Patents by Inventor Jun-ichi Yasuda

Jun-ichi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5409754
    Abstract: An in-mold label with a coupon composed of a base layer having formed on the back side thereof an adhesive layer, in which said base layer comprises a biaxially stretched resin film, a part of the adhesive layer has a formation density of 50% or less to form a less adhesive zone, with at least one end of the less adhesive zone remaining non-adhesive to provide a stripping starting part having a width of from 5 to 10 mm measured from the end of the less adhesive zone to the direction of stripping and an area ratio of not more than 30% based on the total area of the less adhesive zone, the surface of the base layer corresponding to the less adhesive zone has printed thereon a coupon, and the periphery of the printed coupon is perforated. The in-mold label, after integrally molded with a resin container, suffers from no blister, and the coupon can easily be stripped off the container with fingers.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: April 25, 1995
    Assignee: Oji Yuka Goseishi Co., Ltd.
    Inventors: Jun-ichi Yasuda, Masaaki Yamanaka