Abstract: An electrostatic chuck and method for electrostatically clamping a working member such as a semiconductor wafer to the chuck. The elcetrostatic chuck includes at least one conductive electrode and an insulating layer for separating the conductive electrode from the working member. The insulating layer is composed of a composition containing pyrolytic boron nitiride (PBN) and a carbon dopant in an amount above 0 wt % and less than about 3 wt % such that its electrical resistivity is smaller than 10.sup.14 .OMEGA.-cm. A source of voltage is impressed across the conductive electrode to generate an electrostatic field which causes the working member to be clamped to the chuck.