Abstract: There are provided a plurality of radio devices detecting an interference source signal transmitted by an interference source and generating pieces of air time information showing whether the interference source signal exists or not for each predetermined time unit; and an aggregation device estimating air time of the interference source by acquiring the pieces of air time information from the plurality of radio devices and aggregating/integrating the acquired pieces of air time information for each predetermined unit time, matching timings.

Abstract: A plurality of access points configured to communicate with a subordinate wireless LAN terminal, an information collecting device configured to collect a frame respectively transmitted and received between the plurality of access points and the wireless LAN terminal, and extract information on communication quality of an access point of the plurality of access points from a header of the frame, and an information collecting server configured to acquire the information on the communication quality of the access point from the information collecting device, analyze the information to determine whether the communication quality is good or bad for each of the plurality of access points, and execute processing of externally displaying or notifying a result that is determined are included.

Abstract: A release process film which comprises a base material film and an adhesive layer disposed on one face of the base material film and is used by attaching to a flexible printed circuit board, wherein the adhesive layer is formed with an adhesive comprising an acrylate-based copolymer at least comprising 40 to 99% by mass of a butyl acrylate unit and 1 to 20% by mass of a monomer unit having a crosslinking functional group and a crosslinking agent and the film has specific properties. The film can effectively suppress contamination of the surface of a printed circuit board with solvents and foreign substances and formation of flaws on the surface in the process using the flexible printed circuit board for producing electronic and electric instruments.

Abstract: A release process film which comprises a base material film and an adhesive layer disposed on one face of the base material film and is used by attaching to a flexible printed circuit board, wherein the adhesive layer is formed with an adhesive comprising an acrylate-based copolymer at least comprising 40 to 99% by mass of a butyl acrylate unit and 1 to 20% by mass of a monomer unit having a crosslinking functional group and a crosslinking agent and the film has specific properties. The film can effectively suppress contamination of the surface of a printed circuit board with solvents and foreign substances and formation of flaws on the surface in the process using the flexible printed circuit board for producing electronic and electric instruments.