Patents by Inventor Junichi SHINOZAKI

Junichi SHINOZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component, circuit board arrangement, and method of manufacturing electronic component
    Patent number: 11626247
    Abstract: An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: April 11, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Junichi Shinozaki, Toshiki Kondo, Ryosuke Hoshino, Takahisa Fukuda
  • ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20220068564
    Abstract: An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 3, 2022
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Junichi SHINOZAKI, Toshiki KONDO, Ryosuke HOSHINO, Takahisa FUKUDA