Patents by Inventor Junichi Sekiya

Junichi Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8409609
    Abstract: A stable percutaneous absorption-type pharmaceutical preparation for percutaneous administration of drugs except for selegiline and selegiline hydrochloride, which does not suffer a decrease in the cohesive force of the adhesive layer therein even in the presence of sweat components due to perspiration during wear and which is free from cohesive failure and resultant adhesive remaining when stripped off. A percutaneous absorption-type pharmaceutical preparation which comprises: a support; and an adhesive layer containing an adhesive, a metal chloride and a percutaneously-absorptive drug except for selegiline and selegiline hydrochloride, wherein the adhesive layer is subjected to a crosslinking treatment.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: April 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Keigo Inosaka, Junichi Sekiya, Akio Takada, Toshinobu Tsuda
  • Patent number: 8361493
    Abstract: The patch according to an embodiment of the present invention includes: a support; and a pressure-sensitive adhesive layer on at least one surface of the support, wherein: the pressure-sensitive adhesive layer contains an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide; a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 wt % to 90 wt % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 1 wt % to 20 wt %; and the monomer components are substantially free of a monomer having a carboxyl group.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 29, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishikura, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Ryo Hashino, Satoshi Ameyama, Hidetoshi Kuroda
  • Patent number: 8096417
    Abstract: The main object of the present invention is to provide a patch package structure capable of stably retaining the physiologically active ingredient in a patch during preservation of the patch. This object can be achieved by employing the following constitution. To be specific, the present invention is a patch package structure including a patch 1 and a packaging member 51 holding the patch, wherein the patch 1 includes a support 2 and an adhesive layer 3 formed on at least one surface of the support 2, the packaging member 51 includes a first package 11, the first package 11 including an acrylonitrile resin layer 12, a moisture-absorbing layer 13 formed on the acrylonitrile resin layer 12, and a moisture impermeable layer 14 formed on the moisture-absorbing layer 13, and the acrylonitrile resin layer 12 is provided on the proximal side of the patch 1.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: January 17, 2012
    Assignees: Nitto Denko Corporation, Sasaki Chemical Co., Ltd.
    Inventors: Yoshihiro Iwao, Akinori Hanatani, Junichi Sekiya, Hitoshi Akemi
  • Patent number: 8033395
    Abstract: The main object of the present invention is to provide a patch package structure including a patch containing a physiologically active ingredient and a package housing the patch, which is capable of stably retaining the physiologically active ingredient in the patch during preservation. This object can be achieved by employing the following constitution. To be specific, the present invention is a patch package structure including a patch 1 having an adhesive layer containing an organic liquid component, and a packaging member 51 housing the patch, wherein the packaging member 51 includes a first package 11, the first package 11 including an acrylonitrile resin layer 12, a moisture-absorbing layer 13 formed on the acrylonitrile resin layer 12, and a moisture impermeable layer 14 formed on the moisture-absorbing layer 13, and the acrylonitrile resin layer 12 is provided on the proximal side of the patch 1.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: October 11, 2011
    Assignees: Nitto Denko Corporation, Sasaki Chemical Co., Ltd.
    Inventors: Yoshihiro Iwao, Akinori Hanatani, Junichi Sekiya, Hitoshi Akemi
  • Publication number: 20110223235
    Abstract: The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (?)-(R)—N,?-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and one or two or more stabilizers selected from the group consisting of 2-mercaptobenzimidazole, sodium sulfite, butylhydroxyanisole and butylhydroxytoluene.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 15, 2011
    Applicants: NITTO DENKO CORPORATION, FUJIMOTO CO., LTD.
    Inventors: Keigo INOSAKA, Satoshi AMEYAMA, Koji NAKAMURA, Junichi SEKIYA
  • Publication number: 20110123598
    Abstract: The patch according to an embodiment of the present invention includes: a support; and a pressure-sensitive adhesive layer on at least one surface of the support, wherein: the pressure-sensitive adhesive layer contains an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide; a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 wt % to 90 wt % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 1 wt % to 20 wt %; and the monomer components are substantially free of a monomer having a carboxyl group.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHIKURA, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Ryo Hashino, Satoshi Ameyama, Hidetoshi Kuroda
  • Publication number: 20110124833
    Abstract: There is provided a medical pressure-sensitive adhesive composition including an acrylic copolymer obtained by copolymerizing monomer components containing (a) at least one kind of a monomer of a (meth)acrylic acid alkyl ester and (b) at least one kind of a monomer of an N-hydroxyalkyl(meth)acrylamide, wherein: a content of the (meth)acrylic acid alkyl ester monomer (a) with respect to a total amount of the monomer components is 50 weight % to 99.9 weight % and a content of the N-hydroxyalkyl(meth)acrylamide monomer (b) with respect to the total amount is 0.1 weight % to 20 weight %; and the monomer components are substantially free of a monomer having a carboxyl group. The medical pressure-sensitive adhesive composition of the present invention is particularly suitable for applications such as medical patches and patch preparations.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHIKURA, Raito Funayama, Yu Tachikawa, Junichi Sekiya, Tsuyoshi Kasahara, Masayuki Okamoto, Masahito Niwa
  • Publication number: 20110056863
    Abstract: [Object] An adhesive preparation containing donepezil is provided in which adhesive layer discoloration over time is inhibited. [Solution] The adhesive preparation containing donepezil has an adhesive layer containing donepezil and an acrylic adhesive on at least one side of a support, and a water content of the adhesive layer is 1000 ppm or more. The water content of the adhesive layer is preferably 8000 ppm or less and more preferably 7000 ppm or less.
    Type: Application
    Filed: May 26, 2009
    Publication date: March 10, 2011
    Inventors: Junichi Sekiya, Akinori Hanatani, Sachiko Sakamoto, Sumiyo Maruyama, Hitoshi Akemi
  • Patent number: 7754235
    Abstract: The present invention provides an adhesive capable of affording an adhesive layer showing reduced stickiness, reduced cohesive failure and the like. An adhesive containing a copolymer obtained by copolymerizing monomers containing a (meth)acrylic acid alkyl ester as a main component, and a vinyl monomer having a hydroxyl group and/or a carboxyl group and which has an average molecular radius of not less than 70 nm as measured by a multi angle laser light scattering method.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: July 13, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Hitoshi Akemi, Keigo Inosaka, Junichi Sekiya, Junichi Saito, Yoshifumi Hosaka
  • Publication number: 20100062045
    Abstract: [Object] By suppressing coloring of an adhesive preparation containing donepezil, a naturally colored appearance is realized. [Solution] In a method for suppressing coloring of an adhesive preparation having a support and a pressure-sensitive adhesive layer, which comprises a pressure-sensitive adhesive and donepezil in the pressure-sensitive adhesive layer, ascorbic acid, a metal salt or an ester thereof and metal metabisulfite salt are contained in the pressure-sensitive adhesive layer. This method preferably has: a step of preparing a mixture comprising the pressure-sensitive adhesive, the donepezil, the ascorbic acid, a metal salt or an ester thereof, and the metal metabisulfite salt; and a step of film-forming the pressure-sensitive adhesive layer by applying the mixture to the surface of the support.
    Type: Application
    Filed: November 30, 2007
    Publication date: March 11, 2010
    Applicants: NITTO DENKO CORPORATION, Eissi R&D Management cO., Ltd
    Inventors: Sumiyo Nishi, Akinori Hanatani, Junichi Sekiya, Sachiko Terashi, Hitoshi Akemi, Satoko Washiro
  • Publication number: 20100048628
    Abstract: [Object] Discoloration, over time, of a donepezil-containing adhesive preparation is suppressed. [Solution] At least one species of stabilizer selected from the group consisting of ascorbic acid, a metal salt or an ester thereof, isoascorbic acid or a metal salt thereof, ethylenediamine tetraacetic acid or a metal salt thereof, 2-mercaptobenzimidazole, 3(2)-t-butyl-4-hydroxyanisole, 2,6-di-t-butyl-4-methylphenol, tetrakis[3-(3?,5?-di-t-butyl-4?-hydroxyphenyl)propionic acid]pentaerythritol, (±)-?-tocopherol, (±)-?-tocopherol acetate, rutin, hypophosphorous acid, a metal metabisulfite salt and a metal salt of hydroxymethanesulfinic acid, is blended in a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and donepezil.
    Type: Application
    Filed: November 30, 2007
    Publication date: February 25, 2010
    Inventors: Sumiyo Nishi, Akinori Hanatani, Junichi Sekiya, Sachiko Terashi, Hitoshi Akemi, Satoko Washiro
  • Publication number: 20100010043
    Abstract: The present invention provides a percutaneously absorbable preparation comprising 2-[(1-benzylpiperidin-4-yl)methyl]-5,6-dimethoxyindan-1-one and/or a hydrochloride thereof wherein the percuneously absorbable preoaration is able to administer to a patient such that Cmax per unit surface area of the percutaneously absorbable preparation is 0.025 to 0.5 ng/ml·cm2 in a plasma concentration profile.
    Type: Application
    Filed: May 29, 2009
    Publication date: January 14, 2010
    Applicants: Eisai R&D Management Co., Ltd., NITTO DENKO CORPORATION
    Inventors: Akinori Hanatani, Junichi Sekiya, Sachiko Terashi, Sumiyo Nishi, Hitoshi Akemi
  • Patent number: 7585907
    Abstract: The invention provides an inorganic powder-containing resin composition capable of forming a dielectric layer having high light transmittance and excellent in surface smoothness. The invention also provides a film-forming material layer, a transfer sheet and a dielectric layer, which comprise the composition, a method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon. The inorganic powder-containing resin composition comprises inorganic powder, a binder resin, and a phosphorus compound represented by formula (1): wherein R1, R2 and R3 independently represent H, an alkyl group, an alkylaryl group, NH4+ (ammonium) or —(CH2CH2O)n—R4, wherein n is 1 to 15, and R4 represents H, an alkyl group, an alkylaryl group or a (meth)acryloyl group.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: September 8, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Tomohide Banba, Katsuya Kume, Makoto Kai, Natsuki Kobayashi, Mami Ikeya, Yasushi Buzoujima, Junichi Sekiya, Mitsuhiro Kanada
  • Publication number: 20090166229
    Abstract: The main object of the present invention is to provide a patch package structure including a patch containing a physiologically active ingredient and a package housing the patch, which is capable of stably retaining the physiologically active ingredient in the patch during preservation. This object can be achieved by employing the following constitution. To be specific, the present invention is a patch package structure including a patch 1 having an adhesive layer containing an organic liquid component, and a packaging member 51 housing the patch, wherein the packaging member 51 includes a first package 11, the first package 11 including an acrylonitrile resin layer 12, a moisture-absorbing layer 13 formed on the acrylonitrile resin layer 12, and a moisture impermeable layer 14 formed on the moisture-absorbing layer 13, and the acrylonitrile resin layer 12 is provided on the proximal side of the patch 1.
    Type: Application
    Filed: December 12, 2008
    Publication date: July 2, 2009
    Inventors: Yoshihiro Iwao, Akinori Hanatani, Junichi Sekiya, Hitoshi Akemi
  • Publication number: 20090166236
    Abstract: The main object of the present invention is to provide a patch package structure capable of stably retaining the physiologically active ingredient in a patch during preservation of the patch. This object can be achieved by employing the following constitution. To be specific, the present invention is a patch package structure including a patch 1 and a packaging member 51 holding the patch, wherein the patch 1 includes a support 2 and an adhesive layer 3 formed on at least one surface of the support 2, the packaging member 51 includes a first package 11, the first package 11 including an acrylonitrile resin layer 12, a moisture-absorbing layer 13 formed on the acrylonitrile resin layer 12, and a moisture impermeable layer 14 formed on the moisture-absorbing layer 13, and the acrylonitrile resin layer 12 is provided on the proximal side of the patch 1.
    Type: Application
    Filed: December 12, 2008
    Publication date: July 2, 2009
    Inventors: Yoshihiro Iwao, Akinori Hanatani, Junichi Sekiya, Hitoshi Akemi
  • Publication number: 20080131490
    Abstract: A donepezil-containing patch preparation is provided whereby production of donepezil-related substances in the pressure-sensitive adhesive layer is suppressed. A stabilizer comprising at least one or more species selected from the group consisting of ascorbic acid, metal salts or esters thereof, isoascorbic acid or metal salts thereof, ethylenediamine tetraacetic acid or metal salts thereof, cysteine, acetylcysteine, 2-mercaptobenzimidazole, 3(2)-t-butyl-4-hydroxyanisole, 2,6-di-t-butyl-4-methylphenol, tetrakis[3-(3?,5?-di-t-butyl-4?-hydroxyphenyl)propionic acid]pentaerythritol, 3-mercapto-1,2-propanediol, tocopherol acetate, rutin, quercetin, hydroquinone, metal salts of hydroxymethanesulfinic acid, metal metabisulfite salts, metal sulfite salts and metal thiosulfate salts is blended in a donepezil-containing pressure-sensitive adhesive layer provided on at least one side of a support.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 5, 2008
    Inventors: Akinori Hanatani, Junichi Sekiya, Sachiko Terashi, Sumiyo Nishi, Satoko Washiro, Hitoshi Akemi
  • Publication number: 20060292210
    Abstract: A stable percutaneous absorption-type pharmaceutical preparation for percutaneous administration of selegiline or selegiline hydrochloride, which does not suffer a decrease in the cohesive force of the adhesive layer therein even in the presence of sweat components due to perspiration during wear and which is free from cohesive failure and resultant adhesive remaining when stripped off, is provided. A percutaneous absorption-type pharmaceutical preparation which comprises: a support; and an adhesive layer containing a metal chloride, an adhesive and at least one of (?)-(R)—N,?-dimethyl-N-2-propynylphenethylamine and its hydrochloride, wherein the adhesive layer is subjected to a crosslinking treatment.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 28, 2006
    Inventors: Keigo Inosaka, Takateru Muraoka, Yoshihiro Iwao, Akio Takada, Toshinobu Tsuda, Junichi Sekiya
  • Publication number: 20060275354
    Abstract: A stable percutaneous absorption-type pharmaceutical preparation for percutaneous administration of drugs except for selegiline and selegiline hydrochloride, which does not suffer a decrease in the cohesive force of the adhesive layer therein even in the presence of sweat components due to perspiration during wear and which is free from cohesive failure and resultant adhesive remaining when stripped off. A percutaneous absorption-type pharmaceutical preparation which comprises: a support; and an adhesive layer containing an adhesive, a metal chloride and a percutaneously-absorptive drug except for selegiline and selegiline hydrochloride, wherein the adhesive layer is subjected to a crosslinking treatment.
    Type: Application
    Filed: June 5, 2006
    Publication date: December 7, 2006
    Inventors: Keigo Inosaka, Junichi Sekiya, Akio Takada, Toshinobu Tsuda
  • Publication number: 20060246281
    Abstract: The present invention provides an adhesive capable of affording an adhesive layer showing reduced stickiness, reduced cohesive failure and the like. An adhesive containing a copolymer obtained by copolymerizing monomers containing a (meth)acrylic acid alkyl ester as a main component, and a vinyl monomer having a hydroxyl group and/or a carboxyl group and which has an average molecular radius of not less than 70 nm as measured by a multi angle laser light scattering method.
    Type: Application
    Filed: April 25, 2006
    Publication date: November 2, 2006
    Inventors: Hitoshi Akemi, Keigo Inosaka, Junichi Sekiya, Junichi Saito, Yoshifumi Hosaka
  • Publication number: 20060199883
    Abstract: The invention provides an inorganic powder-containing resin composition capable of forming a dielectric layer having high light transmittance and excellent in surface smoothness. The invention also provides a film-forming material layer, a transfer sheet and a dielectric layer, which comprise the composition, a method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon. The inorganic powder-containing resin composition comprises inorganic powder, a binder resin, and a phosphorus compound represented by formula (1): wherein R1, R2 and R3 independently represent H, an alkyl group, an alkylaryl group, NH4+ (ammonium) or —(CH2CH2O)n—R4, wherein n is 1 to 15, and R4 represents H, an alkyl group, an alkylaryl group or a (meth)acryloyl group.
    Type: Application
    Filed: July 23, 2004
    Publication date: September 7, 2006
    Inventors: Tomohide Banba, Katsuya Kume, Makoto Kai, Natsuki Kobayashi, Mami Ikeya, Yasushi Buzoujima, Junichi Sekiya, Mitsahiro Kanada