Abstract: A waste heat recovering and cooling apparatus for an engine includes a water pump that ejects cooling water of an engine; an EGR cooler that cools EGR gas introduced into an intake pipe from an exhaust pipe of the engine by using some of the cooling water ejected from the water pump; an EGR valve that opens and closes the channel of the EGR gas passing through the EGR cooler; and a transmission warmer that heats lubricating oil of a transmission by the cooling water passing through the EGR cooler.

Abstract: A waste heat recovering and cooling apparatus for an engine includes a water pump that ejects cooling water of an engine; an EGR cooler that cools EGR gas introduced into an intake pipe from an exhaust pipe of the engine by using some of the cooling water ejected from the water pump; an EGR valve that opens and closes the channel of the EGR gas passing through the EGR cooler; and a transmission warmer that heats lubricating oil of a transmission by the cooling water passing through the EGR cooler.

Abstract: A portable telephone having an antenna for transmitting and/or receiving a wireless signal, a microphone for generating a sound signal corresponding to an input sound, a transmitting and receiving circuit for generating a wireless signal corresponding to the sound signal generated by the microphone to transmit the wireless signal through the antenna and generating a sound signal corresponding to the wireless signal received by the antenna, a receiver for outputting sound corresponding to the sound signal generated by the transmitting and receiving circuit, a shield case for surrounding and housing all or part of the transmitting and receiving circuit and being conductive, an electric wave absorber with one face in contact with a predetermined area of the shield case for absorbing an electric wave, and a conductive layer formed on another face of the electric wave absorber and electrically connected to the shield case.

Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.

Abstract: A complex material, which emits light with a light hand or finger touch of a person and only when subjected to a stress, comprises stress emission particles and an elastic material. The stress emission particles such as SrAl2O4:Eu particles emit light when subjected to a stress. The elastic material is a soft material having a Young's modulus smaller than 10 MPa, such as silicone rubber, synthetic rubber, natural rubber, or the like. Weight percent of the particles in the complex material is from equal to or more than 10% to less than 100%, ore preferably from equal to or less more than 10% to equal to or less than 90%. The particles are preferably surface-treated by a silane coupling agent. The complex material is used as an artificial light-emitting skin or an artificial light-emitting body.

Abstract: A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer. Then, a second encapsulating resin layer is formed, on the outer circumference of the first encapsulating resin layer, from an epoxy resin composition containing the following components (A) to (D): (A) epoxy resin; (B) phenolic resin; (C) curing accelerator; and (D) at least one of the following particles (d1) and (d2): (d1) conductive particles whose surfaces are subjected to coating treatment with an insulating inorganic material; and (d2) magnetic particles whose surfaces are subjected to coating treatment with an insulating inorganic material.

Abstract: The portable telephone capable of more effectively reducing the electromagnetic energy to be radiated therefrom and absorbed by the human body during its use is provided.

Abstract: A magnetic powder 4 is produced by use of a plating mold M which is pattern-formed with an electrode range 10 corresponding to the shape of a magnetic powder 4 and an insulative range surrounding the periphery of the electrode range, precipitating films 40 of the magnetic material selectively in the electrode range through an electroplating and then peeling the films 40 from the plating mold. The flat magnetic powders 4 where are regular in piano shapes and diameters among or between powders or where average crystal grain diameters are 100 nm or smaller, are much dispersed into an insulative resin as a bonding agent.

Abstract: A complex material, which emits light with a light hand or finger touch of a person and only when subjected to a stress, comprises stress emission particles and an elastic material. The stress emission particles such as SrAl2O4:Eu particles emit light when subjected to a stress. The elastic material is a soft material having a Young's modulus smaller than 10 MPa, such as silicone rubber, synthetic rubber, natural rubber, or the like. Weight percent of the particles in the complex material is from equal to or more than 10% to less than 100%, ore preferably from equal to or less more than 10% to equal to or less than 90%. The particles are preferably surface-treated by a silane coupling agent. The complex material is used as an artificial light-emitting skin or an artificial light-emitting body.

Abstract: An electromagnetic wave suppressor sheet formed into a sheet-like shape out of a material made of synthetic resin in which powder of conjugated magnetic particles surface-treated with an insulating inorganic material has been dispersed.

Abstract: There is disclosed a thinner-layered radio wave absorber having high absorption performance for a high frequency electromagnetic wave. The radio wave absorber, even when having a magnetic layer of not more than 1 mm in thickness, achieves satisfactory absorption characteristics for the high frequency electromagnetic wave by adopting a structure that a conductor is fixedly attached to a face opposite to an electromagnetic-wave incident face of the magnetic layer of single-layered structure, and also arranging the magnetic layer to have values of a real part &mgr;′ and an imaginary part &mgr;″ of complex relative magnetic permeability of the magnetic layer satisfying an expression of &mgr;″≧m&mgr;′−n (m: real number of m>0, n: real number of n≧0) outside an impedance mismatching region.

Abstract: The present invention is a radio wave absorber having a high absorption performance for an electromagnetic wave of a high frequency and made thinner. The radio wave absorber comprises one or more magnetic layers including a magnetic material having a micro organization structure whose particle diameter is controlled to 1 to 100 nm. A radio wave absorbing sheet (2) comprises one magnetic layer formed by preparing as such a magnetic material including Fe, Co and Ni, which are ferromagnetic elements, or a material including an alloy containing Mn, as powder, and dispersing this powder into polymeric material and the like, and it has a radio wave absorption performance for a relatively near electromagnetic field.

Abstract: There is disclosed a thinner-layered radio wave absorber having high absorption performance for a high frequency electromagnetic wave. The radio wave absorber, even when having a magnetic layer of not more than 1 mm in thickness, achieves satisfactory absorption characteristics for the high frequency electromagnetic wave by adopting a structure that a conductor is fixedly attached to a face opposite to an electromagnetic-wave incident face of the magnetic layer of single-layered structure, and also arranging the magnetic layer to have values of a real part &mgr;′ and an imaginary part &mgr;″ of complex relative magnetic permeability of the magnetic layer satisfying an expression of &mgr;″≧m&mgr;′−n (m: real number of m>0, n: real number of n≧0) outside an impedance mismatching region.

Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.

Abstract: A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer.

Abstract: A magnetic powder 4 is produced by use of a plating mold M which is pattern-formed with an electrode range 10 corresponding to the shape of a magnetic powder 4 and an insulative range surrounding the periphery of the electrode range, precipitating films 40 of the magnetic material selectively in the electrode range through an electroplating and then peeling the films 40 from the plating mold. The flat magnetic powders 4 where are regular in plane shapes and diameters among or between powders or where average crystal grain diameters are 100 nm or smaller, are much dispersed into an insulative resin as a bonding agent.

Abstract: A radio wave absorbent capable of absorbing radiowaves in the space saving and efficient manner and capable of coping with up to high frequency bands, as well as a manufacturing method thereof are provided. In a radio wave absorbent in which magnetic particles comprising a soft magnetic metal material are mixed with a matrix of a polymeric material or ceramics, the magnetic particles are formed into elliptic plate particles.

Abstract: An electromagnetic wave suppressor sheet formed into a sheet-like shape out of a material made of synthetic resin in which powder of conjugated magnetic particles surface-treated with an insulating inorganic material has been dispersed.

Abstract: A sheet for electronic parts which includes an electromagnetic wave-absorbing heat-radiating layer containing a magnetic material powder, for example, a ferrite, Sendust or the like, a heat-conductive powder, for example, alumina, aluminum nitride or the like and a resin, and a shield layer which is an electrically conductive layer including a metallic foil, for example, copper foil, aluminum foil or the like, or including an electrically conductive powder of carbon or the like and a resin, laminated on the electromagnetic wave-absorbing heat-radiating layer, and a method of producing the same.

Abstract: The portable telephone capable of more effectively reducing the electromagnetic energy to be radiated therefrom and absorbed by the human body during its use is provided.