Abstract: A processor-implemented method of interlinking a first video conference system and a second video conference system for combining and transmitting voice signals of a plurality of users in a video conference system interlinking apparatus including a plurality of video sharing units including receiving second video conference data of a plurality of users from the second video conference system and transmitting voice data including combined voices of two or more users, among the transmitted second video conference data, through a single one of the plurality of video sharing units.

Abstract: Provided is a mask including a mask frame including a base part in which cell openings are defined, and a coating part surrounding edges of the cell openings, covering at least a portion of an upper surface of the base part, and including a materials that is different from that of the base part, and unit masks on the mask frame, respectively corresponding to the cell openings, including a material that is different from that of the coating part, and in which openings are defined.

Abstract: A mask assembly includes a frame including first to fourth lateral parts connected to define a frame opening, an open sheet including a body part in which sheet openings arranged in a first direction and a second direction are defined to overlap the frame opening and a connecting part protruding from the body part and at least partially overlapping the frame, and masks, each including a deposition part having deposition openings defined therein and coupling parts that protrude from the deposition part and that are spaced apart from each other with the deposition part therebetween. The connecting part includes a first connecting part and a second connecting part that overlap the frame and a third connecting part and a fourth connecting part that at least partially overlap the frame.

Abstract: A mask assembly includes an open mask including first and second open openings defined therethrough and alternately arranged in a first direction, first unit masks respectively corresponding to the first open openings, and second unit masks respectively corresponding to the second open openings. Each of the first unit masks includes a first deposition portion through which first deposition openings are defined and first and second welding portions extending from the first deposition portion to the first direction and a direction opposite to the first direction, respectively. Each of the second unit masks includes a second deposition portion through which second deposition openings are defined and third and fourth welding portions extending from the second deposition portion to a second direction and a direction opposite to the second direction.

Abstract: An apparatus for manufacturing a display device includes a mask assembly, and a deposition source that supplies a deposition material toward the mask assembly. The mask assembly includes a mask frame including a first opening, a sheet portion fixed on the mask, overlapping a portion of the first opening in a plan view, and including a plurality of second openings, a plurality of first masks corresponding to the plurality of second openings and fixed on the sheet portion, each including a plurality of third openings, and a second mask arranged on another portion of the first opening defined by an edge of the sheet portion and inner surfaces of the first opening, fixed on the mask frame, and including a plurality of fourth openings.

Abstract: An electrostatic chuck apparatus includes a base and a dielectric layer on the base. The dielectric layer includes a support surface opposite the base and a clamping electrode laterally extending along the support surface. The clamping electrode extends beyond an edge of the support surface such that the support surface is laterally recessed relative to the clamping electrode. The clamping electrode is configured to attract a substrate to the support surface by electrostatic force, and laterally extends along the support surface up to or beyond an edge of the substrate. Related electrostatic chuck assemblies, semiconductor fabricating apparatuses having the same, and plasma treatment methods using the same are also discussed.