Abstract: Embodiments provide a semiconductor fabrication method. The method includes: providing a substrate including an active layer; and forming a bit line contact layer and a bit line extending along a first direction, two sides of the bit line contact layer being in contact with the active layer and the bit line. Forming the bit line includes: forming a bit line stack including a semiconductor layer and a conductive layer stacked in sequence, the semiconductor layer covering a surface of the substrate and a surface of the bit line contact layer; etching part of the bit line stack to form initial bit lines arranged at intervals, the initial bit lines including a plurality of conductive lines; performing oxidation treatment on the semiconductor layer exposed between adjacent conductive lines to form an oxide layer, the semiconductor layer not oxidized being used as a semiconductor connection layer; and removing the oxide layer.