Patents by Inventor Junhao YI

Junhao YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Voice coil motor direct-drive active vibration isolation and leveling integrated platform
    Patent number: 12034355
    Abstract: A voice coil motor direct-driven active vibration isolation and leveling integrated platform. The voice coil motor direct-drive active vibration isolation and leveling integrated platform includes a moving platform, a base, a driving mechanism and a vibration isolation and leveling composite mechanism; the moving platform is rotatably disposed on the base around the X-axis and the Y-axis through the vibration isolation and leveling composite mechanism; the driving mechanism is used to drive the moving platform to perform leveling movement, and the force exerted by the driving mechanism on the moving platform is distributed symmetrically around the circumference of the moving platform.
    Type: Grant
    Filed: February 2, 2024
    Date of Patent: July 9, 2024
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Jian Gao, Junhao Yi, Lanyu Zhang, Haixiang Deng
  • VOICE COIL MOTOR DIRECT-DRIVE ACTIVE VIBRATION ISOLATION AND LEVELING INTEGRATED PLATFORM
    Publication number: 20240171036
    Abstract: A voice coil motor direct-driven active vibration isolation and leveling integrated platform. The voice coil motor direct-drive active vibration isolation and leveling integrated platform includes a moving platform, a base, a driving mechanism and a vibration isolation and leveling composite mechanism; the moving platform is rotatably disposed on the base around the X-axis and the Y-axis through the vibration isolation and leveling composite mechanism; the driving mechanism is used to drive the moving platform to perform leveling movement, and the force exerted by the driving mechanism on the moving platform is distributed symmetrically around the circumference of the moving platform.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 23, 2024
    Inventors: Jian GAO, Junhao YI, Lanyu ZHANG, Haixiang DENG