Patents by Inventor Junitsu Yamakawa

Junitsu Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate plating apparatus and method
    Patent number: 6793794
    Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: September 21, 2004
    Assignee: Ebara Corporation
    Inventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima
  • Method of measuring the concentration of a leveler in a plating liquid, and method of and apparatus for managing a plating liquid
    Publication number: 20040016644
    Abstract: The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
    Type: Application
    Filed: July 28, 2003
    Publication date: January 29, 2004
    Inventors: Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Akihisa Hongo, Ryoichi Kimizuka, Megumi Maruyama
  • Method of measuring the concentration of a leveler in a plating liquid
    Patent number: 6627066
    Abstract: The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: September 30, 2003
    Assignee: Ebara Corporation
    Inventors: Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Akihisa Hongo, Ryoichi Kimizuka, Megumi Maruyama
  • Substrate plating apparatus
    Publication number: 20020139683
    Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.
    Type: Application
    Filed: March 18, 2002
    Publication date: October 3, 2002
    Inventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima
  • Plating apparatus
    Patent number: 6379520
    Abstract: The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: April 30, 2002
    Assignee: Ebara Corporation
    Inventors: Fumio Kuriyama, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki, Atsushi Chono
  • Substrate plating device
    Patent number: 6365017
    Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: April 2, 2002
    Assignee: Ebara Corporation
    Inventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima