Abstract: A cooling member includes a heat-transfer member having a groove and a refrigerant introducing pipe pressed into the groove. The refrigerant introducing pipe has a pressed region positioned inwardly of the edge of the heat-transfer member, and at least one curbed surface portion. A method for manufacturing a cooling member includes preparing a punch having at least one curved corner and a pressing surface, positioning the corner, and moving the punch closer to the groove to press the refrigerant introducing pipe into the groove with the pressing surface. A device for manufacturing a cooling member includes the punch and a support configured to support the heat-transfer member so the groove is positioned opposite the punch.

Abstract: An air conditioning apparatus is provided which includes a plurality of heat exchangers (11, 12, 13) for effecting heat exchange between a heating medium (such as refrigerant, cold and hot water et cetera) and air and which is adapted to separately perform sensible heat processing and latent heat processing of room air (RA). In the air conditioning apparatus, at least one heat exchanger (13) is made up of an adsorption heat exchanger (13) that supports on its surface an adsorbent, thereby preventing the increase in apparatus size and making it possible to perform operations at high COP.

Abstract: Including a first insulating substrate (A) and a second insulating substrate (B) to be stacked each other. Including a first electrode (2b) formed on the upper surface of the first insulating substrate (A), a pair of second electrodes (3c, 4c) individually formed on the both surfaces thereof and connected to each other via a through-hole (7), and a thermoelectric material (5b) provided in the form of a thin film so as to contact with the first electrode (2b) and the second electrode (3c). Furthermore, including a pair of third electrodes (8b, 9b) formed on the both surfaces of the second insulating substrate (B) and connected to each other via a through-hole (10) while one of the third electrodes (8b, 9b) is connected to the first electrode (2b).

Abstract: A refrigerant circuit (10) is provided with two adsorption heat exchangers (31, 32) in addition to an outdoor heat exchanger (21) and an indoor heat exchanger (22). An adsorbent is carried on the surface of each of the adsorption heat exchangers (31, 32). In the adsorption heat exchanger (31, 32) serving as an evaporator, moisture in the air is adsorbed by the adsorbent. In the adsorption heat exchanger (31, 32) serving as a condenser, moisture is desorbed from the adsorbent and then applied to the air. Then, the air dehumidified or humidified by the adsorption heat exchanger (31, 32) is supplied to a room to cope with latent heat load in the room. On the other hand, in the indoor heat exchanger (22), air is cooled or heated. Then, the air cooled or heated by the indoor heat exchanger (22) is supplied to the room to cope with sensible heat load in the room.

Abstract: A heat exchange system includes an outdoor heat exchanger, an indoor heat exchanger, a compressor, an expansion valve, a capillary tube, and a cooling jacket. The compressor is provided on a first path that is one of two paths connecting the outdoor heat exchanger and the indoor heat exchanger, and the expansion valve, the capillary tube and a check valve are provided on a second path of the two paths connecting the outdoor heat exchanger and the indoor heat exchanger that is opposite to the path on which the compressor is provided. The cooling jacket for cooling an object to be cooled is provided between the expansion valve and the capillary tube.

Abstract: A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

Abstract: A power module includes a power semiconductor, a non-power semiconductor, one resin substrate and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

Abstract: A refrigerant circuit (10) is provided with two adsorption heat exchangers (31, 32) in addition to an outdoor heat exchanger (21) and an indoor heat exchanger (22). An adsorbent is carried on the surface of each of the adsorption heat exchangers (31, 32). In the adsorption heat exchanger (31, 32) serving as an evaporator, moisture in the air is adsorbed by the adsorbent. In the adsorption heat exchanger (31, 32) serving as a condenser, moisture is desorbed from the adsorbent and then applied to the air. Then, the air dehumidified or humidified by the adsorption heat exchanger (31, 32) is supplied to a room to cope with latent heat load in the room. On the other hand, in the indoor heat exchanger (22), air is cooled or heated. Then, the air cooled or heated by the indoor heat exchanger (22) is supplied to the room to cope with sensible heat load in the room.

Abstract: An air conditioning apparatus is provided which includes a plurality of heat exchangers (11, 12, 13) for effecting heat exchange between a heating medium (such as refrigerant, cold and hot water et cetera) and air and which is adapted to separately perform sensible heat processing and latent heat processing of room air (RA). In the air conditioning apparatus, at least one heat exchanger (13) is made up of an adsorption heat exchanger (13) that supports on its surface an adsorbent, thereby preventing the increase in apparatus size and making it possible to perform operations at high COP.

Abstract: A novel metal/polymer base functionally gradient material comprising silver and a fluororesin in which the composition of silver and the fluororesin is continuously changed from one side to the other.