Patents by Inventor Junichi KITAYAMA

Junichi KITAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170213766
    Abstract: A manufacturing method of a semiconductor device forms grooves on a surface side of a semiconductor substrate and thereafter performs grinding from a back side of the semiconductor substrate until a ground face reaches the grooves. Thereafter, a back electrode is formed on the back of the semiconductor substrate that is separated by the grinding.
    Type: Application
    Filed: November 22, 2016
    Publication date: July 27, 2017
    Inventor: Junichi KITAYAMA