Patents by Inventor Junichi Jimi

Junichi Jimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
    Patent number: 7573280
    Abstract: A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: August 11, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Junichi Jimi
  • Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
    Patent number: 7394270
    Abstract: The semiconductor device according to an aspect of the present invention is a semiconductor device having an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: July 1, 2008
    Assignee: NEC Electronics Corporation
    Inventor: Junichi Jimi
  • Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
    Publication number: 20080149927
    Abstract: A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
    Type: Application
    Filed: February 12, 2008
    Publication date: June 26, 2008
    Applicant: NEC Electronics Corporation
    Inventor: Junichi Jimi
  • Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
    Publication number: 20060043992
    Abstract: The semiconductor device according to an aspect of the present invention is a semiconductor device having an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
    Type: Application
    Filed: August 1, 2005
    Publication date: March 2, 2006
    Applicant: NEC Electronics Corporation
    Inventor: Junichi Jimi