Abstract: A resonator device includes a semiconductor substrate having a first surface and a second surface being opposite to each other, a resonator that is bonded to the first surface and includes a resonator element and a container housing the resonator element, an integrated circuit portion that is formed on the second surface and includes an oscillation circuit electrically connected to the resonator element, and mounting terminals connected to the integrated circuit portion.

Abstract: Provided is an abdominal cavity simulator that allows for diverse and realistic procedure training and is easy to store and carry. The simulator is provided with a pedestal that is provided with multiple fixing portions whereto organ model fixtures are mounted; a pneumoperitoneum cover; and two side plate members that provide a space between the pneumoperitoneum cover and the pedestal for allowing the organ model fixture to be arranged therein. A first recess is provided in the pneumoperitoneum cover; a first protrusion and a second protrusion are provided in the side plate members; and a second recess is provided in the pedestal. In a state in which the direction of either the pedestal or a casing has been changed by 180°, the pneumoperitoneum cover and the side plate members can be secured to each other, and the pedestal and the side plate members can be secured to each other.

Abstract: A lens retaining device includes a first shifter and a second shifter. The first shifter holds a lens and moves in a first direction perpendicular to an optical axis direction of the lens. The second shifter supports the first shifter and moves in a second direction perpendicular to the optical axis direction and the first direction. The first shifter includes a first main body moves in the first direction, a lens retainer that is provided on the first main body and retains the lens, and a first drive portion that moves the first main body. The lens retainer is integrally formed with the first main body.

Abstract: A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a high emissivity layer that is disposed at a surface of the heat generating unit on a first lid side and that has an emissivity higher than an emissivity of the surface. In addition, a constituent material of the surface is silicon, and the emissivity of the high emissivity layer at room temperature is 0.5 or more.

Abstract: A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid. In addition, a constituent material of the first lid is silicon, and the emissivity of the low emissivity layer at room temperature is less than 0.5.

Abstract: A lens retaining device includes a first shifter and a second shifter. The first shifter holds a lens and moves in a first direction perpendicular to an optical axis direction of the lens. The second shifter supports the first shifter and moves in a second direction perpendicular to the optical axis direction and the first direction. The first shifter includes a first main body moves in the first direction, a lens retainer that is provided on the first main body and retains the lens, and a first drive portion that moves the first main body. The lens retainer is integrally formed with the first main body.

Abstract: A vibrator device includes: a base including a semiconductor substrate having an integrated circuit disposed at a first surface; a vibration element electrically coupled to the integrated circuit; and a lid having an end surface of a side wall bonded to the first surface at a bonding portion. A first circuit of the integrated circuit includes a first circuit element disposed in a first region overlapping the bonding portion in a plan view. The first circuit element is a passive element or a transistor, and ?<90° is satisfied, ? being an angle formed by the first surface and an inner side surface of the side wall.

Abstract: A vibrator device includes: a base having an integrated circuit disposed at a second surface; a vibration element; and a lid having an end surface of a side wall bonded to a first surface of the base at a bonding portion. The integrated circuit includes a first circuit and a second circuit, the first circuit includes a plurality of first circuit elements disposed in a first region ARA, and the second circuit includes a second circuit element disposed in a second region ARB. At this time, the following relations are established. { 1 - L ? 1 ? A / WX } ? 0.95 ? { 1 - L ? 2 ? A / WX } ? 0.95 ? { 1 - L ? 3 ? A / WY } ? 0.95 ? { 1 - L ? 4 ? A / WY } ? 0.95 ? { 1 - L ? 1 ? B / WX } ? 0.8 ? { 1 - L ? 2 ? B / WX } ? 0.8 ? { 1 - L ? 3 ? B / WY } ? 0.8 ? { 1 - L ? 4 ? B / WY } ? 0.

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

Abstract: A vibrator device includes a vibrator element, a base to which the vibrator element is coupled, and a lid bonded to the base. The vibrator element is accommodated in an accommodation space between the lid and the base. At least one of the base or the lid includes a first semiconductor substrate connected to a ground potential and having a conductivity type that is p-type or n-type. The vibrator element includes a vibrator substrate, a first electrode disposed on a side of the vibrator substrate closer to the first semiconductor substrate, and a second electrode disposed on a side of the vibrator substrate farther from the first semiconductor substrate. L1?0.2×10?3 and d1??×S1×1012, wherein L1 [m] is the height of the accommodation space, d1 [m] is the distance between the first semiconductor substrate and the first electrode, S1 [m2] is the area of the first electrode, and ? [F/m] is the permittivity of the accommodation space.

Abstract: Provided is a fixture tool for securing a bio-textured organ model created by reproducing or deforming the texture and appearance of an actual organ for manipulation training. The fixture tool includes a fixture body and a plurality of holding parts attachable to and detachable from the fixture body. The fixture body includes: integrally connected plates composed of a rectangular center plate and mutually opposing first and second plates rotatably connected to both long sides of the center plate via hinges; and a leg attached to the lower surface of the center plate. The first and second plates have a locking section for securing the holding part. The holding part has a holding surface capable of holding the bio-textured organ model. The holding part is configured such that the holding surface inclines relative to a plate surface when the holding part is secured to the first and second plates.

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

Abstract: A vibrator device includes: a base including a semiconductor substrate having an integrated circuit disposed at a second surface; a vibration element electrically coupled to the integrated circuit; and a lid having an end surface of a side wall bonded to a first surface at a bonding portion. A first circuit of the integrated circuit includes a first circuit element disposed in a second region surrounded by a first region that overlaps the bonding portion in a plan view. The first circuit element is a passive element or a transistor, and ?<90° is satisfied, ? being an angle formed by the first surface and an inner side surface of the side wall.

Abstract: A vibrator device includes: a base including a semiconductor substrate having an integrated circuit disposed at a first surface; a vibration element electrically coupled to the integrated circuit; and a lid having an end surface of a side wall bonded to the first surface at a bonding portion. A first circuit of the integrated circuit includes a first circuit element disposed in a first region overlapping the bonding portion in a plan view. The first circuit element is a passive element or a transistor, and ?<90° is satisfied, ? being an angle formed by the first surface and an inner side surface of the side wall.

Abstract: A vibrator device includes: a base including a semiconductor substrate having an integrated circuit disposed at a second surface; a vibration element electrically coupled to the integrated circuit; and a lid having an end surface of a side wall bonded to a first surface at a bonding portion. A first circuit of the integrated circuit includes a first circuit element disposed in a first region overlapping the bonding portion in a plan view. The first circuit element is a passive element or a transistor, and ?>90° is satisfied, ? being an angle formed by the first surface and an inner side surface of the side wall.

Abstract: A vibrator device includes: a base having an integrated circuit disposed at a second surface; a vibration element; and a lid having an end surface of a side wall bonded to a first surface of the base at a bonding portion. The integrated circuit includes a first circuit and a second circuit, the first circuit includes a plurality of first circuit elements disposed in a first region ARA, and the second circuit includes a second circuit element disposed in a second region ARB. At this time, the following relations are established. { 1 - L ? 1 ? A / WX } ? 0.95 ? { 1 - L ? 2 ? A / WX } ? 0.95 ? { 1 - L ? 3 ? A / WY } ? 0.95 ? { 1 - L ? 4 ? A / WY } ? 0.95 ? { 1 - L ? 1 ? B / WX } ? 0.8 ? { 1 - L ? 2 ? B / WX } ? 0.8 ? { 1 - L ? 3 ? B / WY } ? 0.8 ? { 1 - L ? 4 ? B / WY } ? 0.

Abstract: A resonator device includes: a base substrate having a first surface and a second surface in a front-to-back relationship with the first surface; a resonator element located on a first surface side of the base substrate and including a resonator substrate and an electrode terminal disposed at a base-substrate-side surface of the resonator substrate; a mounting terminal disposed at the first surface; and a metal bump disposed between the base substrate and the resonator element, the metal bump being configured to bond the base substrate and the resonator element and electrically couple the mounting terminal and the electrode terminal. A cross-sectional area of the metal bump at a bonding portion with the resonator element is 491 ?m2 or more and 4007 ?m2 or less.

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

Abstract: A cooker with a door includes: a proximity sensor configured to detect presence or absence of an object in proximity to the cooker; and a door opening controller configured to control the door to open and close on a detection signal from the proximity sensor, wherein the door opening controller opens the door when receiving the detection signal from the proximity sensor twice or more within a predetermined time period, the detection signal indicating the presence of the object.

Abstract: There is provided a vibrator device including: a vibrator element; a semiconductor substrate having a first surface on which the vibrator element is disposed and a second surface positioned on an opposite side of the first surface; a fractional N-PLL circuit disposed at the second surface; a wiring that is disposed at the first surface and electrically couples the vibrator element and the fractional N-PLL circuit; and an output terminal that is disposed at the second surface side of the semiconductor substrate, is electrically coupled to the fractional N-PLL circuit, and outputs a signal from the fractional N-PLL circuit, in which the output terminal does not overlap the wiring in a plan view along a thickness direction of the semiconductor substrate.