Abstract: Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1). [In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.

Abstract: The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in the range of 50 to 500 nm, and silver particles B with an average particle diameter in the range of 0.5 to 5.5 ?m, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A.

Abstract: The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exothermic peak due to binding of the silver nanoparticles in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less.

Abstract: Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticles which include a protective layer comprising one or more amines and have an average particle diameter of 30-300 nm, the amines comprising a C5-7 monoalkylamine and/or an alkoxyamine represented by the following general formula (1). NH2—R2—O—R1 (1) In the protective layer, the ratio of the C5-7 monoalkylamine and/or alkoxyamine represented by the general formula (1) to one or more amines different therefrom is in the range of 100:0 to 10:90. [In formula (1), R1 represents a C1-4 alkyl group and R2 represents a C1-4 alkylene group.