car, the distance from the car to an object in front, and the operating status of a brake pedal and an accelerator pedal, a telematics system to output a signal to control the travel speed of the car and a gear shifting signal, when the speed of the car and the distance from the car to the object in front exceeds a preset range of an approaching distance, a speed regulation system to maintain the travel speed of the car within a speed limit by controlling an accelerator pedal and a brake pedal control unit, and an automatic transmission system to set a gear shifting level by controlling a gear shifting lever control unit.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: March 11, 2008
    Assignee: Hyundai Autonet Co., Ltd.
    Inventors: Seong-Taeg Nou, Hyeon-Su Kim, Chang-Hwan Lim, Jung-Hyun Lim, Jung-Mi Han, Jun-Ho Lee
  • Publication number: 20070005213
    Abstract: Disclosed herein is a backward control system for an automobile using telematics. The system includes: a sensor unit to sense a backward speed, presence of a backward object, and the operating state of the brake pedal and the accelerator pedal of an automobile when backward-travelling; a telematics system unit to output a control signal, when a distance between the automobile and the object is within a pre-set range in response to the signal from the sensor unit, such that the backward-travelling is automatically interrupted to thereby prevent collision with the object; and a accelerator pedal control unit and a brake pedal control unit to automatically control the operation of the accelerator pedal and the brake pedal to thereby interrupt the backward-travelling in response to the control signal outputted from the telematics system unit.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 4, 2007
    Applicant: Hyundai Autonet Co., Ltd.
    Inventors: Seong-Taeg Nou, Hyeon-Su Kim, Chang-Hwan Lim, Jung-Hyun Lim, Jun-Ho Lee