Abstract: A thermally conductive composite silicone rubber sheet including a thermally conductive silicone rubber sheet and a thermosoftening silicone resin layer provided on one side or both sides of the thermally conductive silicone rubber sheet and having a thickness of 0.5 to 10 ?m and an absolute viscosity of 10 to 700 Pa·s at 70° C. The thermosoftening silicone resin layer includes (A) 75 to 95% by mass of a thermosoftening silicone resin in which the proportion of phenyl groups to the number of all substituents directly bonded to silicon atoms is 20 mol % or more, and (B) 5 to 25% by mass of a diphenylsiloxy group-containing organopolysiloxane represented by the following formula (1): wherein m is an integer of 3 to 5, and n is an integer of 5 to 12. Thus, a thermally conductive composite silicone rubber sheet can develop adhesiveness on instantaneous contact while suppressing oil bleed.

Abstract: Provided is an insulating thermally conductive sheet which is flexible and has excellent heat conductivity in the thickness direction. The sheet is a cured product of a thermally conductive silicone resin composition including: (A) 100 parts by mass of a thermosetting silicone resin containing (A1) an organopolysiloxane having two or more silicon atom-bonded alkenyl groups in each molecule, (A2) an organohydrogenpolysiloxane having two or more hydrosilyl groups in each molecule and being composed of (A2-a) and (A2-b) having specific structures, and (A3) a hydrosilylation catalyst; and (B) 150 to 500 parts by mass of a boron nitride having particle diameter of 40 to 100 ?m and an aspect ratio of 20 to 100, wherein the sheet has an orientation degree such that (Sum of the counts at [2?=41 to 43°])/(Sum of the counts at [2?=25 to 27°]) is 1 or greater.

Abstract: One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.

Abstract: Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.

Abstract: It is intended to provide a measuring instrument or the like capable of measuring a flow property of a small amount of sample. A measuring instrument 101 configured to measure a flow property of a test liquid 5, the measuring instrument 101 including: a push-back means configured to push back the test liquid 5, the test liquid 5 having flowed into a capillary tube 11 including a first opening part 111 and a second opening part 112 from the second opening part 112 side toward the first opening part 111 side, to the second opening part 112 side; an adjustment valve for adjusting liquid flow in the capillary tube 11; and a measurement unit 6 configured to measure an arrival time tn at a liquid level position Ln in the capillary tube 11.

Abstract: A thermally conductive sheet containing a thermally conductive filler (B) that contains at least one of carbon and boron nitride in a polymer matrix (A), wherein the thermally conductive sheet has a thermal conductivity in a thickness direction of 15 W/m·K or more and a degree of orientation in which a long axis direction of the thermally conductive filler is oriented in a thickness direction of the thermally conductive sheet is 1.0 or more. This makes the filler highly oriented, and thus it is possible to provide a thermally conductive sheet that has excellent thermal conductivity in a thickness direction and low specific gravity.

Abstract: A cover for a heat generating electronic component including a hollow structure having one or more openings for inserting an electronic circuit component, wherein an inner wall surface of the hollow structure has one or more protrusion portions. Thereby, a cover for a heat generating electronic component that can prevent detachment of the electronic component is provided.

Abstract: Provided is a thermally conductive silicone composition capable of being turned into a cured product that is superior in heat dissipation property and is able to suppress corrosion of metal wirings. The thermally conductive silicone composition contains: (A) an organopolysiloxane having at least 2 silicon atom-bonded alkenyl groups per molecule, and having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.; (B) an organohydrogenpolysiloxane having, per molecule, at least 2 hydrogen atoms that are directly bonded to silicon atoms; (C) a thermally conductive filler having a thermal conductivity of not lower than 10 W/m·K; (D) a dimethylpolysiloxane with one molecular chain end being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; (F) benzotriazole and/or a benzotriazole derivative; and (G) an aliphatic unsaturated bond-free organopolysiloxane.

Abstract: [Problem] One object of the present invention is to provide a thermally conductive silicone composition in which an increase in viscosity is suppressed when a thermally conductive filler is filled with a high amount level, and a thermally conductive silicone cured product having good thermal conductivity and excellent handling properties. [Solution] A thermally conductive silicone composition comprising the following components (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom: 100 parts by mass; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom to the number of the alkenyl group in component (A) is 0.1 to 2; (C) a thermally conductive filler: 4,000 to 7,000 parts by mass; (D) a platinum group metal-based catalyst: a catalyst amount; (E) an addition reaction control agent: 0.

Abstract: One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.

Abstract: Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.

Abstract: A thermal conductive silicone composition containing: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to silicon atoms, the moles of hydrogen atoms directly bonded to silicon atoms is 0.1-5.0 times the moles of alkenyl groups derived from the component (A); (C) 2,800-4,000 parts by mass of a heat conductive filler including 50 mass % or more of a mixture of 25-35 mass % of aluminum hydroxide having an average particle size of 0.1 ?m or more and less than 40 ?m and 65-75 mass % of aluminum hydroxide having an average particle size of 40 ?m or more and 100 ?m or less; and (D) a platinum group metal-based curing catalyst having a mass-based platinum group metal element content of 0.1-1,000 ppm relative to the component (A).

Abstract: A method of manufacturing a solar cell module comprising pressing a first silicone gel sheet provided on a sunlight receiving surface of a solar cell string and a second silicone gel sheet provided on an opposite side sunlight non-receiving surface of the solar cell string in vacuum to encapsulate the solar cell string with the first and second silicone gel sheets; disposing the sunlight receiving surface side of the first silicone gel sheet on one surface of a transparent light receiving panel and disposing butyl rubber in a picture frame-like shape along an outer peripheral portion of a panel where the first silicone gel sheet is not formed and laying the light receiving panel and the light non-receiving panel or back sheet over each other with the silicone gel sheet-encapsulated solar cell string on the inside, and pressing them at 100 to 150° C. in vacuum to press bond the light receiving surface panel and the light non-receiving surface panel or back sheet to each other through the butyl rubber.

Abstract: This silicone adhesive sheet, which has ultraviolet ray shielding properties and is for sealing a solar cell, and which forms a silicone adhesive layer contacting a back surface panel in a solar cell module provided with a light-receiving surface panel, a back surface panel, a silicone adhesive layer contacting both surface panels, and a plurality of solar cells that are sealed by being interposed between both adhesive layers, is characterized by imparting a light transmission rate of no greater than 30% when measuring the light transmission rate at a wavelength of 380 nm to a cured product having a thickness of 2 mm. The silicone adhesive sheet is of a millable type able to capable of extrusion molding, calendering molding, and the like, and modularization using a vacuum laminator is possible of a laminate of a light-receiving surface panel, a silicone adhesive sheet, a solar cell, the silicone adhesive sheet of the present invention, and a back surface panel (back sheet).

Abstract: A method of manufacturing a solar cell module comprising adhering a first silicone gel sheet to one surface of a transparent light receiving panel to be a sunlight incidence surface; adhering a second silicone gel sheet to one surface of a light non-receiving panel or back sheet on the side opposite to the sunlight incidence surface; disposing a solar cell string on the first silicone gel sheet of the light receiving panel, and disposing butyl rubber in a picture frame-like shape along an outer peripheral region of a panel where either of the silicone gel sheets are not formed; and laying the light receiving panel and the light non-receiving panel or back sheet over each other with the silicone gel sheets on the inside, and pressing them at 100 to 150° C. in vacuum to encapsulate the solar cell string with the silicone gel sheets and press bond the light receiving panel and the light non-receiving panel or back sheet to each other through the butyl rubber.

Abstract: A solar cell module is manufactured by encapsulating a solar cell matrix comprising a plurality of electrically connected solar cell components between a transparent panel and a backsheet with a resin. The method involves (i) embossing opposite surfaces of a green silicone rubber sheet, (ii) arranging a transparent panel (13a), silicone rubber sheet (11), solar cell matrix (14), silicone rubber sheet (11), and backsheet (13b) to form a multilayer assembly, and (iii) heating and compressing the assembly for vacuum lamination for establishing a seal around the solar cell matrix.

Abstract: A solar cell module is constructed from light-receiving surface and back surface panels, a solar cell matrix comprising a plurality of solar cells sandwiched between the panels, and a silicone encapsulant layer for encapsulating the solar cell matrix. A silicone encapsulant composition is to form the silicone encapsulant layer that has a storage elastic modulus of 1-300 MPa in a temperature range of ?40° C. to 85° C.

Abstract: A solar cell module is manufactured by encapsulating a solar cell matrix comprising a plurality of electrically connected solar cell components between a transparent panel and a backsheet with a resin. The method involves (i) embossing opposite surfaces of a green silicone rubber sheet, (ii) arranging a transparent panel (13a), silicone rubber sheet (11), solar cell matrix (14), silicone rubber sheet (11), and backsheet (13b) to form a multilayer assembly, and (iii) heating and compressing the assembly for vacuum lamination for establishing a seal around the solar cell matrix.

Abstract: A pellicle for lithography, in which an agglutinant layer is so controlled that the deformation of the pellicle frame is prevented from transferring to an exposure original plate to which the pellicle is attached so that pattern transferred scarcely undergoes deformation; in particular the agglutinant layer has a Young's modulus of 0.02 to 0.08 MPa and a tensile bond strength of 0.04 to 0.08 N/mm2.

Abstract: A method of manufacturing a solar cell module includes adhering a first silicone gel sheet to one surface of a transparent light receiving panel to be a sunlight incidence surface; adhering a second silicone gel sheet to one surface of a light non-receiving panel on the side opposite to the sunlight incidence surface; disposing a solar cell string on the first silicone gel sheet of the light receiving panel, and disposing butyl rubber in a picture frame-like shape along an outer peripheral portion of the first silicone gel sheet; and laying the light receiving panel and the non-receiving panel over each other with the silicone gel sheets on the inside, and pressing them at 100 to 150° C. in vacuum to encapsulate the solar cell string with the silicone gel sheets and press bond the light receiving panel and the non-receiving panel to each other through the butyl rubber.