Patents by Inventor Junichi Itai

Junichi Itai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296568
    Abstract: According to one embodiment, a memory device includes a first wiring extending in a first direction, and a second wiring extending in a second direction that intersects the first direction. A memory cell is between the first wiring and the second wiring and includes a resistive memory element and a switching element that are connected in series between the first wiring and the second wiring. An insulating region surrounds side surfaces of the memory cell. The insulating region includes a first insulating part adjacent to a side surface of the resistive memory element and a second insulating part adjacent to a side surface of the switching element. The second insulating part has a higher thermal conductivity than the first insulating part.
    Type: Application
    Filed: August 26, 2020
    Publication date: September 23, 2021
    Inventors: Taichi IGARASHI, Tadaomi DAIBOU, Junichi ITO, Tadashi KAI, Shogo ITAI, Toshiyuki ENDA
  • Patent number: 10991864
    Abstract: An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: April 27, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Hirotaka Obuchi, Junichi Itai
  • Patent number: 10964870
    Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: March 30, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Yosuke Taka, Tomoichiro Toyama, Junichi Itai
  • Publication number: 20210057312
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Patent number: 10861778
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: December 8, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Patent number: 10820385
    Abstract: An LED drive circuit drives an LED module. The LED module has a light-emitting diode, and an identification unit having characteristic information relating to light-emitting characteristics of the light-emitting diode. The LED drive circuit includes a detection unit and a drive circuit. The detection unit is provided for detecting characteristic information, and generates a detection signal that corresponds to the characteristic information. The drive circuit generates drive current by a drive signal supplied according to the characteristic information based on the detection signal, and supplies the drive current to drive the light-emitting diode.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: October 27, 2020
    Assignee: Rohm Co., Ltd.
    Inventors: Kenichi Fukumoto, Koji Katsura, Ryosuke Kanemitsu, Junichi Itai, Nobuaki Matsui, Seiji Nakashima, Kouji Miyamoto
  • Patent number: 10784420
    Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 22, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Hirotaka Obuchi, Junichi Itai
  • Publication number: 20200287114
    Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.
    Type: Application
    Filed: May 27, 2020
    Publication date: September 10, 2020
    Inventors: Yosuke TAKA, Tomoichiro TOYAMA, Junichi ITAI
  • Patent number: 10700250
    Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 30, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yosuke Taka, Tomoichiro Toyama, Junichi Itai
  • Publication number: 20200052173
    Abstract: An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Inventors: Hirotaka Obuchi, Junichi Itai
  • Publication number: 20190393139
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 26, 2019
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Publication number: 20190387591
    Abstract: An LED drive circuit drives an LED module. The LED module has a light-emitting diode, and an identification unit having characteristic information relating to light-emitting characteristics of the light-emitting diode. The LED drive circuit includes a detection unit and a drive circuit. The detection unit is provided for detecting characteristic information, and generates a detection signal that corresponds to the characteristic information. The drive circuit generates drive current by a drive signal supplied according to the characteristic information based on the detection signal, and supplies the drive current to drive the light-emitting diode.
    Type: Application
    Filed: January 31, 2018
    Publication date: December 19, 2019
    Applicant: ROHM CO., LTD.
    Inventors: Kenichi FUKUMOTO, Koji Katsura, Ryosuke Kanemitsu, Junichi ITAI, Nobuaki MATSUI, Seiji NAKASHIMA, Kouji Miyamoto
  • Patent number: 10446475
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 15, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Publication number: 20190229247
    Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip (30), which has a front (30A) and a back (30B) facing opposite sides in the thickness direction z, and a first back electrode (302A) provided at the back surface (30B); a first terminal (201) in conduction with the first back electrode (302A); and a first bonding layer (311), configured to bond the first back electrode (302A) and the first terminal 201; wherein the composition of the first bonding layer (311) includes a metal eutectic composition containing Au, and when the LED chip (30) is viewed in the thickness direction z, a first bent portion (311A) which is recessed toward the inner side of the periphery of the first back electrode (302A) is formed in the first bonding layer (311).
    Type: Application
    Filed: October 19, 2018
    Publication date: July 25, 2019
    Inventors: Yosuke TAKA, Tomoichiro TOYAMA, Junichi ITAI
  • Patent number: 10305009
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: May 28, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Publication number: 20190157526
    Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.
    Type: Application
    Filed: January 29, 2019
    Publication date: May 23, 2019
    Inventors: Hirotaka OBUCHI, Junichi ITAI
  • Patent number: 10230028
    Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicon.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: March 12, 2019
    Assignee: Rohm Co., Ltd.
    Inventors: Hirotaka Obuchi, Junichi Itai
  • Publication number: 20180277724
    Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicon.
    Type: Application
    Filed: January 2, 2018
    Publication date: September 27, 2018
    Inventors: Hirotaka OBUCHI, Junichi ITAI
  • Publication number: 20180218967
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Patent number: 9953901
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: April 24, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada