Patents by Inventor Jun Ho Lee

Jun Ho Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260243300
    Abstract: A wheel bearing for a part-time four-wheel drive vehicle capable of switching between a two-wheel drive mode and a four-wheel drive mode may be provided. The wheel bearing includes a wheel hub to which a vehicle wheel is mounted and which rotates together with the vehicle wheel; at least one inner ring mounted to the wheel hub; an outer ring fixedly coupled to a vehicle-body-side member; a plurality of rolling elements configured to rotatably support the wheel hub and the inner ring relative to the outer ring; and a coupler mounted to the wheel hub. The coupler includes outer circumferential surface splines extending in an axial direction on an outer circumferential surface thereof, and the outer circumferential surface splines of the coupler may be configured such that a hardening heat treatment is performed at least on a portion that is engaged with a clutch member.
    Type: Application
    Filed: February 20, 2026
    Publication date: August 20, 2026
    Applicant: ILJIN GLOBAL CO.,LTD
    Inventors: Jun Ho LEE, Hee Jae YOON, Hyo Chang SEONG
  • Publication number: 20260223512
    Abstract: A light emitting display device including a bank defining a plurality of light emitting portions spaced apart from each other on a substrate, a light emitting element including a first electrode, an intermediate layer and a second electrode on the first electrode provided in each of the light emitting portions, an encapsulation layer covering the light emitting element, a touch wiring disposed on the encapsulation layer, the touch wiring including a linear portion longer than a diameter of any one of the light emitting portions or a side of any one of the light emitting portions between the plurality of light emitting portions on a plane, a light-shielding layer covering the touch wiring on the encapsulation layer, and a color filter layer disposed on the encapsulation layer corresponding to each of the light emitting portions.
    Type: Application
    Filed: June 27, 2025
    Publication date: July 30, 2026
    Inventors: Dong Chae SHIN, Jun Ho LEE, Sun Young CHOI
  • Publication number: 20260223352
    Abstract: An integrated circuit construction comprises conductive vias that are individually directly above and directly electrically coupled to individual operative transistors. Insulator islands individually extend upwardly from individual inoperative transistors. Insulating material surrounds individual of the insulator islands and individual of the conductive vias. Insulative material is directly above the insulating material. Conducting vias individually extend through the insulative material. Some of the conducting vias are directly above and directly against individual of the conductive vias. Another some of the conducting vias are directly above individual of the insulator islands. Other embodiments, including method, are disclosed.
    Type: Application
    Filed: October 22, 2025
    Publication date: July 30, 2026
    Applicant: Micron Technology, Inc.
    Inventors: Jun Ho Lee, Yen Ting Lin, Byung Yoon Kim, Vinay Nair
  • Patent number: 12686634
    Abstract: An apparatus for manufacturing a glass article includes a chamber defining an inner space that accommodates a molten salt for molding and chemical strengthening the glass article, a first electrode disposed in the inner space of the chamber and in contact with the molten salt, a second electrode disposed in the inner space of the chamber, in contact with the molten salt, and facing the first electrode, and a power supply connected to the first electrode and the second electrode.
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: July 21, 2026
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jihyun Ko, Minki Kim, Jinsu Nam, Jun Ho Lee, Yongkyu Kang, Hyunseung Seo
  • Publication number: 20260190524
    Abstract: A semiconductor package is provided. a semiconductor package comprises a package substrate, an interposer attached onto the package substrate, a first semiconductor chip attached onto the interposer by a first bonding member, a second bonding member positioned on the interposer and spaced apart from the first semiconductor chip, a cover glass positioned on the second bonding member and an encapsulant encapsulating the package substrate, the interposer, and the cover glass.
    Type: Application
    Filed: December 17, 2025
    Publication date: July 2, 2026
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Ho LEE, Sun Woo HAN
  • Publication number: 20260188035
    Abstract: A method for capturing an identification (ID) card image including determining whether an ID card within an image received via a sensor is positioned according to a pre-set guide line; acquiring an ID card image based on the guide line if it is determined that the ID card is positioned according to the pre-set guide line, inputting the ID card image into a first artificial intelligence model to determine whether the ID card contained in the ID card image corresponds to one of pre-set ID card types, determining whether user information within the ID card image is identifiable, and capturing the ID card image if it is determined that the user information within the ID card image is identifiable, and an electronic device for performing the same are disclosed.
    Type: Application
    Filed: December 17, 2025
    Publication date: July 2, 2026
    Inventors: Minjung Chung, Hyunho Cho, Kyung Yoon Kim, Jun Ho Lee, Jiwoo Jeong, Dong Hun Kang, Jayoung Seo
  • Publication number: 20260190483
    Abstract: A display device is disclosed. The display device includes a substrate and a gate driver configured to supply a scan signal to a gate line. The gate driver includes a pull-up transistor and a pull-down transistor, with at least one of the transistors including a plurality of thin film transistors connected in parallel. These thin film transistors include source electrodes, drain electrodes, a common gate electrode, and a common active layer. The common gate electrode and the common active layer extend in a first direction, while the source and drain electrodes are disposed on the common active layer and spaced apart from the common gate electrode in a second direction crossing the first direction. The common active layer includes doped regions doped with a dopant and undoped regions not doped with the dopant. The doped regions and the undoped regions alternate as the common active layer extends in the first direction. This structure enables compact integration and efficient driving of the scan signal.
    Type: Application
    Filed: November 14, 2025
    Publication date: July 2, 2026
    Applicant: LG Display Co., Ltd.
    Inventors: Jun Ho LEE, Jung Yul YANG, Dae Hwan KIM
  • Publication number: 20260190589
    Abstract: A light emitting display device may include a substrate including an active area having a hole and a non-active area outside the active area; a plurality of subpixels in the active area and spaced apart from the hole at least by a first distance, each of the plurality of subpixels including a transistor, and a light-emitting element including a first electrode connected to the transistor, a second electrode facing the first electrode, and an intermediate layer interposed between the first electrode and the second electrode; and a dam region surrounding the hole within the first distance from the hole in a plan view, the dam region including a bank material layer having an undercut structure. The dam region may include at least one light-shielding material layer.
    Type: Application
    Filed: December 29, 2025
    Publication date: July 2, 2026
    Applicant: LG Display Co., Ltd.
    Inventors: Jung Yul YANG, Jun Ho LEE, Sun Young CHOI, Jong Hoon YEO
  • Patent number: 12650368
    Abstract: A glass stress test method includes breaking a glass, analyzing a shape of a crack of a broken portion of the glass in a plan view, finding a breakage origin of the glass based on the shape of the crack in the plan view, analyzing a cross-section of the breakage origin, and calculating a stress of the glass based on a cross-sectional analysis result of the breakage origin. The stress of the glass is calculated as a value proportional to a floor constant defined by a condition of a floor surface disposed when the glass is broken.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: June 9, 2026
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Min Ki Kim, Ji Hyun Ko, Yong Kyu Kang, Jinsu Nam, Hyun Seung Seo, Jun Ho Lee
  • Publication number: 20260152654
    Abstract: An ink composition, a production method thereof, a composite prepared therefrom, and devices including the same are provide. The ink composition including a semiconductor nanoparticle and a polymerizable monomer. The semiconductor nanoparticle includes a Group 11-13-16 compound including silver, a Group 13 metal including indium and gallium, and a Group 16 element including sulfur, and the ink composition further comprises a metal halide and a first organic ligand including a compound or a moiety represented by R1—COOA, wherein R1 is a first organic group, and A represents hydrogen or a portion linked to a surface of the semiconductor nanoparticle.
    Type: Application
    Filed: December 10, 2024
    Publication date: June 4, 2026
    Inventors: Shang Hyeun PARK, Deuk Kyu MOON, Jong Hoon WON, Tae-Gon KIM, Jun Ho LEE, Deuk Seok CHUNG, Eun Seog CHO
  • Publication number: 20260123393
    Abstract: Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, an apparatus includes a semiconductive region, an insulative region that is adjacent to the semiconductive region, and a conductive line that extends across the semiconductive region and at least a portion of the insulative region. The apparatus includes a contact structure that conjoins with the conductive line and that electrically couples the conductive line with the semiconductive region. The apparatus includes a footing structure that conjoins with the conductive line and that penetrates into the insulative region to anchor the conductive line with the insulative region.
    Type: Application
    Filed: September 4, 2025
    Publication date: April 30, 2026
    Inventors: Jun Ho LEE, Byung Yoon KIM, Inchan HWANG, Russell A. BENSON
  • Publication number: 20260112681
    Abstract: A secondary battery, including an electrode assembly having a first electrode, a separator, a second electrode, a first electrode tab connected to the first electrode, and a second electrode tab connected to the second electrode, a receiving can having one open surface to accommodate the electrode assembly, the receiving can being connected to the first electrode tab, and a cap assembly sealing the one open surface of the receiving can, the cap assembly being connected to the second electrode tab, wherein the receiving can includes a tab hole on a bottom surface thereof, and wherein at least a part of the first electrode tab is inserted into the tab hole and connected to the receiving can.
    Type: Application
    Filed: March 11, 2025
    Publication date: April 23, 2026
    Inventor: Jun Ho LEE
  • Publication number: 20260107471
    Abstract: Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, an integrated assembly includes an array of semiconductive fin structures penetrating through a dielectric region. The integrated assembly includes a semiconductive moat structure along the dielectric region that includes a sidewall structure The sidewall structure includes first segments that are biased inwardly toward the array of semiconductive fin structures and second segments that are biased outwardly away from the array of semiconductive fin structures, where the first segments and second segments alternate along an edge of the dielectric region to form a crenellated profile along a surface of the sidewall structure that faces the dielectric region. The integrated assembly includes an array of conductive line structures that extend across the array of semiconductive fin structures, across the dielectric region, and across the sidewall structure.
    Type: Application
    Filed: August 20, 2025
    Publication date: April 16, 2026
    Inventors: Jun Ho LEE, Byung Yoon KIM, Kwangho AHN
  • Patent number: 12600946
    Abstract: A method for increasing dendritic cell migration ability, and a use thereof are disclosed. A method according to one aspect can increase the migration ability of mature dendritic cells and increase the induction, by dendritic cells, of inflammatory cytokine production, T lymphocyte proliferation and T lymphocyte polarization, and thus can be used for the prevention or treatment of immune-related diseases.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: April 14, 2026
    Assignee: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Dae Seog Lim, Soo-yeoun Park, Jun Ho Lee, So Yeon Choi, Ji Young Yoo, Nam Chul Jung
  • Publication number: 20260049024
    Abstract: A glass article, a method for manufacturing the glass article, and a display device and an electronic device are provided. The glass article includes an amorphous glass layer having an amorphous phase, crystal particles dispersed in the amorphous glass layer and having a crystalline phase, and chromium ions dispersed in the amorphous glass layer.
    Type: Application
    Filed: May 1, 2025
    Publication date: February 19, 2026
    Applicant: Samsung Display Co., LTD.
    Inventors: Hyun Seung SEO, Jun Ho LEE, Hyun Il CHO, Mi Jin KIM, Tae Ho AN, Sook Kyung YOU, Jeong Seok LEE
  • Publication number: 20260032915
    Abstract: Apparatus and methods are disclosed, including transistors, semiconductor devices and systems. Example semiconductor devices and methods include an isolation structure within a substrate, and two layers of different dielectric material including a first dielectric layer and a second silicon oxide layer, both layers located over the isolation structure. Examples are further shown that include a first contact and a second contact both passing through a first dielectric of the two layers with side surfaces of the first contact and the second contact surrounded by the first dielectric.
    Type: Application
    Filed: July 22, 2025
    Publication date: January 29, 2026
    Inventors: Byung Yoon Kim, Kyuseok Lee, Jun Ho Lee, Deokhan Bae, Mark Zaleski, Robert B. Kerr
  • Patent number: 12534007
    Abstract: In an embodiment a headrest position adjustment apparatus includes a fixing frame having a guide plate including a first slide hole at an upper end portion and a second slide hole at a lower end portion, wherein a rear surface portion of the fixing frame is configured to be mounted to a high-back board, a first motor mounted on the fixing frame, wherein the first motor is configured to move a headrest, a fixing guide mounted on the fixing frame, wherein the fixing guide has a pair of first guide pipes facing forward, a first slide including upper guide holes arranged on an upper position on opposite sides of the first slider and lower guide holes arranged on a lower position of the opposite sides of the first slider and into which the first guide pipes are inserted, and a second slider mounted on the headrest.
    Type: Grant
    Filed: March 22, 2024
    Date of Patent: January 27, 2026
    Assignees: Hyundai Motor Company, Kia Corporation, SEOYONCF, HYUNDAI TRANSYS INC.
    Inventors: Sang Uk Yu, Sang Ho Kim, Seung Young Lee, Tae Hoon Lee, Jun Namgoong, Yong Jun Shin, Won Kee Kim, Hyun Kim, Jun Ho Lee
  • Patent number: 12520435
    Abstract: This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: January 6, 2026
    Assignees: LX SEMICON CO., LTD., FJ COMPOSITE MATERIALS CO., LTD.
    Inventors: Jun Ho Lee, Nam Tae Cho, Eiki Tsushima
  • Publication number: 20260001803
    Abstract: A glass article comprises an amorphous glass layer having an amorphous phase, and crystal particles dispersed in the amorphous glass layer and having a crystalline phase, wherein some of the crystal particles protrude from a surface of the amorphous glass layer.
    Type: Application
    Filed: March 10, 2025
    Publication date: January 1, 2026
    Inventors: Hyun Seung SEO, Mi Jin KIM, Tae Ho AN, Sook Kyung YOU, Jeong Seok LEE, Jun Ho Lee, Hyun Il CHO
  • Patent number: 12508965
    Abstract: In an embodiment a headrest position adjustment system includes a housing mounted on a front surface portion of a high-back board, a headrest mounted on the housing, the headrest being capable of moving forward and backward, a fixing frame comprising slide holes in opposite side portions of the fixing frame, the fixing frame being mounted inside the housing, a first motor mounted on the fixing frame, the first motor having a first lead screw facing forward as an output shaft, and a side bracket disposed on each of the opposite side portions of the fixing frame and connected to the headrest, the side bracket being fastened to a slide hole such that the side bracket is capable of being moved forward and backward.
    Type: Grant
    Filed: March 21, 2024
    Date of Patent: December 30, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc., SEOYONCNF
    Inventors: Sang Uk Yu, Sang Ho Kim, Seung Young Lee, Tae Hoon Lee, Jun Namgoong, Yong Jun Shin, Won Kee Kim, Hyun Kim, Jun Ho Lee