Patents by Inventor Junichi OKAZAKI

Junichi OKAZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154041
    Abstract: A change in electrical characteristics in a semiconductor device including an oxide semiconductor film is inhibited, and the reliability is improved. The semiconductor device includes a gate electrode, a first insulating film over the gate electrode, an oxide semiconductor film over the first insulating film, a source electrode electrically connected to the oxide semiconductor film, a drain electrode electrically connected to the oxide semiconductor film, a second insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, a first metal oxide film over the second insulating film, and a second metal oxide film over the first metal oxide film. The first metal oxide film contains at least one metal element that is the same as a metal element contained in the oxide semiconductor film. The second metal oxide film includes a region where the second metal oxide film and the first metal oxide film are mixed.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 9, 2024
    Inventors: Shunpei YAMAZAKI, Junichi KOEZUKA, Kenichi OKAZAKI, Masami JINTYOU
  • Publication number: 20240149660
    Abstract: A drive unit for a vehicle may include a motor, a casing accommodating the motor, an electric pump unit attached to a lower part of the casing and configured to circulate heat medium within the casing and a filter unit attached to the lower part of the casing and configured to filter the heat medium. At least a part of the electric pump unit and at least a part of the filter unit each protrude outside the casing. Outside the casing, the filter unit is adjacent to the electric pump unit from a front in the vehicle.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hideaki Miyazono, Junya Kobayashi, Junichi Deguchi, Hironori Asaoka, Kei Ohta, Sho Okazaki
  • Patent number: 11961918
    Abstract: A semiconductor device which has favorable electrical characteristics, a method for manufacturing a semiconductor device with high productivity, and a method for manufacturing a semiconductor device with a high yield are provided.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: April 16, 2024
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasutaka Nakazawa, Yukinori Shima, Kenichi Okazaki, Junichi Koezuka, Shunpei Yamazaki
  • Publication number: 20240113229
    Abstract: To reduce defects in an oxide semiconductor film in a semiconductor device. To improve electrical characteristics of and reliability in the semiconductor device including an oxide semiconductor film. A method for manufacturing a semiconductor device includes the steps of forming a gate electrode and a gate insulating film over a substrate, forming an oxide semiconductor film over the gate insulating film, forming a pair of electrodes over the oxide semiconductor film, forming a first oxide insulating film over the oxide semiconductor film and the pair of electrodes by a plasma CVD method in which a film formation temperature is 280° C. or higher and 400° C. or lower, forming a second oxide insulating film over the first oxide insulating film, and performing heat treatment at a temperature of 150° C. to 400° C. inclusive, preferably 300° C. to 400° C. inclusive, further preferably 320° C. to 370° C. inclusive.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Junichi KOEZUKA, Yukinori SHIMA, Suzunosuke HIRAISHI, Kenichi OKAZAKI
  • Publication number: 20240087929
    Abstract: Described herein is a technique capable of detecting a substrate state without contacting the substrate. According to one aspect of the technique, there is provided (a) loading a substrate retainer, where a plurality of substrates is placed, into a reaction tube; (b) processing the plurality of the substrates by supplying a gas into the reaction tube; (c) unloading the substrate retainer out of the reaction tube after the plurality of the substrates is processed; and (d) detecting the plurality of the substrates placed on the substrate retainer after the substrate retainer is rotated by a first angle with respect to a transferable position, wherein the plurality of the substrates is transferable to/from the substrate retainer in the transferable position.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Tomoyuki MIYADA, Hajime ABIKO, Junichi KAWASAKI, Tadashi OKAZAKI
  • Publication number: 20240079502
    Abstract: A semiconductor device with favorable electrical characteristics is to be provided. A highly reliable semiconductor device is to be provided. A semiconductor device with lower power consumption is to be provided. The semiconductor device includes a gate electrode, a first insulating layer over the gate electrode, a metal oxide layer over the first insulating layer, a pair of electrodes over the metal oxide layer, and a second insulating layer over the pair of electrodes. The first insulating layer includes a first region and a second region. The first region has a region being in contact with the metal oxide layer and containing more oxygen than the second region. The second region has a region containing more nitrogen than the first region. The metal oxide layer has at least a concentration gradient of oxygen in a thickness direction, and the concentration gradient becomes high on a first region side and on a second region side.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Inventors: Junichi KOEZUKA, Kenichi OKAZAKI, Yukinori SHIMA, Yasutaka NAKAZAWA, Yasuharu HOSAKA, Shunpei YAMAZAKI
  • Patent number: 10030879
    Abstract: A remote control device includes a flat, plate-like display to display a state of settings of the air-conditioning apparatus or a control command; a touch panel provided on or under the display to receive input of a control command for the air-conditioning apparatus through detection of a change in an electric signal, the change occurring when a display position of the display is touched; a transmitter to transmit to the air-conditioning apparatus a signal of the control command input through the touch panel; and a start/stop button provided at a position different from the touch panel and configured to trigger start of operation of or stop of operation of the air-conditioning apparatus.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: July 24, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Junichi Okazaki, Hideki Takahara, Jiro Nakasu, Miho Ishikawa, Hidetoshi Hatta
  • Patent number: 9972595
    Abstract: A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 15, 2018
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Wei Chen, Junichi Okazaki, Nanako Maeda
  • Publication number: 20170336083
    Abstract: The air-conditioning-apparatus indoor unit includes a main body that has an air inlet and an air outlet that accommodates a heat exchanger and a fan, left-right deflectors that are arranged in the air outlet and are configured to change the direction of an air flow from the air outlet in a left-right direction, up-down deflectors that are arranged in the air outlet and are configured to change the direction of the air flow from the air outlet in an up-down direction, the infrared sensor disposed at one end in the left-right direction of the front surface of the main body, and a large air flow control plate, a small air flow control plate, and an upper air flow control plate that are arranged between the infrared sensor and one end of the left-right deflector close to the infrared sensor and that control the air flow from the air outlet.
    Type: Application
    Filed: March 2, 2015
    Publication date: November 23, 2017
    Inventors: Mitsuhiro SHIROTA, Junichi OKAZAKI, Nobutaka TANABE, Seiji HIRAKAWA
  • Patent number: 9362249
    Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: June 7, 2016
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Kazuhiko Yasuhara, Nanako Maeda, Junichi Okazaki, Jun Chiba, Wei Chen, Yuki Antoku
  • Publication number: 20160093586
    Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.
    Type: Application
    Filed: February 11, 2015
    Publication date: March 31, 2016
    Inventors: Kazuhiko YASUHARA, Nanako MAEDA, Junichi OKAZAKI, Jun CHIBA, Wei CHEN, Yuki ANTOKU
  • Publication number: 20160041742
    Abstract: A remote control device includes a display unit configured to display various screens including at least one main screen indicating an operating state of an apparatus to be operated, a touch panel disposed over the display unit, and a controller configured to cause at least one custom button to be displayed on the main screen along with the operating state. The custom button is assigned with one of a plurality of functions of the apparatus in accordance with a user operation.
    Type: Application
    Filed: July 31, 2015
    Publication date: February 11, 2016
    Inventors: Hideki TAKAHARA, Junichi OKAZAKI, Jiro NAKASU, Hidetoshi HATTA, Miho ISHIKAWA
  • Publication number: 20160033156
    Abstract: A remote control device includes a flat, plate-like display to display a state of settings of the air-conditioning apparatus or a control command; a touch panel provided on or under the display to receive input of a control command for the air-conditioning apparatus through detection of a change in an electric signal, the change occurring when a display position of the display is touched; a transmitter to transmit to the air-conditioning apparatus a signal of the control command input through the touch panel; and a start/stop button provided at a position different from the touch panel and configured to trigger start of operation of or stop of operation of the air-conditioning apparatus.
    Type: Application
    Filed: July 30, 2015
    Publication date: February 4, 2016
    Inventors: Junichi OKAZAKI, Hideki TAKAHARA, Jiro NAKASU, Miho ISHIKAWA, Hidetoshi HATTA
  • Publication number: 20140302317
    Abstract: An object is to provide a bonding wire for a high-speed signal line, formed by an Ag—Pd—Pt three-element alloy or an Ag—Pd—Pt ternary alloy, that is able to transmit a stable super-high frequency signal in a several GHz band, and that does not have a strong silver sulfide (Ag2S) film even when an unstable silver sulfide layer is formed on the surface of the bonding wire. Provided is the bonding wire for the high-speed signal line formed by a three-element alloy containing 0.8 to 2.5 mass % of palladium (Pd), 0.1 to 0.7 mass % of platinum (Pt), and a balance being silver (Ag) with purity of 99.99 mass % or more, or a ternary alloy obtained by adding a trace element to the three-element alloy, in which cross section of the bonding wire is formed by a skin film and a core, and in which a surface segregation layer containing highly-concentrated silver (Ag) is present in the skin film of the silver alloy.
    Type: Application
    Filed: December 27, 2013
    Publication date: October 9, 2014
    Applicant: TANAKA DENSHI KOGYO K.K.
    Inventors: Yuki ANTOKU, Kazuhiko YASUHARA, Jun CHIBA, Wei CHEN, Junichi OKAZAKI, Nanako MAEDA