Patents by Inventor Jun-Hui CHOI

Jun-Hui CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for grain boundary analysis of polycrystalline two-dimensional materials
    Patent number: 12638398
    Abstract: The present disclosure relates to a method for analyzing a grain boundary of a polycrystalline two-dimensional material including transferring a polycrystalline two-dimensional material onto a substrate for analysis including a single crystalline two-dimensional material formed on a substrate; analyzing the polycrystalline two-dimensional material; depositing a metal thin film on the polycrystalline two-dimensional material; and exfoliating the polycrystalline two-dimensional material.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: May 26, 2026
    Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jaehyun Lee, Jiyun Moon, Jun-Hui Choi, Seung-il Kim
  • METHOD FOR GRAIN BOUNDARY ANALYSIS OF POLYCRYSTALLINE TWO-DIMENSIONAL MATERIALS
    Publication number: 20230251201
    Abstract: The present disclosure relates to a method for analyzing a grain boundary of a polycrystalline two-dimensional material including transferring a polycrystalline two-dimensional material onto a substrate for analysis including a single crystalline two-dimensional material formed on a substrate; analyzing the polycrystalline two-dimensional material; depositing a metal thin film on the polycrystalline two-dimensional material; and exfoliating the polycrystalline two-dimensional material.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 10, 2023
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jaehyun LEE, Jiyun MOON, Jun-Hui CHOI, Seung-il KIM