Abstract: An embodiment joint structure of a vehicle body includes a front body module fixed to a front portion of a center floor member of an underbody of the vehicle body, wherein the front body module is a fixed part, a rear body module detachably fixed to a rear portion of the center floor member and a rear portion of the front body module in a set shape, wherein the rear body module is a variable part, a plurality of center floor member coupling modules disposed on the center floor member at the rear portion of the front body module, and a plurality of variable part coupling modules disposed at a lower side of the rear body module and configured to be coupled to the center floor member coupling modules by electromagnetic force.

Abstract: An embodiment joint structure for a vehicle body includes a front body module that is a stationary part fixable to a front part of an under body of the vehicle body, a rear body module that is a variable part having a preset shape, the rear body module being attachable to and detachable from a rear part of the under body and a rear part of the front body module, a plurality of stationary part coupling modules disposed on an upper end surface portion of a rear edge of the front body module, and a plurality of variable part coupling modules disposed on an upper end surface portion of a front edge of the rear body module and couplable to the stationary part coupling modules by an electromagnetic force.

Abstract: A semiconductor system includes a controller configured to apply a command address, a first chip selection signal, and a second chip selection signal, and a semiconductor device including a first rank and a second rank configured to calibrate each termination resistance, based on the command address, the first chip selection signal, and the second chip selection signal.

Abstract: An electric vehicle structure includes a drive system, a front lateral member and a rear upper lateral member. The front and rear lateral members are elongated in a lateral direction of a vehicle and spaced apart from each other in a forward-rearward direction of the vehicle with the drive system interposed therebetween. The vehicle structure further includes a rear lower lateral member elongated in the lateral direction of the vehicle and disposed beneath a motor of the drive system.

Abstract: A trailing arm bush may include a cylindrical outer pipe, an inner pipe inserted to a central portion of the outer pipe at an interval, a first bush rubber unit, a second bush rubber unit and a third bush rubber unit that connect between an inner peripheral surface of the outer pipe and an outer peripheral surface of the inner pipe, respectively, a hollow void part formed between the inner peripheral surface of the outer pipe and the outer peripheral surface of the inner pipe, and a stopper attached to the inner peripheral surface of the outer pipe and disposed among the first bush rubber unit, the second bush rubber unit and the third bush rubber unit.

Abstract: A coupled torsion beam axle for vehicles may include a torsion beam disposed in a vehicle width direction and trailing arms disposed at both ends of the torsion beam in a length direction of a vehicle body, wherein the torsion beam has an opened cross section formed in a reverse “U” shape by press-forming one sheet member machined so that lengths of right and left sides are different from each other on the basis of a center, and cross section widths which are different from each other along vehicle width directions of both sides on the basis of the center between the trailing arms of both sides, and front and rear surfaces formed in a wave shape along the vehicle width directions of both sides on the basis of the center.

Abstract: A coupled torsion beam axle for vehicles may include a torsion beam disposed in a vehicle width direction and trailing arms disposed at both ends of the torsion beam in a length direction of a vehicle body, wherein the torsion beam has an opened cross section formed in a reverse “U” shape by press-forming one sheet member machined so that lengths of right and left sides are different from each other on the basis of a center, and cross section widths which are different from each other along vehicle width directions of both sides on the basis of the center between the trailing arms of both sides, and front and rear surfaces formed in a wave shape along the vehicle width directions of both sides on the basis of the center.

Abstract: A trailing arm bush may include a cylindrical outer pipe, an inner pipe inserted to a central portion of the outer pipe at an interval, a first bush rubber unit, a second bush rubber unit and a third bush rubber unit that connect between an inner peripheral surface of the outer pipe and an outer peripheral surface of the inner pipe, respectively, a hollow void part formed between the inner peripheral surface of the outer pipe and the outer peripheral surface of the inner pipe, and a stopper attached to the inner peripheral surface of the outer pipe and disposed among the first bush rubber unit, the second bush rubber unit and the third bush rubber unit.

Abstract: A structure of a trailing arm for a vehicle according to the exemplary embodiment of the present disclosure may include a trailing arm disposed between a vehicle body and a wheel to absorb torsion generated at the wheel. A drive motor is disposed in an interior space of the trailing arm and serves as a power source of the vehicle. A decelerator is disposed to selectively change a rotation speed of the wheel by receiving a torque of the drive motor.

Abstract: In an embodiment of a method of inspecting a substrate, the substrate on which minute structures are formed is divided into a plurality of inspection regions. A main inspection region among the inspection regions is selected. A main image of the main inspection region and sub-images of sub-inspection regions adjacent to the main inspection region are obtained. An average image of the main image and the sub-images is obtained. The average image is then compared with the main image to detect defects in the main inspection region. Gray levels may be used. The average image may have improved quality so that the defects in the selected inspection region may be rapidly and accurately detected. This process has an improved reliability. Further, the number of inspecting processes for the substrate may be reduced. And a line for the inspection process may be automated so that a worker-free line may be established.

Abstract: In an embodiment, a method of scanning a substrate, and a method and an apparatus for analyzing crystal characteristics are disclosed. A sequential scan on the scan areas using a first electron beam and a second electron beam are repeatedly performed. The electrons accumulated in the scan areas by the first electron beam are removed from the scan areas by the second electron beam. When a size of the scan area is substantially the same as a spot size of the first electron beam, adjacent scan areas partially overlap each other. When each of the scan areas is larger than a spot size of the first electron beam, the adjacent scan areas do not overlap each other. Images of the scan areas are generated using back-scattered electrons emitted from each of the scan areas by irradiating the first electron beam to analyze crystal characteristics of circuit patterns on the substrate.

Abstract: In the methods of compensating for an alignment error during fabrication of structures on semiconductor substrates, a conductive pattern structure is formed at a first position on a first semiconductor substrate. The conductive pattern structure includes a grid of first and second conductive patterns arranged as columns and intersecting rows with openings bounded therebetween. A first conductive contact structure overlaps the conductive pattern structure, and includes a plurality of spaced apart conductive contacts arranged as a grid of rows and columns that can be tilted at a non-zero angle relative to the grid of the conductive pattern structure. A determination is made as to whether the first conductive contact structure is electrically connected to the conductive pattern structure.

Abstract: In an embodiment, a method of scanning a substrate, and a method and an apparatus for analyzing crystal characteristics are disclosed. A sequential scan on the scan areas using a first electron beam and a second electron beam are repeatedly performed. The electrons accumulated in the scan areas by the first electron beam are removed from the scan areas by the second electron beam. When a size of the scan area is substantially the same as a spot size of the first electron beam, adjacent scan areas partially overlap each other. When each of the scan areas is larger than a spot size of the first electron beam, the adjacent scan areas do not overlap each other. Images of the scan areas are generated using back-scattered electrons emitted from each of the scan areas by irradiating the first electron beam to analyze crystal characteristics of circuit patterns on the substrate.

Abstract: In the methods of compensating for an alignment error during fabrication of structures on semiconductor substrates, a conductive pattern structure is formed at a first position on a first semiconductor substrate. The conductive pattern structure includes a grid of first and second conductive patterns arranged as columns and intersecting rows with openings bounded therebetween. A first conductive contact structure overlaps the conductive pattern structure, and includes a plurality of spaced apart conductive contacts arranged as a grid of rows and columns that can be tilted at a non-zero angle relative to the grid of the conductive pattern structure. A determination is made as to whether the first conductive contact structure is electrically connected to the conductive pattern structure.

Abstract: In a method, with improved utilization of memory, of inspecting a defect on an object, the object is divided into a plurality of inspection regions. A plurality of levels is determined according to the numbers of defects, which are expected before detecting the defects, on the inspection regions. The defects on a selected inspection region are detected. The level including a range, which corresponds to the number of defects detected on the selected inspection region, is assigned to the selected inspection region with reference to the number of defects detected on the selected inspection region. The steps of detecting defects and assigning levels are repeated with respect to remaining inspection regions.

Abstract: In an embodiment of a method of inspecting a substrate, the substrate on which minute structures are formed is divided into a plurality of inspection regions. A main inspection region among the inspection regions is selected. A main image of the main inspection region and sub-images of sub-inspection regions adjacent to the main inspection region are obtained. An average image of the main image and the sub-images is obtained. The average image is then compared with the main image to detect defects in the main inspection region. Gray levels may be used. The average image may have improved quality so that the defects in the selected inspection region may be rapidly and accurately detected. This process has an improved reliability. Further, the number of inspecting processes for the substrate may be reduced. And a line for the inspection process may be automated so that a worker-free line may be established.

Abstract: An image processing method is disclosed. The method comprises capturing a plurality of images of a sample using a scanning electron microscope (SEM). The method further comprising computing a mean value for each pixel location in the plurality of images and forming an integrated image with the mean values. The method further comprises filtering the integrated image using a median filter.

Abstract: An etching system and method. In the method, layers are etched on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, wherein an etching period varies according to an accumulated process number of substrates. The system includes an etching equipment including an etching processor for etching layers on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, and a loader for temporarily holding cassettes in which the substrates are stored; and a controller for controlling operations of the etching equipment. The etching equipment changes an etching period according to an accumulated process number of the substrates.

Abstract: An etching system and method. In the method, layers are etched on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, wherein an etching period varies according to an accumulated process number of substrates. The system includes an etching equipment including an etching processor for etching layers on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, and a loader for temporarily holding cassettes in which the substrates are stored; and a controller for controlling operations of the etching equipment. The etching equipment changes an etching period according to an accumulated process number of the substrates.