Patents by Inventor Junichi Nakao

Junichi Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240273711
    Abstract: An image analysis apparatus according to an embodiment of the present invention includes: a processor; and a memory storing program instructions that cause the processor to: determine a shape of a particle included in a particle image that is extracted from an image of an object, so that an OK particle image which is a particle image of an OK particle that satisfies a predetermined standard for shape and a provisional NG particle image which is a particle image of a provisional NG particle that does not satisfy the predetermined standard, are obtained; generate a pseudo image using a generative model; and determine whether the provisional NG image and the pseudo image are similar, wherein in a case where the provisional NG image and the pseudo image are determined to be similar, the provisional NG particle is determined as including an OK particle.
    Type: Application
    Filed: April 24, 2024
    Publication date: August 15, 2024
    Inventors: Yoshishige OKUNO, Eriko TAKEDA, Junichi SHIBUYA, Yuki NAKAO, Kenji OGAWA
  • Publication number: 20230140068
    Abstract: The present invention is a polyester elastomer resin composition that has excellent extrusion moldability and surface smoothness even in a thin shape, while maintaining mechanical characteristics, and that is halogen-free and has excellent flame retardancy as well as heat aging resistance and hydrolysis resistance.
    Type: Application
    Filed: February 24, 2021
    Publication date: May 4, 2023
    Applicant: TOYOBO CO., LTD.
    Inventors: Yuki TAMASHIRO, Junichi NAKAO
  • Patent number: 10442234
    Abstract: Provided is a booklet finishing device including: a frame; a first pressing unit and a second pressing unit which are configured to move relative to each other in a thickness direction of the booklet and configured to press the front surface and back surface of the booklet respectively; a forming roller configured to press the spine portion; and a forming roller moving unit for moving the forming roller along the spine portion. The first pressing unit includes: a first movable component; and a first guide component having a plate-shape. A surface of the first guide component facing the second pressing unit includes: a first guide surface; a first contact surface; and a first corner-forming end portion.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: October 15, 2019
    Assignees: HITACHI METALS, LTD., Hitachi Metals Precision, Ltd.
    Inventors: Makoto Tago, Junichi Nakao
  • Publication number: 20190054751
    Abstract: Provided is a booklet finishing device including: a frame; a first pressing unit and a second pressing unit which are configured to move relative to each other in a thickness direction of the booklet and configured to press the front surface and back surface of the booklet respectively; a forming roller configured to press the spine portion; and a forming roller moving unit for moving the forming roller along the spine portion. The first pressing unit includes: a first movable component; and a first guide component having a plate-shape. A surface of the first guide component facing the second pressing unit includes: a first guide surface; a first contact surface; and a first corner-forming end portion.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 21, 2019
    Applicants: HITACHI METALS, LTD., Hitachi Metals Precision, Ltd.
    Inventors: Makoto TAGO, Junichi NAKAO
  • Patent number: 10196514
    Abstract: The present invention provides a thermoplastic polyester elastomer composition which is flexible and exhibits excellent thermal aging resistance and water resistance. According to the present invention, there is provided a thermoplastic polyester elastomer composition wherein, to 100 parts by mass in total of a thermoplastic polyester elastomer (A) and a modified hydrogenated styrene-type elastomer (B), 0.1 to 10 part (s) by mass of a carbodiimide compound (C), 0.01 to 5 part (s) by mass of an antioxidant of a hindered phenol type (D) and 0.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: February 5, 2019
    Assignee: TOYOBO CO., LTD.
    Inventors: Tadamine Ohashi, Yasuto Fujii, Junichi Nakao
  • Publication number: 20170130046
    Abstract: The present invention provides a thermoplastic polyester elastomer composition which is flexible and exhibits excellent thermal aging resistance and water resistance. According to the present invention, there is provided a thermoplastic polyester elastomer composition wherein, to 100 parts by mass in total of a thermoplastic polyester elastomer (A) and a modified hydrogenated styrene-type elastomer (B), 0.1 to 10 part (s) by mass of a carbodiimide compound (C), 0.01 to 5 part (s) by mass of an antioxidant of a hindered phenol type (D) and 0.
    Type: Application
    Filed: June 17, 2015
    Publication date: May 11, 2017
    Applicant: TOYOBO CO., LTD.
    Inventors: Tadamine OHASHI, Yasuto FUJII, Junichi NAKAO
  • Patent number: 9006881
    Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Fukuyoshi, Junichi Nakao, Yoshiki Endo, Eitaro Miyake
  • Publication number: 20140284786
    Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.
    Type: Application
    Filed: September 5, 2013
    Publication date: September 25, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Fukuyoshi, Junichi Nakao, Yoshiki Endo, Eitaro Miyake
  • Publication number: 20140191638
    Abstract: Electronic device includes main body, cover having through hole and covering at least part of main body, fixing mechanism fixing cover to main body, and waterproof mechanism draining water to outside, water having entered into gap between cover and main body. Fixing mechanism includes rotating knob provided in main body and inserted into through hole when cover is fixed to main body, protruding portion moved by rotation of rotating knob, engaging portion provided inside cover and engaging with protruding portion when cover is fixed to main body, and recess portion provided in main body and accommodating engaging portion when cover is fixed to main body. Waterproof mechanism includes groove portion provided in main body or cover, extending toward outer edge direction of cover, and coming into communication with recess portion when cover is fixed to main body.
    Type: Application
    Filed: January 9, 2013
    Publication date: July 10, 2014
    Applicant: NEC CASIO MOBILE COMMUNICATIONS, LTD.
    Inventors: Junichi NAKAO, Shinobu HOSONO
  • Patent number: 8587105
    Abstract: A semiconductor device includes a first semiconductor chip, a buffer body, and a terminal lead. The first semiconductor chip includes a first electrode and a second electrode provided on a side opposite to the first electrode. The first semiconductor chip is configured to allow a current to flow between the first electrode and the second electrode. The buffer body includes a lower metal foil, a ceramic piece, and an upper metal foil. The lower metal foil is electrically connected to the second electrode. The ceramic piece is provided on the second electrode with the lower metal foil interposed. The upper metal foil is provided on a side of the ceramic piece opposite to the lower metal foil to be electrically connected to the lower metal foil. The terminal lead has one end provided on the upper metal foil and electrically connected to the upper metal foil.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: November 19, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Junichi Nakao, Hiroshi Fukuyoshi
  • Patent number: 8564945
    Abstract: A slide type electronic apparatus which can prevent internal structure such as a slide mechanism from being visually recognized from a gap between two cases and suppress dirt, dust and the like invading from the gap is provided. A slide type electronic apparatus according to the present invention includes: two cases; slide means, which is arranged between the two cases, for connecting the two cases in a manner that the two cases can slide each other; and covering means, which is arranged in one of the cases, for hiding a gap formed between the two cases at least at a time of an opened state in which an overlap of the two cases becomes smallest.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: October 22, 2013
    Assignee: NEC Corporation
    Inventors: Junichi Nakao, Hiroshi Yamada, Toshiki Yamanaka
  • Patent number: 8554288
    Abstract: A front case at a display section side of frame shape is formed of metal material having strength and a bathtub-shaped draw frame formed by drawing metal plate is fixed at the external side of the front case at the display section side by heat adhesive to be integral with the front case at the display section side. Two L-shaped frames formed by bending metal plate materials are fixed at the internal side of the front case at the display section side by two heat adhesives to be integral with the front case at the display section side. The front case at the display section side, the two L-shaped frames, and the bathtub-shaped draw frame are integral with each other to have sandwich structure.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: October 8, 2013
    Assignee: NEC Corporation
    Inventors: Junichi Nakao, Yasuyuki Honma
  • Patent number: 8519265
    Abstract: According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: August 27, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Junichi Nakao, Hiroshi Fukuyoshi
  • Publication number: 20130069215
    Abstract: A semiconductor device includes a first semiconductor chip, a buffer body, and a terminal lead. The first semiconductor chip includes a first electrode and a second electrode provided on a side opposite to the first electrode. The first semiconductor chip is configured to allow a current to flow between the first electrode and the second electrode. The buffer body includes a lower metal foil, a ceramic piece, and an upper metal foil. The lower metal foil is electrically connected to the second electrode. The ceramic piece is provided on the second electrode with the lower metal foil interposed. The upper metal foil is provided on a side of the ceramic piece opposite to the lower metal foil to be electrically connected to the lower metal foil. The terminal lead has one end provided on the upper metal foil and electrically connected to the upper metal foil.
    Type: Application
    Filed: March 19, 2012
    Publication date: March 21, 2013
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: JUNICHI NAKAO, HIROSHI FUKUYOSHI
  • Publication number: 20130069217
    Abstract: According to one embodiment, a semiconductor device includes a substrate, a semiconductor chip mounted on the substrate, an electrode electrically connected to the semiconductor chip, an electrode terminal having a first terminal at one end portion and a second terminal at the other end portion, and a case covering the substrate, the electrode, the first terminal and the second terminal, wherein the first terminal and the second terminal are bended to direct to a center portion and to be opposed each other in the case, and the first terminal and the second terminal are close to each other to be soldered with the electrode.
    Type: Application
    Filed: March 15, 2012
    Publication date: March 21, 2013
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Junichi NAKAO
  • Patent number: 8238843
    Abstract: A strap attaching section of a folding portable apparatus includes a recessed section arranged on a hinge section of a case configuring the portable apparatus, a strap holder stored in the recessed section, and a coupler for coupling the strap holder and the hinge section. The coupler includes a first pin hole which penetrates the strap holder, a second pin hole formed on the hinge section, a groove formed on an outer surface of the hinge section, and a pin. The groove is provided with a first region whereupon one end of the second pin hole opens, and a second region continued to the first region. A first portion of the pin extends through the first and second pin holes, and a second portion of the pin is arranged in the second region in the groove. A cover is removably attached to the case to cover the groove.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: August 7, 2012
    Assignee: Nec Corporation
    Inventors: Junichi Nakao, Toshiki Yamanaka, Yasuyuki Homma
  • Patent number: 8180413
    Abstract: An upper case of the display section includes a first connecting portion having a cylindrical hole, into which an inner cylinder of a dummy hinge composed of two cylindrical portions having the same axis and different diameters is inserted rotatably, wherein the first connecting portion protrudes from an end of the upper case. An upper case of the keybutton section includes a second connecting portion located, along a hinge axis, on the center side of the first connecting portion, and having a cylindrical hole into which an outer cylindrical portion of the dummy hinge is inserted unrotatably, wherein the second connecting portion protrudes from an end of the upper case. The hinge structure comprises a stopper for fixing the dummy hinge, which can be inserted as the dummy hinge is buried in the cylindrical hole, with the inner cylindrical portion inserted into the cylindrical hole of the first connecting portion.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: May 15, 2012
    Assignee: NEC Corporation
    Inventors: Junichi Nakao, Yasuyuki Honma
  • Publication number: 20120106102
    Abstract: A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part.
    Type: Application
    Filed: January 9, 2012
    Publication date: May 3, 2012
    Inventors: Junichi NAKAO, Hiroyasu YAMADA
  • Patent number: 8102661
    Abstract: A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: January 24, 2012
    Assignee: NEC Corporation
    Inventors: Junichi Nakao, Hiroyasu Yamada
  • Publication number: 20110149492
    Abstract: A slide type electronic apparatus which can prevent internal structure such as a slide mechanism from being visually recognized from a gap between two cases and suppress dirt, dust and the like invading from the gap is provided. A slide type electronic apparatus according to the present invention includes: two cases; slide means, which is arranged between the two cases, for connecting the two cases in a manner that the two cases can slide each other; and covering means, which is arranged in one of the cases, for hiding a gap formed between the two cases at least at a time of an opened state in which an overlap of the two cases becomes smallest.
    Type: Application
    Filed: September 15, 2009
    Publication date: June 23, 2011
    Inventors: Junichi Nakao, Hiroshi Yamada, Toshiki Yamanaka