Patents by Inventor Jung Woo Yang

Jung Woo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121902
    Abstract: The present invention relates to a surface-treated copper foil, which has excellent adhesive strength with a resin substrate, shows low bending deformation after adhesion with a resin substrate, and is suitable as a high-frequency foil due to its low transmission loss, to a copper clad laminate comprising same, and to a printed wiring board.
    Type: Application
    Filed: January 11, 2022
    Publication date: April 11, 2024
    Inventors: Chang Yol YANG, Jung Woo SEO, Kideok SONG, Sunhyoung LEE
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Patent number: 11935926
    Abstract: A method for fabricating a semiconductor device includes forming a stack structure including a horizontal recess over a substrate, forming a blocking layer lining the horizontal recess, forming an interface control layer including a dielectric barrier element and a conductive barrier element over the blocking layer, and forming a conductive layer over the interface control layer to fill the horizontal recess.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: March 19, 2024
    Assignee: SK hynix Inc.
    Inventors: Hyeng-Woo Eom, Jung-Myoung Shim, Young-Ho Yang, Kwang-Wook Lee, Won-Joon Choi
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Patent number: 8163526
    Abstract: A method for increasing production of ethanol in an ethanologenic cell using an autoinducer molecule, for example, AI-2.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: April 24, 2012
    Assignee: The University of Durham
    Inventors: Adrian Robert Walmsley, Maria Ines Borges-Walmsley, Jung Woo Yang
  • Publication number: 20110053236
    Abstract: A method for increasing production of ethanol in an ethanologenic cell using an autoinducer molecule, for example AI-2.
    Type: Application
    Filed: October 17, 2007
    Publication date: March 3, 2011
    Applicant: University of Durham
    Inventors: Adrian Robert Walmsley, Maria Ines Borges-Walmsley, Jung Woo Yang