Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.

Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

Abstract: A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12).

Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.

Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

Abstract: A movable table for supporting a work piece is allowed to move on the same plane in arbitrary directions through a table holding mechanism. Also, a feed within the same plane is supplied to the movable table by the electromagnetic driving means. Further, the movable table is stopped by an electromagnetic braking mechanism at an arbitrary position within the same plane. The electromagnetic driving means generates a feed to the movable table by a mutual magnetic effect between driven magnets and driving coils. The electromagnetic braking mechanism includes braking magnets and a nonmagnetic and conductive braking plate. A pair of the braking magnets and braking plate generates braking force by a magnetic effect between a magnetic force by an eddy current generated in the braking plate in accordance with the movement of the movable table and a magnetic force of the braking magnets.

Abstract: A movable table for supporting a work piece is allowed to move on the same plane in arbitrary directions through a table holding mechanism. Also, a feed within the same plane is supplied to the movable table by the electromagnetic driving means. Further, the movable table is stopped by an electromagnetic braking mechanism at an arbitrary position within the same plane. The electromagnetic driving means generates a feed to the movable table by a mutual magnetic effect between driven magnets and driving coils. The electromagnetic braking mechanism includes braking magnets and a nonmagnetic and conductive braking plate. A pair of the braking magnets and braking plate generates braking force by a magnetic effect between a magnetic force by an eddy current generated in the braking plate in accordance with the movement of the movable table and a magnetic force of the braking magnets.

Abstract: A first electromagnetic induction pump is disposed in a first reservoir, and a second electromagnetic induction pump is disposed in a second, independent, reservoir. Each reservoir is adapted to contain molten brazing filler metal. The electromagnetic induction pumps are effective to eject the brazing filler metal upward through wave forming portions into contact with an underside of a workpiece being conveyed along a workpiece conveyance path. The second reservoir is disposed downstream of the first reservoir in the direction of conveyance. At least one of the first and second reservoirs include a height adjusting device which permits adjusting the relative heights of the wave forming portions to adapt to the needs of the workpiece. The apparatus may be adapted to contain an intermediate space and an intermediate processing device between the reservoirs.

Abstract: A first electromagnetic induction pump system includes a first plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The first plurality of electromagnetic induction pumps extend vertically along a first vertical plate portion at a workpiece inlet side of a single reservoir. A second electromagnetic induction pump system includes a second plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The second plurality of electromagnetic induction pumps extend vertically extends along a second vertical plate portion at the workpiece outlet side of the reservoir. Brazing filler metal is ejected upward in waves by the electromagnetic induction pump systems to braze workpieces carried by the ejected waves into and out of the device.

Abstract: A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.