Abstract: A packaged electronic device includes a molded substrate with a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side; an inner lead having an inner lead outward side and an inner lead inward side; and a substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure. An upper portion of the edge lead outward side is exposed from one side of the body encapsulant. A conductive cover is over a top side and sides of the body encapsulant and outer sides of the substrate encapsulant. The conductive cover contacts the upper portion of the edge lead outward side.

Abstract: In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side and an inner lead inward side opposite to the inner lead outward side. The molded substrate includes a substrate encapsulant covering a lower portion of the edge lead inward side, a lower portion of the inner lead inward side, and a lower portion of the inner lead outward side. An upper portion of the edge lead outward side and an upper portion of the inner lead outward side are exposed from the substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure.

Abstract: In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side and an inner lead inward side opposite to the inner lead outward side. The molded substrate includes a substrate encapsulant covering a lower portion of the edge lead inward side, a lower portion of the inner lead inward side, and a lower portion of the inner lead outward side. An upper portion of the edge lead outward side and an upper portion of the inner lead outward side are exposed from the substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure.

Abstract: This method for inhibiting the occurrence of a pyrolysis deposit in a pyrolysis gasification system includes: gasifying biomass (S2) through pyrolysis in a pyrolysis gasification furnace (5); separating, in a solid-gas separation unit (7), a pyrolysis gas (G1) and a carbide (C) continuously formed through pyrolysis of the biomass (S2); feeding an oxygen-containing gas (G3) to the separated pyrolysis gas (G1); and introducing the pyrolysis gas (G1) together with the oxygen-containing gas (G3) to a combustion furnace (6) through a pipe (9) which constitutes a pyrolysis gas line (8).

Abstract: This method for inhibiting the occurrence of a pyrolysis deposit in a pyrolysis gasification system includes: gasifying biomass (S2) through pyrolysis in a pyrolysis gasification furnace (5); separating, in a solid-gas separation unit (7), a pyrolysis gas (G1) and a carbide (C) continuously formed through pyrolysis of the biomass (S2); feeding an oxygen-containing gas (G3) to the separated pyrolysis gas (G1); and introducing the pyrolysis gas (G1) together with the oxygen-containing gas (G3) to a combustion furnace (6) through a pipe (9) which constitutes a pyrolysis gas line (8).

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: Provided are an anchor fixing agent which can fill up fine concave and convex portions present on the inner surface of a hole formed in a base material and can maintain great strength, in particular, even after the lapse of a long period of time; an anchor fixing agent ampule; and a method for fixing an anchor. An anchor fixing agent which comprises an alumina cement, a lime and/or a portland cement, and water. Preferably, it further comprises an agent for the retardation of setting and light magnesia. The anchor fixing agent ampule holds a solid component and a liquid component in the anchor fixing agent in the state wherein the components are separated from each other.

Abstract: Provided are an anchor fixing agent which can fill up fine concave and convex portions present on the inner surface of a hole formed in a base material and can maintain great strength, in particular, even after the lapse of a long period of time; an anchor fixing agent ampule; and a method for fixing an anchor. An anchor fixing agent which comprises an alumina cement, a lime and/or a portland cement, and water. Preferably, it further comprises an agent for the retardation of setting and light magnesia. The anchor fixing agent ampule holds a solid component and a liquid component in the anchor fixing agent in the state wherein the components are separated from each other.

Abstract: A feeding method and apparatus for breeding natural enemy insects necessary for establishing a farming system that uses less or no pesticides and a rearing method for breeding natural enemy insects are provided. A feeding apparatus including a food supplying section, a feeding section, and a food introducing section via which the food supplying section and the feeding section are in communication with each other, and an attracting section made of a material having a specific color tone is designed, and is used to breed natural enemy insects.