Abstract: A heat sinking rapid assembly semiconductor package comprising an electrically segmented conductive assembly post. The post is fabricated comprising at least two independent electrically conductive segments separated by an electrically isolating element. An electrical component, such as a semiconductor device, is assembled to an upper portion of the conductive post, wherein each contact of the component is in electrical communication with a respective conductive segment. The post can be mechanically pressed, threaded, or mechanically coupled using any other reasonable mechanical interface into a segmented via or plated-through hole of a printed circuit board (PCB). The electrical segments would be in electrical communication with conductive portions of the segmented via to form a complete electrical circuit between the PCB and the electrical component.