Abstract: A method of adjusting a substrate transfer position is provided in a substrate processing system including: a batch processing section; a single-substrate processing section; and a substrate standby section configured to cause a substrate to be transferred from the batch processing section to the single-substrate processing section to wait. The substrate standby section includes: a delivery table; and a first transfer robot including a first holding section. The single-substrate processing section includes a second transfer robot including a second holding section. The method includes: acquiring, by the second holding section, the substrate from the delivery table; detecting a shift amount of the substrate with respect to a reference position while the second holding section holds the substrate acquired from the delivery table; and correcting a horizontal position when the first holding section mounts the substrate on the delivery table, based on the detected shift amount.

Abstract: An apparatus for processing a substrate of the present invention comprises a holder holding a substrate, a supply pipe being supplied with a processing solution from a first end and supplying the processing solution to the substrate from a second end, a first temperature controller having a first temperature controlled water circulated inside which controls a first temperature around the second end of the supply pipe and a second temperature controller having a second temperature controlled water drained from the first temperature controller circulated inside, which controls a second temperature around the first end of the supply pipe. With such a configuration, the temperature controlled water used for controlling the temperature of the processing solution just before its application onto the substrate can be recycled for controlling the temperature of the processing solution just after being supplied to a supply pipe.

Abstract: An apparatus for processing a substrate of the present invention comprises a holder holding a substrate, a supply pipe being supplied with a processing solution from a first end and supplying the processing solution to the substrate from a second end, a first temperature controller having a first temperature controlled water circulated inside which controls a first temperature around the second end of the supply pipe and a second temperature controller having a second temperature controlled water drained from the first temperature controller circulated inside, which controls a second temperature around the first end of the supply pipe. With such a configuration, the temperature controlled water used for controlling the temperature of the processing solution just before its application onto the substrate can be recycled for controlling the temperature of the processing solution just after being supplied to a supply pipe.