Abstract: To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space. An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.

Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.

Abstract: To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space. An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.

Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.

Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.

Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.

Abstract: A copper electroplating apparatus is disclosed. The copper electroplating apparatus includes: a plating bath configured to hold a plating solution therein; a soluble anode of phosphorus-containing copper; a substrate holder configured to hold a substrate; an anode bag that surrounds the anode, the anode bag being formed of mesh; a regulation plate configured to regulate an electric field, the regulation plate having an opening and being disposed between the anode and the substrate held by the substrate holder; and a diaphragm disposed so as to dose the opening of the regulation plate, the diaphragm being configured to allow permeation of metal ions therethrough and not allow permeation of additives contained in the plating solution.

Abstract: An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.

Abstract: An electroless plating apparatus can suppress a change in quality of a plating solution and form a plated film without loss of its properties and reliability. The electroless plating apparatus includes a plating solution circulation system having a plating solution supply pipe for supplying a plating solution in a plating solution reservoir tank to a plating tank and a plating solution recovery pipe for returning the plating solution in the plating tank to the plating solution reservoir tank, and a heat retention section for preventing lowering of the temperature of the plating solution in the entire plating solution circulation system.

Abstract: An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.