Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: An LED drive circuit drives an LED module. The LED module has a light-emitting diode, and an identification unit having characteristic information relating to light-emitting characteristics of the light-emitting diode. The LED drive circuit includes a detection unit and a drive circuit. The detection unit is provided for detecting characteristic information, and generates a detection signal that corresponds to the characteristic information. The drive circuit generates drive current by a drive signal supplied according to the characteristic information based on the detection signal, and supplies the drive current to drive the light-emitting diode.

Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.

Abstract: An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: An LED drive circuit drives an LED module. The LED module has a light-emitting diode, and an identification unit having characteristic information relating to light-emitting characteristics of the light-emitting diode. The LED drive circuit includes a detection unit and a drive circuit. The detection unit is provided for detecting characteristic information, and generates a detection signal that corresponds to the characteristic information. The drive circuit generates drive current by a drive signal supplied according to the characteristic information based on the detection signal, and supplies the drive current to drive the light-emitting diode.

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip (30), which has a front (30A) and a back (30B) facing opposite sides in the thickness direction z, and a first back electrode (302A) provided at the back surface (30B); a first terminal (201) in conduction with the first back electrode (302A); and a first bonding layer (311), configured to bond the first back electrode (302A) and the first terminal 201; wherein the composition of the first bonding layer (311) includes a metal eutectic composition containing Au, and when the LED chip (30) is viewed in the thickness direction z, a first bent portion (311A) which is recessed toward the inner side of the periphery of the first back electrode (302A) is formed in the first bonding layer (311).

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.

Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicon.