Abstract: Phenolic resin compositions comprising a polymeric substance having a phenolic OH group such as phenol resins, and a rubber having an epoxy group and an epoxy equivalent of 500 to 30,000 such as butadiene copolymers, acrylic copolymers, chloroprene copolymers and urethane copolymers are provided. These resin compositions exhibit improved properties having overcome the drawback of brittle properties intrinsic of conventional phenolic resins, and also exhibit cold resistance; hence they are used as molding materials, laminating materials, casting materials, binders, etc. Further, molding resin compositions having improved solvent-resistance and metal insert properties are provided.

Abstract: Phenolic resin compositions comprising a polymeric substance having a phenolic OH group such as phenol resins, and a rubber having an epoxy group and an epoxy equivalent of 500 to 30,000 such as butadiene copolymers, acrylic copolymers, chloroprene copolymers and urethane copolymers are provided. These resin compositions exhibit improved properties having overcome the drawback of brittle properties intrinsic of conventional phenolic resins, and also exhibit cold resistance; hence they are used as molding materials, laminating materials, casting materials, binders, etc. Further, molding resin compositions having improved solvent-resistance and metal insert properties are provided.

Abstract: Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.

Abstract: A process for preparing vinyl aromatic resin-, e.g. styrene-,based resinous materials to render them brittle and disintegratable upon prolonged exposure to ultraviolet light while retaining, in the absence of ultraviolet light, substantially the same appearance, processability and mechanical properties of conventional vinyl aromatic resin-based materials, comprising copolymerizing said vinyl aromatic monomer with from 0.5 to 6.0% of a conjugated diene monomer, e.g. isoprene, based on the total weight of the two monomers, initially copolymerizing said vinyl aromatic monomer with only a portion of the total amount of conjugated diene monomer and then completing the copolymerization with the remainder thereof, and the polymeric resin obtained by said process.

Abstract: A process for the production of glass-fiber reinforced plastics by partially copolymerizing a mixture of (A) 35-95% by weight methyl methacrylate, (B) 65-5% by weight of a vinyl aromatic hydrocarbon, and 0.2-5.0% by weight, based on the sum of (A) and (B) of a polymerizable compound containing two or more ethylenically unsaturated groups, discontinuing the partial copolymerization before gelation of said mixture has occurred, impregnating glass fibers with the resultant partially polymerized mixture and then curing the impregnated mixture.