Abstract: It is possible to provide a semiconductor device which can be obtained at a high reliability by warping an insulating substrate stably into a convex shape while ensuring a close contact between a cooling member and the insulating substrate. The semiconductor device includes an insulating substrate, a semiconductor element disposed on a first surface of the insulating substrate, a case connected to the insulating substrate, and a resin filled inside the case. Assuming that the thickness of the insulating substrate is denoted by t1, the thickness of the resin is denoted by t2, the linear expansion coefficient of the insulating substrate is denoted by ?1, and the linear expansion coefficient of the resin is denoted by ?2, the relationship therebetween satisfies t2?t1 and ?2??1, and a second surface of the insulating substrate opposite to the first surface thereof is warped into a convex shape.

Abstract: It is possible to provide a semiconductor device which can be obtained at a high reliability by warping an insulating substrate stably into a convex shape while ensuring a close contact between a cooling member and the insulating substrate. The semiconductor device includes an insulating substrate, a semiconductor element disposed on a first surface of the insulating substrate, a case connected to the insulating substrate, and a resin filled inside the case. Assuming that the thickness of the insulating substrate is denoted by t1, the thickness of the resin is denoted by t2, the linear expansion coefficient of the insulating substrate is denoted by ?1, and the linear expansion coefficient of the resin is denoted by ?2, the relationship therebetween satisfies t2?t1 and ?2??1, and a second surface of the insulating substrate opposite to the first surface thereof is warped into a convex shape.

Abstract: Equipment of the invention provides ultrasonic flaw detection equipment using a volume focusing flaw detection method, the ultrasonic flaw detection equipment described below. That is, this equipment performs internal flaw detection of a material being tested, the material having a virtually circular cross-sectional shape, and transducers 1 . . . 1 are arranged in an arc along a circle exhibited by the material being tested. Array probes 10 . . . 10 are disposed so as to surround the material being tested. An exciting unit enables flaw detection of the material being tested to be performed by vertical and oblique flaw detection methods.

Abstract: Equipment of the invention uses a volume focusing flaw detection method. In a sectional view of a material m being tested, a plurality of transducers 1 . . . 1 of one of array probes 10 are arranged along one side of a rectangular shape of the material being tested, and a plurality of transducers 1 . . . 1 of the other of the array probes 10 are arranged along one of sides adjacent to the one side.

Abstract: Equipment of the invention provides ultrasonic flaw detection equipment using a volume focusing flaw detection method, the ultrasonic flaw detection equipment described below. That is, this equipment performs internal flaw detection of a material being tested, the material having a virtually circular cross-sectional shape, and transducers 1 . . . 1 are arranged in an arc along a circle exhibited by the material being tested. Array probes 10 . . . 10 are disposed so as to surround the material being tested. An exciting unit enables flaw detection of the material being tested to be performed by vertical and oblique flaw detection methods.

Abstract: Equipment of the invention uses a volume focusing flaw detection method. In a sectional view of a material m being tested, a plurality of transducers 1 . . . 1 of one of array probes 10 are arranged along one side of a rectangular shape of the material being tested, and a plurality of transducers 1 . . . 1 of the other of the array probes 10 are arranged along one of sides adjacent to the one side.

Abstract: In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (6) and (7). The semiconductor device (1) also has a heat sink (8). The members (2) to (8) are sealed with a plastic package (10). The leads (4) are exposed outward. Each of the end leads (4a) to (4d) has a wide first lead portion, a narrow second lead portion, a third lead portion to be inserted into an external substrate, and a protruding gap-controlling portion (9) for keeping the gap between the semiconductor device (1) and the external substrate constant. Because the heat resistance from the leads (4) to the plastic package (10) increases, the temperature-rise property of the lead is improved so that the solderability is improved.

Abstract: In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (6) and (7). The semiconductor device (1) also has a heat sink (8). The members (2) to (8) are sealed with a plastic package (10). The leads (4) are exposed outward. Each of the end leads (4a) to (4d) has a wide first lead portion, a narrow second lead portion, a third lead portion to be inserted into an external substrate, and a protruding gap-controlling portion (9) for keeping the gap between the semiconductor device (1) and the external substrate constant. Because the heat resistance from the leads (4) to the plastic package (10) increases, the temperature-rise property of the lead is improved so that the solderability is improved.

Abstract: A disc cartridge has a casing having first and second apertures and first and second shutters slidably mounted to the casing for selectively opening and closing the first and second apertures. First and second shutter openers are respectively connected to the first and second shutters. Only the first aperture is opened using the first shutter opener when the disc cartridge is loaded in a standard specifications or existing recording and/or reproducing apparatus. When the disc cartridge is loaded in an optional specifications apparatus, both the first and second shutter openers are used to open the first and second apertures, respectively. A disc cartridge compatible with both new plural head recording and reproducing apparatuses and existing single head recording and reproducing apparatuses is thus provided while offering improved resistance to penetration of dust and other foreign matter into the casing by opening only the aperture(s) required for head insertion.