Abstract: The semiconductor memory device includes a substrate including an active area, a bit line structure on the substrate, the bit line structure including a cell conductive line and a cell line capping film, storage contacts disposed on opposing sides of the bit line structure and connected to the active area, a storage pad on one of the storage contacts and connected to one of the storage contacts, and a data storage pattern on an upper surface of the cell line capping film and connected to the storage pad, and wherein the storage pad includes an upper storage pad, and a lower storage pad disposed between the upper storage pad and the storage contact, and wherein a width of the upper storage pad disposed on top of the upper surface of the cell line capping film increases with distance from the upper surface of the cell line capping film.

Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.

Abstract: A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.

Abstract: According to the present disclosure, upper and lower substrates may be electrically connected to a lead frame, such that wire bonding may be excluded, and electrical connection and heat dissipation may be performed without a spacer by improving a connection structure in the upper and lower substrates. In addition, a power module is introduced in which because a spacer for forming a large current path may be excluded, a current path may be shortened, such that power performance may be improved, an internal space may be additionally provided, costs may be reduced, and an overall size of the power module may be reduced.

Abstract: The present disclosure relates to a polymerase chain reaction (PCR) test chip and a PCR test device including the same. The PCR test chip includes: a body unit made of a light-transmitting material and including an inlet through which a sample is injected; a reaction chamber including a first chamber part recessed from a lower surface of the body unit toward an upper surface of the body unit, and recessed in a first region from the lower surface, and a second chamber part in which a reagent is accommodated, being further recessed than the first chamber part toward the upper surface of the body unit with a step difference from the first region inside the first region; and an inflow path that connects the inlet to the reaction chamber and guides the sample into the reaction chamber.

Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: The present disclosure relates to a nucleic acid isolation device and method. The nucleic acid isolation device includes: a main body formed to allow a biological sample to pass through from top to bottom; and an absorption layer provided inside the main body to absorb an inhibitor that inhibits a polymerase chain reaction (PCR) and is included in the sample, wherein, when the sample passes through the main body, the inhibitor is absorbed into the absorption layer and nucleic acids are discharged through a lower portion of the main body.

Abstract: A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.

Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

Abstract: There is provided a method performed by a system for obtaining a relative location of an anchor-free UWB-based node. The method includes obtaining relative distances between a plurality of nodes based on UWB sensor values between the nodes, constructing a relative coordinate system having a center node of the plurality of nodes as a base, and calculating coordinate values of other nodes in the relative coordinate system. The constructing of the relative coordinate system having the center node of the plurality of nodes as a base includes constructing the relative coordinate system based on a relative distance between the center node and another node and absolute values of y axis values.

Abstract: A power module includes first and second substrates spaced from each other, at least one semiconductor chip, and at least one third substrate, in which the at least one third substrate includes at least one conductive pattern including one end portion electrically connected to any one of the semiconductor chips, and the other end portion extending outwardly from the first and second substrates.

Abstract: A power module includes an insulating layer, a first metal layer disposed on a first surface of the insulating layer, and including a first intaglio pattern, and a second metal layer disposed on a second surface of the insulating layer, and including a second intaglio pattern. The second intaglio pattern is formed so that the second metal layer has a volume corresponding to a volume of the first metal layer.

Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

Abstract: A power module includes a first substrate formed by stacking a plurality of layers in a first axis direction, a semiconductor chip electrically connected to the first substrate, a printed circuit board connected to the semiconductor chip and comprising at least one step portion with a reduced thickness compared to the surrounding area in the first axis direction, and at least one metal block mounted on the at least one step portion in the first axis direction and electrically connected to the first substrate.

Abstract: Disclosed is a battery pack including a battery cell stack, an internal connection member coupled to opposite ends of the battery cell stack from which the electrode leads protrude, and a pack frame configured to receive the battery cell stack and the internal connection member. A weld is formed at a part at which a first electrode lead and a second electrode lead protruding respectively from a first battery cell and a second battery cell of the battery cell stack, which neighbor each other, are bent in different directions and overlap each other. All battery cells constituting the battery cell stack are connected to each other in series in a zigzag fashion, and the internal connection member includes an insulation cover configured to isolate the electrode leads from the outside and a sensing member electrically connected to the weld.

Abstract: An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.

Abstract: An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to the embodiment may include a first reflective layer; an active layer disposed on the first reflective layer; an active region disposed on the active layer and having an aperture and an insulation region disposed around the aperture; and a second reflective layer disposed on the active region. The second reflective layer may include a core reflective layer disposed in a position vertically corresponding to the aperture. The embodiment may include a cladding insulation layer disposed around the core reflective layer. The horizontal cross-section of the aperture may be different from the horizontal cross-section of the core reflective layer.

Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.

Abstract: A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.