Abstract: Provided is use of a trigonal agonist having activities to all of glucagon, GLP-1, and GIP receptors, and/or a conjugate thereof in the prevention or treatment of sequelae following respiratory infectious diseases.

Abstract: A syntactic analysis apparatus according to an embodiment of the present disclosure may include an input device receiving a phrase uttered from a user, and a learning device performing at least one or more of extension of an intent output layer for classifying an utterance intent of the user from the uttered phrase and extension of a slot output layer for classifying a slot including information of the phrase and extending a pre-generated utterance syntactic analysis model, such that the uttered phrase is classified into the extended intent output layer and the extended slot output layer, thereby broadly classifying an intent and a slot for the phrase uttered from a user.

Abstract: A syntactic analysis apparatus according to an embodiment of the present disclosure may include an input device receiving a phrase uttered from a user, and a learning device performing at least one or more of extension of an intent output layer for classifying an utterance intent of the user from the uttered phrase and extension of a slot output layer for classifying a slot including information of the phrase and extending a pre-generated utterance syntactic analysis model, such that the uttered phrase is classified into the extended intent output layer and the extended slot output layer, thereby broadly classifying an intent and a slot for the phrase uttered from a user.

Abstract: A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.

Abstract: A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.

Abstract: A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.

Abstract: Provided is a test system conducting a parallel bit test. The test system, conducting a parallel bit test on a plurality of memory modules mounted on a socket, comprises a plurality of counters and a comparator. Each of the counters counts the number of data output signals in the same logic state, among the data output signals outputted from each memory of the memory modules, and outputs a count signal. The comparator compares the count signal outputted from each of the counters and outputs a comparison signal corresponding to a defect of the memory modules. According to the test system, defects in a memory module can be accurately detected and a possibility of an error in the detection can be reduced when a plurality of memory modules are tested, as compared to conventional test systems.

Abstract: A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).

Abstract: A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.

Abstract: a memory module test system for testing a plurality of memory modules includes a plurality buffers in one-to-one correspondence the plurality of memory modules, each of the buffers including a self-test engine for testing a corresponding memory module. The test system further includes an interface configured to receive a test program for testing the memory module, and a gate array configured to transmit the test program to the buffers using a Joint Test Action Group (JTAG) protocol and to read test results of the test program from the buffers using the JTAG protocol.

Abstract: A method for preventing carbon steel from intergranular cracking utilizing a reducing gas instead of nitrogen gas for a heat treatment of feeder pipes for a pressurized heavy water reactor (PHWR) nuclear power plant. This heat treatment protects carbon from oxidation to prevent the formation of decarburized layers so that the feeder pipes can be prevented from intergranular cracking. In addition, intergranular segregation of impurities is inhibited and intergranular strength of the carbon steel is enhanced. Therefore, no intergranular cracking occurs despite the concentration of stress.

Abstract: A memory module, a memory unit, and a hub with a non-periodic clock and methods for using the same. An example memory module may include a phased locked loop, receiving an external, periodic clock and generating one or more internal periodic clocks and a plurality of memory units, receiving one of the internal periodic clocks or a non-periodic clock from an external source.

Abstract: Provided is a test system conducting a parallel bit test. The test system, conducting a parallel bit test on a plurality of memory modules mounted on a socket, comprises a plurality of counters and a comparator. Each of the counters counts the number of data output signals in the same logic state, among the data output signals outputted from each memory of the memory modules, and outputs a count signal. The comparator compares the count signal outputted from each of the counters and outputs a comparison signal corresponding to a defect of the memory modules. According to the test system, defects in a memory module can be accurately detected and a possibility of an error in the detection can be reduced when a plurality of memory modules are tested, as compared to conventional test systems.

Abstract: A memory module testing apparatus and method include a test slot adapted to receive a target memory module, wherein the target memory module includes a first memory unit to store information related to the target memory module. The memory module testing apparatus further includes a second memory unit adapted to store information related to a memory module, and a first switching unit adapted to selectively provide a driving signal to at least one of the first memory unit and the second memory unit.

Abstract: A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).

Abstract: A memory module and related method are disclosed. The memory module comprises a clock generator configured to generate first and second internal clock signals in relation to an external clock signal, and a register configured to receive the first and second internal clock signals. The register stores an external control/address signal in response to the first internal clock signal and transmits an internal control/address signal derived from the external control/address in response to the second internal control/address signal.

Abstract: A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.

Abstract: A memory module and related method are disclosed. The memory module comprises a clock generator configured to generate first and second internal clock signals in relation to an external clock signal, and a register configured to receive the first and second internal clock signals. The register stores an external control/address signal in response to the first internal clock signal and transmits an internal control/address signal derived from the external control/address in response to the second internal control/address signal.

Abstract: A memory module testing apparatus that comprises a test slot adapted to receive a target memory module, wherein the target memory module comprises a first memory unit adapted to store information related to the target memory module, is disclosed. The memory module testing apparatus further comprises a second memory unit adapted to store information related to a memory module, and a first switching unit adapted to selectively provide a driving signal to at least one of the first memory unit and the second memory unit. A memory module testing method for the memory module testing apparatus is also disclosed.

Abstract: A memory module, a memory unit, and a hub with a non-periodic clock and methods for using the same. An example memory module may include a phased locked loop, receiving an external, periodic clock and generating one or more internal periodic clocks and a plurality of memory units, receiving one of the internal periodic clocks or a non-periodic clock from an external source.