Abstract: The present invention relates to a grinding cosmetic container, and grinds solid cosmetic contents by means of a grinding member so as to enable application of same as powdered cosmetic contents, thereby allowing cosmetic contents to be uniformly stuck to a puff and, simultaneously, allowing the cosmetic contents to be refilled and used.

Abstract: Heating apparatus includes an air inlet, a plurality of air outlets, an impeller, a motor for rotating the impeller to draw air through the air inlet, a user interface for allowing a user to select a rotational speed of the motor from a user selectable range of values, and a plurality of heater assemblies each comprising at least one positive temperature coefficient (PTC) heating element for heating air passing from the air inlet to a respective air outlet. The magnitude of a current drawn by the heater assemblies is detected, and the rotational speed of the motor is controlled independently from the rotational speed selected by the user depending on a characteristic of the current drawn by the heater assemblies.

Abstract: Heating apparatus includes an air inlet, a plurality of air outlets, an impeller, a motor for rotating the impeller to draw air through the air inlet, a user interface for allowing a user to select a rotational speed of the motor from a user selectable range of values, and a plurality of heater assemblies each comprising at least one positive temperature coefficient (PTC) heating element for heating air passing from the air inlet to a respective air outlet. The magnitude of a current drawn by the heater assemblies is detected, and the rotational speed of the motor is controlled independently from the rotational speed selected by the user depending on a characteristic of the current drawn by the heater assemblies.

Abstract: A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.

Abstract: A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.

Abstract: A method for packaging a semiconductor chip, generally comprising the following steps of: (a) forming a plurality of openings on the top surface of the conducting substrate, wherein the upper portions of the openings are formed larger than the lower portions of the openings; (b) forming insulating sections in the conducting substrate by filling an insulating material in the openings; (c) forming a plurality of leads insulated by the insulating sections by planarizing the bottom surface of the conducting substrate to expose and form planarized bottom surfaces of the insulating sections; (d) mounting a semiconductor chip on the bottom surface of the conducting substrate; (e) providing a plurality of conducting wires to electrically connect the semiconductor chip to the leads; and (f) encapsulating the semiconductor chip and the conducting wires.